公开(公告)号：US20120074810A1

公开(公告)日：2012-03-29

申请号：US13313511

申请日：2011-12-07

申请人： David M. Chen ,  Jan H. Kuypers ,  Alexei Gaidarzhy ,  Guiti Zolfagharkhani

发明人： David M. Chen ,  Jan H. Kuypers ,  Alexei Gaidarzhy ,  Guiti Zolfagharkhani

IPC分类号： H01L41/04

CPC分类号： H03H9/02834 ,  H03H9/02102 ,  H03H9/02228 ,  H03H9/02448 ,  H03H9/02574

摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.

公开(公告)号：US20100182102A1

公开(公告)日：2010-07-22

申请号：US12639161

申请日：2009-12-16

申请人： Jan H. Kuypers ,  David M. Chen ,  Alexei Gaidarzhy ,  Guiti Zolfagharkhani

发明人： Jan H. Kuypers ,  David M. Chen ,  Alexei Gaidarzhy ,  Guiti Zolfagharkhani

IPC分类号： H03H9/17

CPC分类号： H03H9/02834 ,  H03H9/02102 ,  H03H9/02228 ,  H03H9/02448 ,  H03H9/02574

摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.

摘要翻译： 描述了机械谐振结构，以及相关的装置和方法。 机械谐振结构可以具有用于补偿温度变化的补偿结构。

公开(公告)号：US08698376B2

公开(公告)日：2014-04-15

申请号：US13681904

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/04

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。

公开(公告)号：US08587183B2

公开(公告)日：2013-11-19

申请号：US13681873

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H03H9/25 ,  H01L41/053

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

公开(公告)号：US20130140944A1

公开(公告)日：2013-06-06

申请号：US13681904

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H02N1/00

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

公开(公告)号：US20130140958A1

公开(公告)日：2013-06-06

申请号：US13681873

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/053

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。

公开(公告)号：US20130140651A1

公开(公告)日：2013-06-06

申请号：US13681893

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： B81B3/00

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

公开(公告)号：US20120280594A1

公开(公告)日：2012-11-08

申请号：US13466767

申请日：2012-05-08

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/053

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。

公开(公告)号：US08044736B2

公开(公告)日：2011-10-25

申请号：US12111535

申请日：2008-04-29

申请人： Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Alexei Gaidarzhy ,  Guiti Zolfagharkhani ,  David M. Chen ,  Matthew J. Crowley

发明人： Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Alexei Gaidarzhy ,  Guiti Zolfagharkhani ,  David M. Chen ,  Matthew J. Crowley

IPC分类号： H03B5/30

CPC分类号： H03L1/00 ,  H03B5/30 ,  H03L1/04 ,  H03L7/16

摘要： Timing oscillators as well as related methods and devices are described. A timing oscillator may include a mechanical resonating structure with major elements and minor elements coupled to the major element. The timing oscillator can generate stable signals with low phase noise at very high frequencies which allows a timing oscillator to be used effectively in a number of devices including computers and mobile phones for time and data synchronization purposes. The signal generated by the timing oscillator can be tuned using a driver circuit and a compensation circuit.

摘要翻译： 描述了定时振荡器以及相关方法和设备。 定时振荡器可以包括具有耦合到主要元件的主要元件和次要元件的机械谐振结构。 定时振荡器可以以非常高的频率产生具有低相位噪声的稳定信号，这允许定时振荡器在包括计算机和移动电话在内的多个设备中被有效地用于时间和数据同步目的。 由定时振荡器产生的信号可以使用驱动电路和补偿电路进行调谐。

公开(公告)号：US09030080B2

公开(公告)日：2015-05-12

申请号：US13681893

申请日：2012-11-20

申请人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

发明人： David M. Chen ,  Jan H. Kuypers ,  Pritiraj Mohanty ,  Klaus Juergen Schoepf ,  Guiti Zolfagharkhani ,  Jason Goodelle ,  Reimund Rebel

IPC分类号： H01L41/053 ,  H03H3/007 ,  H03H9/02 ,  B81B3/00 ,  H02N1/00 ,  H03H9/24

CPC分类号： H01L41/053 ,  B81B3/0018 ,  H01L2224/11 ,  H01L2224/48091 ,  H02N1/006 ,  H03H3/007 ,  H03H9/02007 ,  H03H9/02244 ,  H03H9/02535 ,  H03H2009/241

摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。