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公开(公告)号：US11276674B2
公开(公告)日：2022-03-15
申请号：US16862934
申请日：2020-04-30
发明人： Ke Meng , Chao Liu , Qiangwei Cui , Chuhang Wang , Lili Wang , Linhui Gong , Yutian Chu , Fan Yang
IPC分类号： H01L27/118 , H01L25/075 , H01L27/12 , H01L33/62
摘要： A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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公开(公告)号：US20220068972A1
公开(公告)日：2022-03-03
申请号：US17201198
申请日：2021-03-15
发明人： Linhui Gong , Chao Liu , Haiwei Sun
摘要： A display panel, a preparation method thereof, and a display device are disclosed. The display panel includes: a plurality of pixel units arranged in an array; a plurality of first signal lines extending in a first direction and arranged in a second direction; and a plurality of first connecting electrodes arranged in the second direction; where the first direction intersects with the second direction. The plurality of pixel units form m pixel rows arranged in sequence along the first direction and each extending along the second direction, where m is an integer greater than 1; and a projection of at least one pixel unit in an m-th pixel row on a plane perpendicular to the second direction and projections of the first connecting electrodes on the plane perpendicular to the second direction have an overlapped area.
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公开(公告)号：US11239198B2
公开(公告)日：2022-02-01
申请号：US16830834
申请日：2020-03-26
发明人： Lili Wang , Haiwei Sun , Zhenxing Tang , Feng Qu , Jing Liu , Chao Liu , Chuhang Wang , Qiangwei Cui , Ke Meng , Linhui Gong
摘要： A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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公开(公告)号：US09666609B2
公开(公告)日：2017-05-30
申请号：US14469554
申请日：2014-08-26
发明人： Chao Liu , Yujun Zhang , Zengsheng He , Lei Chen
IPC分类号： H01L27/12
CPC分类号： H01L27/124 , H01L27/1259
摘要： This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch.
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公开(公告)号：US20230229196A1
公开(公告)日：2023-07-20
申请号：US17924526
申请日：2021-05-12
发明人： Ming Li , Lin Xiong , Yuliang Wang , Jun Wang , Xu Zhao , Shenghua Bai , Jie Li , Xing Zou , Fanyou Li , Mu Zeng , Chao Liu , Miao Wang , Jie Tu , Zhoujun Chen , Guifang He , Chunrong Lai
IPC分类号： G06F1/16
CPC分类号： G06F1/1656 , G06F1/1616
摘要： The display module (100) includes: a supporting member (2) and a display panel (2), supporting member (1) includes an interlayer part (11) and a supporting part (12), the surface of the side of the supporting part (12) that is away from the interlayer part (11) is a supporting curved face (121), the supporting curved face (121) protrudes in the direction away from the interlayer part (11), the display panel (2) includes a non-bending part (21), a bending part (22) and a connecting part (23), the non-bending part (21) and the connecting part (23) are located on the two sides of the interlayer part (11) in the thickness direction of the interlayer part (11), the bending part (22) supports the side of the supporting part (12) that is away from the interlayer part (11), and the inner surface of the bending part (22) adheres to the supporting curved face (121).
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公开(公告)号：US20220314598A1
公开(公告)日：2022-10-06
申请号：US17310292
申请日：2021-01-12
发明人： Linhui Gong , Chao Liu , Qiangwei Cui , Ke Meng , Haiwei Sun
IPC分类号： B41F16/00
摘要： Disclosed are a pattern transfer apparatus and a pattern transfer method. The pattern transfer method includes: transferring a pattern to a flexible printing substrate; and transferring the pattern on the printing substrate to a bending surface of a rigid carrier through an elastic rubber head.
