公开(公告)号：US20180190589A1

公开(公告)日：2018-07-05

申请号：US15394388

申请日：2016-12-29

申请人： Bernd Waidhas ,  Stephan Stoeckl ,  Andreas Wolter ,  Reinhard Mahnkopf ,  Georg Seidemann ,  Thomas Wagner ,  Laurent Millou

发明人： Bernd Waidhas ,  Stephan Stoeckl ,  Andreas Wolter ,  Reinhard Mahnkopf ,  Georg Seidemann ,  Thomas Wagner ,  Laurent Millou

IPC分类号： H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L23/053

CPC分类号： H01L23/5386 ,  H01L21/4846 ,  H01L23/053 ,  H01L23/5387 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/13099

摘要： A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.

公开(公告)号：US09252077B2

公开(公告)日：2016-02-02

申请号：US14037213

申请日：2013-09-25

申请人： Wolfgang Molzer ,  Edmund Goetz ,  Reinhard Mahnkopf ,  Bernd Memmler

发明人： Wolfgang Molzer ,  Edmund Goetz ,  Reinhard Mahnkopf ,  Bernd Memmler

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/73259 ,  H01L2924/15311 ,  H01L2924/3025

摘要： Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.

摘要翻译： 描述了与封装有关的射频天线连接的通路。 在一个示例中，封装具有封装衬底，附接到封装衬底的管芯，以及从封装衬底到封装的外表面的导电通孔，以在天线和封装衬底之间形成射频连接。