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40 条记录 (耗时 0.021 秒)

    Integration manufacturing process for MEMS device
    21.
    发明授权
    Integration manufacturing process for MEMS device 有权
    MEMS器件集成制造工艺

    公开(公告)号：US08030111B2

    公开(公告)日：2011-10-04

    申请号：US12326355

    申请日：2008-12-02

    申请人： Mingching Wu ,  Hsueh-An Yang ,  Hung-Yi Lin ,  Weileun Fang

    发明人： Mingching Wu ,  Hsueh-An Yang ,  Hung-Yi Lin ,  Weileun Fang

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00301 ,  B81B2201/042 ,  B81B2207/097

    摘要： A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.

    摘要翻译： 提供了一种用于制造MEMS器件的方法。 该方法包括以下步骤：a）提供具有位于其上的凹面的第一基底，b）提供具有分别位于其上的连接区域和致动区域的第二基底，c）在致动区域中形成多个微结构，d） 在所述连接区域和所述致动区域中的元件，e）在所述导电元件上形成绝缘层，以及f）将所述第一基板连接到所述连接区域以形成所述MEMS器件。 凹面包含多个微结构。

    METHOD OF MANUFACTURING OPTICAL COMPONENTS
    22.
    发明申请
    METHOD OF MANUFACTURING OPTICAL COMPONENTS 有权
    制造光学元件的方法

    公开(公告)号：US20090194892A1

    公开(公告)日：2009-08-06

    申请号：US12357039

    申请日：2009-01-21

    申请人： Chih-Chun Lee ,  Sheng-Yi Hsiao ,  Weileun Fang

    发明人： Chih-Chun Lee ,  Sheng-Yi Hsiao ,  Weileun Fang

    IPC分类号： B29D11/00

    CPC分类号： B29D11/00009 ,  B29C39/006 ,  B29C39/26 ,  B29C41/12 ,  B29L2011/00

    摘要： A method of manufacturing an optical component is provided. The method comprises steps of providing a first liquid; providing a fluid, disposed above the first liquid, wherein an interface exists between the first liquid and the fluid; providing a polymer precursor at the interface; and solidifying the polymer precursor so as to form the optical component made by a polymer.

    摘要翻译： 提供了一种制造光学部件的方法。 该方法包括提供第一液体的步骤; 提供设置在所述第一液体上方的流体，其中在所述第一液体和所述流体之间存在界面; 在界面处提供聚合物前体; 并固化聚合物前体以形成由聚合物制成的光学部件。

    Corner compensation method for fabricating MEMS and structure thereof
    23.
    发明授权
    Corner compensation method for fabricating MEMS and structure thereof 失效
    用于制造MEMS的角补偿方法及其结构

    公开(公告)号：US06949396B2

    公开(公告)日：2005-09-27

    申请号：US10187714

    申请日：2002-07-01

    申请人： Jerwei Hsieh ,  Weileun Fang

    发明人： Jerwei Hsieh ,  Weileun Fang

    IPC分类号： B81C1/00 ,  H01L21/00 ,  B82B1/00

    CPC分类号： B81C1/00571

    摘要： A corner-compensation method for fabricating MEMS (Micro-Electro-Mechanical System) is provided. The method includes steps of: (a) providing a substrate; (b) forming a conductive layer on the substrate; (c) sequentially forming a masking layer having structural openings and a photoresist layer on the conductive layer; (d) executing a photolithography for etching the photoresist layer and the masking layer to form at least one hole penetrating the photoresist layer and the masking layer; (e) etching the conductive layer and the substrate to extend the at least one hole to upper portions of the substrate; (f) removing the photoresist layer and etching the conductive layer and the substrate via the structural openings and the at least one hole respectively to form deep trench structures having different depths; (g) forming a peripheral compensation structure on a side-wall portion of the deep trench structure having the different depths; (h) removing portions of the peripheral compensation structure laterally and the substrate for exposing an uncompensated silicon structure; and (i) side etching the uncompensated silicon structure to be terminated by the peripheral compensation structure around the at least one hole.

