公开(公告)号：US20100055847A1

公开(公告)日：2010-03-04

申请号：US12614960

申请日：2009-11-09

申请人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

发明人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

IPC分类号： H01L21/56

CPC分类号： G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

公开(公告)号：US08482139B2

公开(公告)日：2013-07-09

申请号：US12614945

申请日：2009-11-09

申请人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

发明人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

IPC分类号： H01L23/29

CPC分类号： G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

公开(公告)号：US08232145B2

公开(公告)日：2012-07-31

申请号：US12614960

申请日：2009-11-09

申请人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

发明人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

IPC分类号： H01L21/00

CPC分类号： G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

摘要翻译： 公开了一种闪存卡及其制造方法。 卡包括制造成接收单面或双面盖的半导体封装。 半导体封装的表面可以形成有孔，沟槽和/或戳记。 在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。 在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。 因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

公开(公告)号：US20110084377A1

公开(公告)日：2011-04-14

申请号：US12709952

申请日：2010-02-22

申请人： Jack Chang Chien ,  KH Ong ,  Weili Wang ,  Li Wang ,  XingZhi Liang ,  Shicai Ma

发明人： Jack Chang Chien ,  KH Ong ,  Weili Wang ,  Li Wang ,  XingZhi Liang ,  Shicai Ma

IPC分类号： H01L23/498 ,  H01L21/50 ,  B32B38/10

CPC分类号： H01L21/67132 ,  H01L23/3107 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983 ,  H01L2924/00014

摘要： A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

摘要翻译： 公开了一种系统，用于在晶片切割过程期间从模具固定到的带上弹出半导体管芯。 在实施例中，系统包括具有支撑台，顶针和拾取臂的顶出器工具。 支撑台连接到真空源，用于在带和支撑台之间的界面处产生负压。 支撑台还包括具有一个或多个倒角侧壁的孔。 真空源连接到孔口，使得当带子以孔为中心的模具放置在支撑台上时，真空源将半导体管芯的边缘周围的一部分带离开模具并且进入 由倒角边缘产生的空间。

公开(公告)号：US20120145332A1

公开(公告)日：2012-06-14

申请号：US13398647

申请日：2012-02-16

申请人： Jack Chang Chien ,  KH Ong ,  Weili Wang ,  Li Wang ,  XingZhi Liang ,  Shicai Ma

发明人： Jack Chang Chien ,  KH Ong ,  Weili Wang ,  Li Wang ,  XingZhi Liang ,  Shicai Ma

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L23/3107 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983 ,  H01L2924/00014

摘要： A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

摘要翻译： 公开了一种系统，用于在晶片切割过程期间从模具固定到的带上弹出半导体管芯。 在实施例中，系统包括具有支撑台，顶针和拾取臂的顶出器工具。 支撑台连接到真空源，用于在带和支撑台之间的界面处产生负压。 支撑台还包括具有一个或多个倒角侧壁的孔。 真空源连接到孔口，使得当带子以孔为中心的模具放置在支撑台上时，真空源将半导体管芯的边缘周围的一部分带离开模具并且进入 由倒角边缘产生的空间。

公开(公告)号：US08499813B2

公开(公告)日：2013-08-06

申请号：US13398647

申请日：2012-02-16

申请人： Jack Chang Chien ,  King Hoo Ong ,  Weili Wang ,  Li Wang ,  XingZhi Liang ,  Shicai Ma

发明人： Jack Chang Chien ,  King Hoo Ong ,  Weili Wang ,  Li Wang ,  XingZhi Liang ,  Shicai Ma

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L23/3107 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983 ,  H01L2924/00014

摘要： A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

摘要翻译： 公开了一种系统，用于在晶片切割过程期间从模具固定到的带上弹出半导体管芯。 在实施例中，系统包括具有支撑台，顶针和拾取臂的顶出器工具。 支撑台连接到真空源，用于在带和支撑台之间的界面处产生负压。 支撑台还包括具有一个或多个倒角侧壁的孔。 真空源连接到孔口，使得当将带子放置在支撑台上，其中模具以孔为中心时，真空源将半导体管芯的边缘周围的一部分带离模具并且进入 由倒角边缘产生的空间。