Abstract:
Managing pressure within a thickness-control-zone (muffle door) housing relative to pressures in a glass-making machine enclosure and an upper chamber that is disposed outside the enclosure so as to minimize or control undesired airflows that would adversely affect thickness of glass ribbon. According to one pressure management technique, the pressure at a location in the housing is managed so as to be less than the pressure at a location that is within the enclosure as well as both outside and adjacent to the housing. In the event of a leak, as by a crack or unintended opening in the housing, for example, this pressure difference reduces or prevents airflow toward the ribbon and, thereby, undesired thickness variation in the ribbon. According to a second pressure-management technique, the pressure at the location is managed so as to be greater than the pressure in the upper chamber.
Abstract:
Managing pressure within a thickness-control-zone (muffle door) housing (20) relative to pressures in a glass-making machine enclosure (60) and an upper chamber (40)—that is disposed outside the enclosure—so as to minimize or control undesired airflows that would adversely affect thickness (9) of glass ribbon (8). According to one pressure-management technique, the pressure at a location (25) in the housing (20) is managed so as to be less than the pressure at a location (65) that is within the enclosure (60) as well as both outside and adjacent to the housing. In the event of a leak, as by a crack or unintended opening in the housing, for example, this pressure difference reduces or prevents airflow toward the ribbon and, thereby, undesired thickness variation in the ribbon. According to a second pressure-management technique, the pressure at location (25) is managed so as to be greater than the pressure in the upper chamber.
Abstract:
A glass article including any one or several of SiO2, Al2O3, B2O3, Li2O, SnO2 and a fusion line. The glass article can also include a liquidus viscosity less than or equal to 100 kP. In some embodiments, the glass article includes, on an oxide basis, from 60 mol % to 74 mol % SiO2, from 7 mol % to 18 mol % Al2O3, from 3 mol % to 16 mol % B2O3, from 0 mol % to 6 mol % Na2O, from 0 mol % to 5 mol % P2O5, from 5 mol % to 11 mol % Li2O, less than or equal to 0.2 mol % SnO2.
Abstract:
A method and apparatus for manufacturing a glass article includes flowing a glass ribbon through a transition region, heating the glass ribbon with a heating mechanism housed in the transition region, cooling the glass ribbon with a cooling mechanism housed in the transition region, wherein the cooling mechanism extends between the heating mechanism and the glass ribbon, and shielding the glass ribbon with a shielding mechanism that extends between the cooling mechanism and at least one of first and second bead regions of the glass ribbon.
Abstract:
A glass article including any one or several of SiO2, Al2O3, B2O3, Li2O, SnO2 and a fusion line. The glass article can also include a liquidus viscosity less than or equal to 100 kP. In some embodiments, the glass article includes, on an oxide basis, from 60 mol % to 74 mol % SiO2, from 7 mol % to 18 mol % Al2O3, from 3 mol % to 16 mol % B2O3, from 0 mol % to 6 mol % Na2O, from 0 mol % to 5 mol % P2O5, from 5 mol % to 11 mol % Li2O, less than or equal to 0.2 mol % SnO2.
Abstract:
The disclosure relates to apparatuses for producing a glass ribbon, the apparatuses comprising a forming body (100) comprising an upper trough-shaped portion comprising two trough walls and a trough bottom; a lower wedge-shaped portion; a delivery end configured to receive molten glass; and a compression end (237) comprising a curb (243); and an end cap (205) coupled to the compression end (237) and extending over a top surface of the curb (243), wherein a height of the curb (243) is greater than a height of the two trough walls at a point proximate the compression end (237). Also disclosed herein are methods for producing a glass ribbon using such apparatuses. This minimizes glass flow into the end cap and over the compression end of the forming body and minimizes formations of gobs.
Abstract:
The disclosure relates to apparatuses for producing a glass ribbon, the apparatuses comprising a forming body (100) comprising an upper trough-shaped portion comprising two trough walls and a trough bottom; a lower wedge-shaped portion; a delivery end configured to receive molten glass; and a compression end (237) comprising a curb (243); and an end cap (205) coupled to the compression end (237) and extending over a top surface of the curb (243), wherein a height of the curb (243) is greater than a height of the two trough walls at a point proximate the compression end (237). Also disclosed herein are methods for producing a glass ribbon using such apparatuses. This minizes glass flow into the end cap and over the compression end of the forming body and minimizes formations of gobs.
Abstract:
A system and method are described herein for controlling an environment around an inlet tube in the glass manufacturing system. More specifically, the system and method control a level of hydrogen within a humid gas mixture that flows over an exterior of the inlet tube to effectively suppress the formation of undesirable gaseous inclusions in molten glass that flows through the inlet tube.
Abstract:
Disclosed herein are methods for making a thin film device and/or for reducing warp in a thin film device, the methods comprising applying at least one metal film to a convex surface of a glass substrate, wherein the glass substrate is substantially dome-shaped. Other methods disclosed include methods of determining the concavity of a glass sheet. The method includes determining the orientation of the concavity and measuring a magnitude of the edge lift of the sheet when the sheet is supported by a flat surface and acted upon by gravity. Thin film devices made according to these methods and display devices comprising such thin film devices are also disclosed herein.
Abstract:
A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.