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公开(公告)号：US10522502B2
公开(公告)日：2019-12-31
申请号：US15030509
申请日：2014-11-18
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro Shinohara
Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35° . These anisotropic conductive films have stable connection reliability in COG connection.
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Patent Agency Ranking
公开(公告)号：US10513635B2
公开(公告)日：2019-12-24
申请号：US15515309
申请日：2015-10-26
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro Shinohara
Abstract: An anisotropic conductive film with a structure wherein an electrically insulating adhesive base layer and cover layer are stacked, and electrically conductive particles are disposed at lattice points with a planar lattice pattern in the vicinity of the interface of the layers. In the anisotropic conductive film, a proportion of lattice points at which no electrically conductive particles are disposed with respect to all lattice points with the planar lattice pattern assumed in any reference region is 25% or less, and some of the electrically conductive particles disposed at lattice points with planar lattice pattern are disposed to be shifted in longitudinal direction of anisotropic conductive film with respect to corresponding lattice points, and a shift amount defined as a distance between a plane projection center of the electrically conductive particles disposed to be shifted and the corresponding lattice point is less than 50% the electrically conductive particles' average diameter.
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公开(公告)号：US10446517B2
公开(公告)日：2019-10-15
申请号：US15030509
申请日：2014-11-18
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro Shinohara
Abstract: Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35° . These anisotropic conductive films have stable connection reliability in COG connection.
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公开(公告)号：US10424538B2
公开(公告)日：2019-09-24
申请号：US15027607
申请日：2014-09-18
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro Shinohara
IPC: B32B27/08 , H01L23/498 , C09J9/02 , H01L23/00 , H05K3/32
Abstract: An anisotropic conductive film that is capable of suppressing the occurrence of short circuit during anisotropic conductive connection of electrical components having decreased pitch, and suppressing a decrease in conduction reliability during storage under a high temperature and high humidity environment has a structure in which a conductive particle-containing layer containing conductive particles that are arranged in a single layer in a layered binder resin composition is layered on at least a first insulating resin composition layer. The lowest melt viscosity of the binder resin composition is equal to or higher than that of a first insulating resin composition. A second insulating resin composition layer is further layered on a surface of the conductive particle-containing layer on a side opposite to the first insulating resin composition layer. The lowest melt viscosity of the binder resin composition is higher than those of the first and second insulating resin compositions.
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公开(公告)号：US10272598B2
公开(公告)日：2019-04-30
申请号：US14422470
申请日：2013-08-23
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro Shinohara , Yasushi Akutsu
IPC: B29D7/01 , C09J5/06 , C09J7/10 , C09J9/02 , H01R4/04 , H05K3/32 , B29C35/08 , B29C43/00 , B29C43/20 , B29K63/00 , H01L23/00 , B29K505/00 , H01L21/00 , H01L21/82
Abstract: Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.
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公开(公告)号：US09816012B2
公开(公告)日：2017-11-14
申请号：US14904456
申请日：2014-07-28
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro Shinohara
IPC: B32B3/00 , C09J9/02 , C09J7/00 , C09J11/04 , H01R4/04 , H01R43/00 , H05K3/32 , H05K3/30 , C08K3/04 , C08K3/08 , H01R12/62
CPC classification number: C09J9/02 , C08K3/04 , C08K3/08 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J11/04 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01R4/04 , H01R12/62 , H01R43/007 , H05K3/303 , H05K3/323 , H05K2201/0224 , H05K2203/0139 , H05K2203/0278
Abstract: A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.
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