Abstract:
There is provided a portable substrate carrier enclosure. The carrier enclosure has a carrier support; a displaceable cover; spacers between the support and cover; a gas inlet; and a removable lid. There is also provided an assembly and a process for depositing an air-sensitive material onto a substrate using the portable substrate carrier enclosure.
Abstract:
There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.
Abstract:
An apparatus and method for vapor phase deposition of a reactive surface area (RSA) material onto a substrate of an electronic device. The vapor phase deposition is conducted at ambient pressures in air, and provides capture of residual vapor to minimize environmental release of RSA and other constituents used in the processing.
Abstract:
A multilayer, photosensitive element comprising a coversheet, a photohardenable layer, a contiguous layer, an isolation layer, an adhesive layer, and a support, is described. The element is used for image reproduction.