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1.
公开(公告)号:US20150001713A1
公开(公告)日:2015-01-01
申请号:US13931899
申请日:2013-06-29
IPC分类号: H01L23/00 , H01L25/065 , H01L23/498
CPC分类号: H01L23/5389 , H01L21/568 , H01L24/19 , H01L24/96 , H01L25/0655 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/15311 , H01L2924/181 , H01L2924/00
摘要: A package with multiple chips and a shared redistribution layer is described. In one example, a first and a second die are formed where the first and the second die each have a different height. The dies are placed on a substrate. The first, the second, or both dies are ground so that the first and the second die are about the same height. Layers, such as redistribution layers are formed over both the first and the second die at the same time using a single process, and the first and the second die and the formed layers are packaged.
摘要翻译: 描述了具有多个芯片和共享再分配层的封装。 在一个示例中,形成第一和第二管芯,其中第一和第二管芯各自具有不同的高度。 将模具放置在基板上。 第一,第二或两个模具被磨削,使得第一和第二模具大约相同的高度。 使用单个工艺同时在第一和第二管芯上形成诸如再分布层的层,并且封装第一和第二管芯和形成的层。
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公开(公告)号:US09252077B2
公开(公告)日:2016-02-02
申请号:US14037213
申请日:2013-09-25
IPC分类号: H01L23/48
CPC分类号: H01L23/481 , H01L23/66 , H01L2223/6616 , H01L2223/6677 , H01L2224/13025 , H01L2224/16225 , H01L2224/73259 , H01L2924/15311 , H01L2924/3025
摘要: Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
摘要翻译: 描述了与封装有关的射频天线连接的通路。 在一个示例中,封装具有封装衬底,附接到封装衬底的管芯,以及从封装衬底到封装的外表面的导电通孔,以在天线和封装衬底之间形成射频连接。
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公开(公告)号:US20150084194A1
公开(公告)日:2015-03-26
申请号:US14037213
申请日:2013-09-25
IPC分类号: H01L23/48
CPC分类号: H01L23/481 , H01L23/66 , H01L2223/6616 , H01L2223/6677 , H01L2224/13025 , H01L2224/16225 , H01L2224/73259 , H01L2924/15311 , H01L2924/3025
摘要: Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
摘要翻译: 描述了与封装有关的射频天线连接的通路。 在一个示例中,封装具有封装衬底,附接到封装衬底的管芯,以及从封装衬底到封装的外表面的导电通孔,以在天线和封装衬底之间形成射频连接。
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4.
公开(公告)号:US20150084165A1
公开(公告)日:2015-03-26
申请号:US14034854
申请日:2013-09-24
申请人: Reinhard Mahnkopf , Wolfgang Molzer , Bernd Memmler , Edmund Goetz , Hans-Joachim Barth , Sven Albers , Thorsten Meyer
发明人: Reinhard Mahnkopf , Wolfgang Molzer , Bernd Memmler , Edmund Goetz , Hans-Joachim Barth , Sven Albers , Thorsten Meyer
IPC分类号: H01L23/538 , H01L21/768 , H01L23/00 , H01L25/00 , H01L21/56 , H01L23/522 , H01L25/07
CPC分类号: H01L23/5389 , H01L21/56 , H01L21/563 , H01L21/76898 , H01L23/3121 , H01L23/5226 , H01L23/5384 , H01L23/562 , H01L24/03 , H01L24/81 , H01L25/0657 , H01L25/074 , H01L25/50 , H01L2224/08146 , H01L2224/16148 , H01L2224/73204 , H01L2225/06513 , H01L2225/06541 , H01L2225/06544 , H01L2225/06548 , H01L2225/06568 , H01L2924/181 , H01L2924/00012
摘要: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.
摘要翻译: 本说明书的实施例包括嵌入在微电子衬底中的堆叠微电子骰子及其制造方法。 在一个实施例中,至少一个第一微电子管芯连接到第二微电子管芯,其中在第二微电子管芯和至少一个第一微电子管芯之间提供底部填充材料。 然后通过将第一微电子管芯和第二微电子管芯层压在衬底材料中来形成微电子衬底。
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公开(公告)号:US09171726B2
公开(公告)日:2015-10-27
申请号:US12614362
申请日:2009-11-06
申请人: Giovanni Calabrese , Domagoj Siprak , Wolfgang Molzer , Uwe Hodel
发明人: Giovanni Calabrese , Domagoj Siprak , Wolfgang Molzer , Uwe Hodel
IPC分类号: H01L21/76 , H01L21/265 , H01L29/06 , H01L29/08 , H01L29/66 , H01L29/78 , H01L21/223
CPC分类号: H01L29/66681 , H01L21/02057 , H01L21/2236 , H01L21/26506 , H01L21/26513 , H01L21/26586 , H01L21/30604 , H01L21/324 , H01L21/76237 , H01L29/0619 , H01L29/0653 , H01L29/0847 , H01L29/66659 , H01L29/7835
摘要: Semiconductor devices may be configured to reduce noise in the devices. For example, a semiconductor device may be configured or made with a first doped region within a semiconductor substrate to operate as an extended drain region, a trench isolation region, a second doped region between the first doped region and the trench isolation region, wherein the trench isolation region and the second doped region may be at least partially formed within the first doped region. Additionally, or alternatively, the second doped region may be within the first doped region and at least partially surround the trench isolation region, the first and second doped regions may have the same conductivity type, and the second doped region may have a higher conductivity than the first doped region.