    摘要翻译： 提供了一种用于制造MEMS（微机电系统）的角补偿方法。 该方法包括以下步骤：（a）提供衬底; （b）在所述基板上形成导电层; （c）在所述导电层上依次形成具有结构开口的掩模层和光致抗蚀剂层; （d）执行光刻用于蚀刻光致抗蚀剂层和掩模层以形成穿透光致抗蚀剂层和掩模层的至少一个孔; （e）蚀刻所述导电层和所述基底以将所述至少一个孔延伸到所述基底的上部; （f）去除光致抗蚀剂层并分别经由结构开口和至少一个孔蚀刻导电层和基板以形成具有不同深度的深沟槽结构; （g）在具有不同深度的深沟槽结构的侧壁部分上形成外围补偿结构; （h）横向去除外围补偿结构的部分和用于暴露未补偿的硅结构的衬底; 和（i）侧面蚀刻由所述至少一个孔周围的外围补偿结构终止的未补偿硅结构。

    Actuating mechanism for rotating micro-mirror
    25.
    发明授权
    Actuating mechanism for rotating micro-mirror 有权
    旋转微镜的启动机构

    公开(公告)号：US06359718B1

    公开(公告)日：2002-03-19

    申请号：US09838061

    申请日：2001-04-18

    申请人： Hung-Yi Lin ,  Weileun Fang

    发明人： Hung-Yi Lin ,  Weileun Fang

    IPC分类号： G02B2608

    CPC分类号： G02B26/0841

    摘要： An actuating mechanism for rotating a micro-mirror is disclosed. The actuating mechanism includes a first linking rod consisting of a first and a second portions, a second linking rod consisting of a third and a fourth portions, a first fulcrum positioned between the first and second portions, and a second fulcrum positioned at one side of the fourth portion opposite to the third portion. The first and third portions are flexibly connected to a shaft that the micro-mirror rotates with, and the second and fourth portions are coupled to respective actuators. When actuating forces are applied to move the second and fourth portions, the first and third portions are levered to rotate the shaft and thus the micro-mirror due to the effect of the fulcrums.

    摘要翻译： 公开了一种用于旋转微反射镜的致动机构。 致动机构包括由第一和第二部分组成的第一连接杆，由第三和第四部分组成的第二连杆，位于第一和第二部分之间的第一支点和位于第一和第二部分之间的第二支点 第四部分与第三部分相对。 第一和第三部分柔性地连接到微反射镜旋转的轴上，第二和第四部分联接到相应的致动器。 当施加致动力以移动第二和第四部分时，由于支点的作用，使第一和第三部分被转动以使轴转动，从而使微反射镜旋转。

    3-Axis Accelerometer With Gap-Closing Capacitive Electrodes
    27.
    发明申请
    3-Axis Accelerometer With Gap-Closing Capacitive Electrodes 有权
    具有间隙闭合电容电极的3轴加速度计

    公开(公告)号：US20100212425A1

    公开(公告)日：2010-08-26

    申请号：US12556433

    申请日：2009-09-09

    申请人： Chia-Pao Hsu ,  Weileun Fang ,  Ming-Ching Wu

    发明人： Chia-Pao Hsu ,  Weileun Fang ,  Ming-Ching Wu

    IPC分类号： G01P15/125

    CPC分类号： G01P15/18 ,  G01P15/0802 ,  G01P15/125

    摘要： Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits. (1) The sensitivity of the accelerometer is improved since the proof-mass is increased by containing both device and handling silicon layers; (2) The sensitivity is also improved by the gap-closing differential capacitive sensing electrodes design; (3) The parasitic capacitance at bond pad is reduced by the existing of metal-vias between the device Si layer and handling Si layer; (4) The sensing gap thickness is precisely defined by the buried oxide of SOI wafer; (5) The stationary sensing electrodes anchored to the substrate also act as the limit stops to protect the accelerometer.

