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21.发明授权Electrical power connection with two power connectors on a module in an electronic system 有权与电子系统中模块上的两个电源连接器的电源连接公开(公告)号：US07782632B2
公开(公告)日：2010-08-24
申请号：US11641243
申请日：2006-12-19
IPC分类号： H02B1/20
CPC分类号： H05K7/1454 , H01R12/7088 , Y10T29/49117
摘要： When a module is inserted into a bay of an electronic system, an electrical signal connector on the electronic system engages a mating signal connector on the module and an electrical power connector on the electronic system engages one of two mating power connectors on the module. The electrical power connector on the electronic system is on either a first side or a second side of the electrical signal connector. The mating power connectors are on the first and second sides of the mating signal connector on the module.
摘要翻译： 当模块插入到电子系统的托架中时，电子系统上的电信号连接器与模块上的匹配信号连接器相接合，并且电子系统上的电源连接器接合模块上的两个匹配的电源连接器中的一个。 电子系统上的电力连接器位于电信号连接器的第一侧或第二侧上。 配对电源连接器位于模块上的配合信号连接器的第一和第二侧。
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公开(公告)号：US20080310107A1
公开(公告)日：2008-12-18
申请号：US12138625
申请日：2008-06-13
申请人： WADE D. VINSON , David W. Sherrod
发明人： WADE D. VINSON , David W. Sherrod
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
摘要翻译： 外壳在前部区域和后部区域中容纳电子模块。 气流可以通过前部区域中的电子模块传送到集气室。 外壳中的气流将气流从外壳的前部区域转移到容纳在外壳后部区域的电子模块。 气流通过后部区域中的电子模块传送到集气室。
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23.发明申请Electrical power connection with two power connnectors on a module in an electronic system 有权与电子系统中模块上的两个电源连接器的电源连接公开(公告)号：US20070279892A1
公开(公告)日：2007-12-06
申请号：US11641243
申请日：2006-12-19
IPC分类号： H02B1/20
CPC分类号： H05K7/1454 , H01R12/7088 , Y10T29/49117
摘要： When a module is inserted into a bay of an electronic system, an electrical signal connector on the electronic system engages a mating signal connector on the module and an electrical power connector on the electronic system engages one of two mating power connectors on the module. The electrical power connector on the electronic system is on either a first side or a second side of the electrical signal connector. The mating power connectors are on the first and second sides of the mating signal connector on the module.
摘要翻译： 当模块插入到电子系统的托架中时，电子系统上的电信号连接器与模块上的匹配信号连接器相接合，并且电子系统上的电源连接器接合模块上的两个匹配的电源连接器中的一个。 电子系统上的电力连接器位于电信号连接器的第一侧或第二侧上。 配对电源连接器位于模块上的配合信号连接器的第一和第二侧。
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24.发明申请CONNECTOR MODULES HAVING OPTICAL CONNECTORS MOVEABLE BETWEEN A RETRACTED POSITION AND AN EXTENDED POSITION 有权带有连接器的连接器模块在延迟位置与扩展位置之间移动公开(公告)号：US20140369654A1
公开(公告)日：2014-12-18
申请号：US14370165
申请日：2012-01-06
IPC分类号： G02B6/36
CPC分类号： G02B6/3897 , G02B6/3628 , G02B6/4261 , G02B6/4292 , G02B6/43 , G02B6/4452 , Y10T29/49826
摘要： A plurality of connector modules are mounted to a support frame. The connector modules have respective optical connectors to optically connect with respective electronic devices, where the optical connectors are moveable between a retracted position and an extended position. The optical connector of a first of the connector modules is retractable and extendable independently of a second of the connector modules.
摘要翻译： 多个连接器模块安装到支撑框架。 连接器模块具有相应的光学连接器以与相应的电子设备光学连接，其中光学连接器可在缩回位置和延伸位置之间移动。 连接器模块中的第一个的光学连接器可独立于第二个连接器模块缩回和伸展。
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公开(公告)号：US20080310123A1
公开(公告)日：2008-12-18
申请号：US12121350
申请日：2008-05-15
IPC分类号： H05K7/18
CPC分类号： H05K7/1488
摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.
摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。
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公开(公告)号：US08982565B2
公开(公告)日：2015-03-17
申请号：US12121350
申请日：2008-05-15
CPC分类号： H05K7/1488
摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.
摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。
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公开(公告)号：US07813120B2
公开(公告)日：2010-10-12
申请号：US12138625
申请日：2008-06-13
申请人： Wade D. Vinson , David W. Sherrod
发明人： Wade D. Vinson , David W. Sherrod
CPC分类号： H05K7/20736
摘要： An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
摘要翻译： 外壳在前部区域和后部区域中容纳电子模块。 气流可以通过前部区域中的电子模块传送到集气室。 外壳中的气流将气流从外壳的前部区域转移到容纳在外壳后部区域的电子模块。 气流通过后部区域中的电子模块传送到集气室。
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公开(公告)号：US07599761B2
公开(公告)日：2009-10-06
申请号：US11038723
申请日：2005-01-19
IPC分类号： G05D23/00
CPC分类号： G05D23/19 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
摘要翻译： 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵以及泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。
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公开(公告)号：US20090306833A1
公开(公告)日：2009-12-10
申请号：US12540479
申请日：2009-08-13
CPC分类号： G05D23/19 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
摘要翻译： 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵和泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。
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公开(公告)号：US20090016010A1
公开(公告)日：2009-01-15
申请号：US12138622
申请日：2008-06-13
CPC分类号： G11B33/142 , G11B33/124 , H05K7/1487
摘要： An electronic module includes an enclosure having front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
摘要翻译： 电子模块包括具有前表面和后表面的外壳。 电子电路板位于外壳中，处理器安装在电子电路板上。 数据存储设备位于外壳中，使得处理器位于数据存储设备和电子电路板之间。
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