摘要翻译: 半导体器件可以被配置为降低器件中的噪声。 例如,半导体器件可以配置或制成半导体衬底内的第一掺杂区域,以在第一掺杂区域和沟槽隔离区域之间作为延伸漏极区域,沟槽隔离区域,第二掺杂区域工作,其中, 沟槽隔离区域和第二掺杂区域可以至少部分地形成在第一掺杂区域内。 另外或替代地,第二掺杂区域可以在第一掺杂区域内并且至少部分地围绕沟槽隔离区域,第一和第二掺杂区域可以具有相同的导电类型,并且第二掺杂区域可以具有比 第一掺杂区域。
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6.
公开(公告)号:US06750483B2
公开(公告)日:2004-06-15
申请号:US10200541
申请日:2002-07-22
申请人: Wolfgang Klein , Rudolf Lachner , Wolfgang Molzer
发明人: Wolfgang Klein , Rudolf Lachner , Wolfgang Molzer
IPC分类号: H01L29737
CPC分类号: H01L29/165 , H01L29/7378
摘要: A silicon-germanium bipolar transistor includes a silicon substrate in which a first n-doped emitter region, a second p-doped base region adjoining the latter and a third n-doped collector region adjoining the latter, are formed. A first space charge zone is formed between the emitter region and the base region and a second space charge zone is formed between the base region and the collector region. The base region and an edge zone of the adjoining emitter region are alloyed with germanium. The germanium concentration in the emitter region rises toward the base region. The germanium concentration in a junction region containing the first space charge zone rises less sharply than in the emitter region or decreases and, in the base region, it initially again rises more sharply than in the junction region.
摘要翻译: 硅 - 锗双极晶体管包括硅衬底,其中形成有第一n掺杂发射极区域,与之相邻的第二p掺杂基极区域和与之相邻的第三n掺杂集电极区域。 在发射极区域和基极区域之间形成第一空间电荷区域,并且在基极区域和集电极区域之间形成第二空间电荷区域。 邻接发射极区域的基极区域和边缘区域与锗合金化。 发射极区域中的锗浓度朝向基极区域上升。 包含第一空间电荷区的结区中的锗浓度比发射极区域急剧上升或降低,并且在基极区域中其初始地再次比在结区域中急剧上升。
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公开(公告)号:US20110108916A1
公开(公告)日:2011-05-12
申请号:US12614362
申请日:2009-11-06
申请人: Giovanni Calabrese , Domagoj Siprak , Wolfgang Molzer , Uwe Hodel
发明人: Giovanni Calabrese , Domagoj Siprak , Wolfgang Molzer , Uwe Hodel
IPC分类号: H01L29/78 , H01L29/06 , H01L21/762
CPC分类号: H01L29/66681 , H01L21/02057 , H01L21/2236 , H01L21/26506 , H01L21/26513 , H01L21/26586 , H01L21/30604 , H01L21/324 , H01L21/76237 , H01L29/0619 , H01L29/0653 , H01L29/0847 , H01L29/66659 , H01L29/7835
摘要: Disclosed herein are Lateral Diffused Metal Oxide Semiconductor (LDMOS) device and trench isolation related devices, methods, and techniques.
摘要翻译: 本文公开了横向扩散金属氧化物半导体(LDMOS)器件和沟槽隔离相关器件,方法和技术。
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公开(公告)号:US20150084202A1
公开(公告)日:2015-03-26
申请号:US14038248
申请日:2013-09-26
申请人: Georg Seidemann , Sven Albers , Teodora Ossiander , Michael Skinner , Hans-Joachim Barth , Harald Gossner , Reinhard Mahnkoph , Christian Mueller , Wolfgang Molzer
发明人: Georg Seidemann , Sven Albers , Teodora Ossiander , Michael Skinner , Hans-Joachim Barth , Harald Gossner , Reinhard Mahnkoph , Christian Mueller , Wolfgang Molzer
IPC分类号: H01L23/00 , H01L25/00 , H01L25/065
CPC分类号: H01L24/09 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/80 , H01L24/81 , H01L25/0655 , H01L25/50 , H01L2224/03444 , H01L2224/0346 , H01L2224/03602 , H01L2224/0401 , H01L2224/04042 , H01L2224/05009 , H01L2224/05013 , H01L2224/05014 , H01L2224/05015 , H01L2224/05016 , H01L2224/05553 , H01L2224/05556 , H01L2224/05571 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/06135 , H01L2224/06155 , H01L2224/06183 , H01L2224/08054 , H01L2224/08056 , H01L2224/08057 , H01L2224/08121 , H01L2224/08137 , H01L2224/08225 , H01L2224/09135 , H01L2224/09183 , H01L2224/1134 , H01L2224/131 , H01L2224/16137 , H01L2224/48137 , H01L2224/80201 , H01L2224/80895 , H01L2224/81203 , H01L2224/94 , H01L2924/00014 , H01L2924/1434 , H01L2224/03 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.
摘要翻译: 一种装置包括第一集成电路(IC)芯片,其包括顶层,底表面,从顶层的顶表面延伸到底表面的侧壁表面,以及至少一个多表面接触垫,第二 IC芯片包括顶层,底面,从顶层的顶表面延伸到底表面的侧壁表面,以及至少一个多表面接触焊盘,其中第二IC管芯被布置为与第一IC 并且包括与第一IC管芯的多表面接触焊盘的顶表面或侧表面中的至少一个与第二IC管芯的多表面接触焊盘的顶表面接触的导电接合 。
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