    摘要翻译： 公开了一种在SOI晶片上实现的新型三轴电容式加速度计。 加速度计包括四个弹簧，一个检测质量块，四对间隙闭合感测电极（每对间隙闭合感测电极，包含一个可移动电极和一个固定电极）和几个金属通孔作为电互连。 可移动电极位于检测质量上，而固定电极固定在基板上。 三轴加速度计有五个优点。 （1）加速度传感器的灵敏度提高，因为通过容纳硅层和处理硅层来提高质量; （2）间隙闭合差分电容式感应电极的设计灵敏度也得到提高; （3）通过在器件Si层和处理Si层之间存在金属通孔来减小接合焊盘处的寄生电容; （4）传感间隙厚度由SOI晶片的埋入氧化物精确定义; （5）固定在基板上的固定感应电极也作为限位装置来保护加速度计。

    Micro scanner and manufacturing process, driving structure and driving method therefor
    29.
    发明申请
    Micro scanner and manufacturing process, driving structure and driving method therefor 审中-公开
    微型扫描仪和制造工艺，驱动结构及其驱动方法

    公开(公告)号：US20080001690A1

    公开(公告)日：2008-01-03

    申请号：US11650402

    申请日：2007-01-05

    申请人： Huseh-An Yang ,  Weileun Fang ,  Tsung-Lin Tang

    发明人： Huseh-An Yang ,  Weileun Fang ,  Tsung-Lin Tang

    IPC分类号： H01H1/00

    CPC分类号： G02B26/085

    摘要： A method for manufacturing a magnetic-induction element is provided. The method includes steps of: a) providing a substrate, b) forming an adhesive layer on the substrate, c) forming a seed layer on the adhesive layer, d) removing a part of the seed layer to reveal a part of the adhesive layer, e) partially forming a resistance on the seed layer and the revealed part of the adhesive layer, f) forming a magnetic-induction layer on the seed layer and the revealed part of the adhesive layer, g) removing the resistance, and h) removing a part of the substrate and the revealed part of the adhesive layer.

    摘要翻译： 提供一种制造磁感应元件的方法。 该方法包括以下步骤：a）提供衬底，b）在衬底上形成粘合剂层，c）在粘合剂层上形成种子层，d）去除种子层的一部分以露出粘合剂层的一部分 e）部分地在种子层和粘合剂层的显露部分形成电阻，f）在种子层和粘合剂层的显露部分上形成磁感应层，g）去除电阻，以及h） 去除衬底的一部分和粘合剂层的露出部分。

    Optical microelectromechanical component and fabrication method thereof
    30.
    发明申请
    Optical microelectromechanical component and fabrication method thereof 审中-公开
    光学微机电元件及其制造方法

    公开(公告)号：US20050205514A1

    公开(公告)日：2005-09-22

    申请号：US10933630

    申请日：2004-09-03

    申请人： Mingching Wu ,  Hung-Yi Lin ,  Weileun Fang

    发明人： Mingching Wu ,  Hung-Yi Lin ,  Weileun Fang

    IPC分类号： B44C1/22 ,  C23F1/00 ,  G02B26/08

    CPC分类号： G02B26/0841

    摘要： The optical microelectromechanical components and the fabrication method thereof are provided. The method for fabricating an optical microelectromechanical component includes steps of (a) providing a substrate; (b) depositing an oxide layer on the substrate as a first mask; (c) performing a plurality of first etchings on the substrate to form a plurality of trenches with a plurality of depths; (d) depositing a first polysilicon layer on the trenches to form refilled trenches.

    摘要翻译： 提供了光学微机电部件及其制造方法。 制造光学微机电元件的方法包括以下步骤：（a）提供衬底; （b）在衬底上沉积氧化物层作为第一掩模; （c）在所述衬底上执行多个第一蚀刻以形成具有多个深度的多个沟槽; （d）在沟槽上沉积第一多晶硅层以形成再填充的沟槽。