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公开(公告)号：US11883845B2
公开(公告)日：2024-01-30
申请号：US18093701
申请日：2023-01-05
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0127 , B81B2203/0315 , B81B2203/0392 , B81C2201/0109 , B81C2201/0125 , B81C2201/0176
Abstract: A method of forming an ultrasonic transducer device involves depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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公开(公告)号：US11857368B2
公开(公告)日：2024-01-02
申请号：US18104063
申请日：2023-01-31
Applicant: BFLY OPERATIONS, INC.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
CPC classification number: A61B8/4477 , A61B8/0883 , A61B8/0891 , A61B8/12 , A61B8/4236 , A61B8/4427 , A61B8/4444 , A61B8/4472 , A61B8/4494 , A61B8/465 , A61B8/467 , A61B8/483 , A61B8/485 , A61B8/488 , A61B8/5207 , A61B8/54 , A61B8/56 , B06B1/0292 , B06B1/0622
Abstract: A processing device is coupled to a single ultrasound device having a single array of capacitive micromachined ultrasound transducers (CMUTs). The processing device generates a graphical user interface (GUI) having user selectable GUI menu options corresponding to respective ultrasound operating modes for the single ultrasound device having the single ultrasound transducer array. The user-selectable GUI menu options include GUI menu options labeled as representing an ultrasound operating mode for musculoskeletal imaging, breast imaging, carotid imaging, vascular imaging, and abdominal imaging, respectively. The processing device further receives, via the GUI, user input indicating selection of one of the ultrasound operating modes, and in response to receiving the user input, provides an indication to the single ultrasound device having the single array of CMUTs to operate in the selected ultrasound operating mode.
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公开(公告)号：US11833542B2
公开(公告)日：2023-12-05
申请号：US16562821
申请日：2019-09-06
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: B06B1/02 , B06B1/0292 , B81B3/0021 , B81B7/0077 , B81C1/00158 , G10K9/12 , G10K11/18 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81C2201/013 , B81C2203/0118 , B81C2203/0735 , B81C2203/0771
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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公开(公告)号：US11672179B2
公开(公告)日：2023-06-06
申请号：US16666238
申请日：2019-10-28
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Jaime Scott Zahorian , Paul Francis Cristman , Keith G. Fife
CPC classification number: H01L41/27 , B06B1/0292 , B06B1/06 , H01L41/047 , H05K3/361 , H05K2201/10977 , H05K2203/0726
Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
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公开(公告)号：US20230089630A1
公开(公告)日：2023-03-23
申请号：US17891027
申请日：2022-08-18
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
Abstract: A universal ultrasound device having an ultrasound probe includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.
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Patent Agency Ranking
公开(公告)号：US20220354459A1
公开(公告)日：2022-11-10
申请号：US17874180
申请日：2022-07-26
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , James Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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公开(公告)号：US11311274B2
公开(公告)日：2022-04-26
申请号：US15631819
申请日：2017-06-23
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife , David Elgena
Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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公开(公告)号：US11275161B2
公开(公告)日：2022-03-15
申请号：US16178871
申请日：2018-11-02
Applicant: BFLY Operations, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).
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公开(公告)号：US12178648B2
公开(公告)日：2024-12-31
申请号：US17853835
申请日：2022-06-29
Applicant: BFLY Operations, Inc.
Inventor： Keith G. Fife , Jianwei Liu , Andrew Betts
Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.
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公开(公告)号：US12070773B2
公开(公告)日：2024-08-27
申请号：US18099456
申请日：2023-01-20
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Jianwei Liu , Keith G. Fife
CPC classification number: B06B1/0292 , B81B3/0021 , B81C1/00158 , B81B2201/0271 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C2201/0125 , B81C2201/013 , B81C2201/0176 , B81C2203/03
Abstract: An ultrasonic transducer device includes a patterned film stack disposed on first regions of a substrate, the patterned film stack including a metal electrode layer and a bottom cavity layer formed on the metal electrode layer. The ultrasonic transducer device further includes a planarized insulation layer disposed on second regions of the substrate layer, a cavity formed in a membrane support layer and a CMP stop layer, the CMP stop layer including a top layer of the patterned film stack and the membrane support layer formed over the patterned film stack and the planarized insulation layer. The ultrasonic transducer device also includes a membrane bonded to the membrane support layer. The CMP stop layer underlies portions of the membrane support layer but not the cavity.
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