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公开(公告)号：US20210398955A1
公开(公告)日：2021-12-23
申请号：US17281872
申请日：2020-02-21
发明人： Chao Liu , Zhongbao Wu , Gongtao Zhang , Haiwei Sun , Xue Dong
IPC分类号： H01L25/075 , H01L33/60 , H01L33/62
摘要： An array substrate is provided. In the array substrate, an organic material layer includes a first planar portion, a bending portion and a second planar portion which are connected in sequence. The first planar portion and the second planar portion are disposed on both sides of a base substrate. A lead structure includes a first lead portion, a bent lead portion and a second lead portion which are connected in sequence, wherein the first lead portion is disposed outside the first plane portion, the bent lead portion is disposed outside the bending portion, and the second lead portion is disposed outside the second plane portion. An LED layer and a control circuit are respectively disposed on the both sides of the base substrates.
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公开(公告)号：US20210088828A1
公开(公告)日：2021-03-25
申请号：US16893472
申请日：2020-06-05
发明人： Qiangwei Cui , Lili Wang , Ke Meng , Chao Liu , Chuhang Wang , Linhui Gong , Zhaohui Li , Donghui Wang
IPC分类号： G02F1/1333 , H01L23/00 , H01L51/00 , H01L27/32 , G02F1/1335 , G02F1/1362
摘要： The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.
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29.发明申请公开(公告)号：US20170122992A1
公开(公告)日：2017-05-04
申请号：US15105594
申请日：2015-09-18
发明人： Yujun Zhang , Chao Liu
IPC分类号： G01R27/26
CPC分类号： G01R27/2617 , G01D5/24 , G01D5/2405 , G01R27/2605 , G02F1/1309
摘要： A film structure includes a first metal layer, a second metal layer, and an insulation layer located between the first metal layer and the second metal layer. In at least a portion of an edge region of the film structure, the first metal layer extends outwards relative to an edge of the insulation layer by a first predetermined length, and the insulation layer extends outwards relative to an edge of the second metal layer by a second predetermined length. In this way, when the film structure is measured, a fall value between the surface, adjacent to the second metal layer, of the insulation layer and the surface, adjacent to the insulation layer, of the first metal layer is measured by means of a motion trajectory of the measuring probe at the time of ascending or descending, thereby obtaining a more accurate thickness value of the insulation layer.
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30.发明授权公开(公告)号：US09256105B2
公开(公告)日：2016-02-09
申请号：US13877504
申请日：2012-10-29
发明人： Dejiang Zhao , Yujun Zhang , Chao Liu , Zhongyuan Sun
IPC分类号： G02F1/1333 , G02F1/1339 , G02F1/1341 , B23B27/00 , B32B17/06 , H01J9/24 , H01J9/26 , H01J9/32
CPC分类号： G02F1/1339 , B23B27/00 , B32B17/06 , B32B27/00 , G02F1/133305 , G02F1/1341
摘要： Embodiments of the present invention disclose a bended liquid crystal display and a manufacturing method and apparatus therefore. The method comprises: preparing an array substrate and a color filter substrate with flat glass sheets having different thermal expansion coefficients; applying adhesive sealant at edges of surfaces of the array substrate and/or the color filter substrate; heating the array substrate and the color filter substrate, and binding the expanded array substrate and color filter substrate together, to form an assembled substrate; and cooling the assembled substrate and forming a bended assembled substrate having a degree of curvature. The bended liquid crystal display has a better stability, and has no variation in its degree of curvature over service time.
摘要翻译： 本发明的实施例公开了一种弯曲液晶显示器及其制造方法和装置。 该方法包括：准备具有不同热膨胀系数的平板玻璃板的阵列基板和滤色器基板; 在阵列基板和/或滤色器基板的表面的边缘处施加粘合剂密封剂; 加热阵列基板和滤色器基板，并将扩展的阵列基板和滤色器基板结合在一起，以形成组装的基板; 并冷却组装的基板并形成具有曲率程度的弯曲组装的基板。 弯曲的液晶显示器具有更好的稳定性，并且在使用时间上的曲率程度没有变化。
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