Sacrificial Cover Layers for Laser Drilling Substrates and Methods Thereof
    21.
    发明申请
    Sacrificial Cover Layers for Laser Drilling Substrates and Methods Thereof 有权
    激光钻孔基板牺牲盖层及其方法

    公开(公告)号:US20140147623A1

    公开(公告)日:2014-05-29

    申请号:US14092536

    申请日:2013-11-27

    Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

    Abstract translation: 一种用于通过钻孔在基板中形成多个精密孔的方法,包括将牺牲覆盖层固定到基板的表面,将激光束相对于基板定位在预定位置,并且对应于 多个精密孔,通过在预定位置重复地激励激光束在牺牲覆盖层中形成通孔,并将激光束脉冲到形成在牺牲覆盖层中的通孔中。 一种具有精密孔的工件,包括其中形成有精密孔的基板,其中每个精密孔的纵轴在基板的厚度方向上延伸,并且牺牲盖层可拆卸地固定到基板的表面,使得 牺牲覆盖层减少精密孔的不规则性。

    EXTRUSION DIES AND METHODS AND APPARATUSES FOR FORMING THE SAME

    公开(公告)号:US20190047174A1

    公开(公告)日:2019-02-14

    申请号:US15555780

    申请日:2016-03-04

    Abstract: A honeycomb extrusion die (100), a method of making the same, and an apparatus for forming the same. The die (100) includes: a feed hole plate (202) comprising an input surface (202A), an opposing output surface (202B), and feed holes (108) configured to guide a batch material from the input surface (202A) to the output surface (202B); and a pin assembly (204) comprising pins (300) disposed on the feed hole plate (202). At least one of the pins includes: a tail (304); a head (302) connected to the tail (304) and comprising alignment surfaces (314) configured to align the pins (300), flow surfaces (316) disposed between the alignment surfaces (314), and a tapered portion (310) comprising a contact surface (308) adhered to the output surface (202B) of the feed hole plate (202); and a first groove (306) disposed between the head (302) and the tail (304). In the pin assembly (204), the alignment surfaces (314) contact adjacent pins (300) to align the pins (300), such that discharge slots are at least partially defined by the tails (304) of the pins (300).

    METHODS AND APPARATUS FOR HEAT TRANSFER BY CONDUCTION MORE THAN CONVECTION

    公开(公告)号:US20190039938A1

    公开(公告)日:2019-02-07

    申请号:US16073888

    申请日:2017-01-27

    Abstract: Method and apparatus are provided for the controlled transport of glass sheets (13) or glass ribbons (15) undergoing heating and/or cooling (e.g., thermal tempering) by conduction more than convection. The controlled transport is achieved by applying a gas-based force (17,19,21) to the glass sheet (13) or glass ribbon (15). The gas-based force (17,19,21) can move the glass sheet (13) or glass ribbon (15) in a desired direction and/or cause it to acquire a desired orientation. The gas-based force (17,19,21) can also cause the glass sheet (13) or glass ribbon (15) to retain a desired position and/or a desired orientation. The gas-based force (17,19,21) can be applied to the glass sheet (13) or glass ribbon (15) continuously or intermittently. Systems for transitioning a glass sheet (13) or a glass ribbon (15) between a heating zone (27) and a quench zone (31) are also discussed.

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