公开(公告)号：US20210143088A1

公开(公告)日：2021-05-13

申请号：US17155696

申请日：2021-01-22

Applicant: DENSO CORPORATION

Inventor： Kosuke KAMIYA ,  Ryota TANABE ,  Tomohisa SANO ,  Takuo NAGASE ,  Hiroshi ISHINO ,  Shoichiro OMAE

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18

Abstract: A semiconductor device configures one arm of an upper-lower arm circuit, and includes: a semiconductor element that includes a first main electrode and a second main electrode, wherein a main current between the first main electrode and the second main electrode; and multiple main terminals that include a first main terminal connected to the first main electrode and a second main terminal connected to the second main electrode. The first main terminal and the second main terminal are placed adjacent to each other; A lateral surface of the first main terminal and a lateral surface of the second main terminal face each other in one direction orthogonal to a thickness direction of the semiconductor element.

公开(公告)号：US20200262115A1

公开(公告)日：2020-08-20

申请号：US16866431

申请日：2020-05-04

Applicant: DENSO CORPORATION

Inventor： Akifumi KURITA ,  Yohei YOSHIMURA ,  Ryota TANABE ,  Tsuyoshi ARAI

IPC: B29C45/14

Abstract: Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.

公开(公告)号：US20190335629A1

公开(公告)日：2019-10-31

申请号：US16396814

申请日：2019-04-29

Applicant: DENSO CORPORATION

Inventor： Kazuya TAKEUCHI ,  Ryota TANABE

IPC: H05K7/20 ,  H01L23/473 ,  H01L25/11

Abstract: In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.

公开(公告)号：US20190036282A1

公开(公告)日：2019-01-31

申请号：US16039587

申请日：2018-07-19

Applicant: DENSO CORPORATION

Inventor： Ryota TANABE ,  Akihumi KURITA ,  Yohei YOSHIMURA

IPC: H01R25/16 ,  H02M7/00 ,  H01L23/50

Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element that constitutes a power converter circuit. The semiconductor module has a power terminal extending therefrom, and the power terminal has opposing first and second terminal surfaces. The power converter includes a capacitor electrically connected to the semiconductor module. The power converter includes a busbar. The busbar includes a capacitor-connection terminal connected to the capacitor, and at least first and second semiconductor-connection terminals that are at least partly joined to the respective first and second terminal surfaces of the power terminal.

公开(公告)号：US20180332732A1

公开(公告)日：2018-11-15

申请号：US15978507

申请日：2018-05-14

Applicant: DENSO CORPORATION

Inventor： Naoki HIRASAWA ,  Ryota TANABE ,  Taijiro MOMOSE ,  Hiromi ICHIJO

IPC: H05K7/20 ,  H05K5/02 ,  H05K7/14 ,  H02M7/00

CPC classification number: H05K7/2089 ,  H02M7/003 ,  H05K5/0217 ,  H05K7/1401 ,  H05K7/20927

Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.

公开(公告)号：US20170317605A1

公开(公告)日：2017-11-02

申请号：US15655027

申请日：2017-07-20

Applicant: DENSO CORPORATION

Inventor： Kazuya TAKEUCHI ,  Tetsuya MATSUOKA ,  Ryota TANABE

IPC: H02M7/00 ,  H05K7/20

CPC classification number: H02M7/003 ,  H05K7/20263 ,  H05K7/20927

Abstract: A power conversion apparatus includes a capacitor and a heat dissipation member for cooling the capacitor. The capacitor and the heat dissipation member are pressed in an arranging direction in which the capacitor and the heat dissipation member are arranged. The capacitor includes a capacitor element which includes a dielectric body and a metal layer formed on a surface of the dielectric body, an electrode part connected to the metal layer and a bus bar connected to the electrode part. Part of the bus bar is interposed in the arranging direction between the heat dissipation member and the capacitor element.

公开(公告)号：US20160241155A1

公开(公告)日：2016-08-18

申请号：US15013503

申请日：2016-02-02

Applicant: DENSO CORPORATION

Inventor： Kazuya TAKEUCHI ,  Tetsuya MATSUOKA ,  Ryota TANABE

IPC: H02M7/00 ,  H05K5/06 ,  H02M7/44 ,  H05K7/20

CPC classification number: H02M7/003 ,  H05K7/20263 ,  H05K7/20927

Abstract: A power conversion apparatus includes a capacitor and a heat dissipation member for cooling the capacitor. The capacitor and the heat dissipation member are pressed in an arranging direction in which the capacitor and the heat dissipation member are arranged. The capacitor includes a capacitor element which includes a dielectric body and a metal layer formed on a surface of the dielectric body, an electrode part connected to the metal layer and a bus bar connected to the electrode part. Part of the bus bar is interposed in the arranging direction between the heat dissipation member and the capacitor element.

Abstract translation: 电力转换装置包括用于冷却电容器的电容器和散热构件。 在布置电容器和散热构件的布置方向上按压电容器和散热构件。 电容器包括电容器元件，其包括电介质体和形成在电介质体的表面上的金属层，连接到金属层的电极部分和连接到电极部分的汇流条。 汇流条的一部分插入在散热构件和电容器元件之间的布置方向上。