METHOD, APPARATUS, AND SYSTEM FOR PROTECTING HEAD NODE OF POINT TO MULTIPOINT LABEL SWITCHED PATH
    22.
    发明申请
    METHOD, APPARATUS, AND SYSTEM FOR PROTECTING HEAD NODE OF POINT TO MULTIPOINT LABEL SWITCHED PATH 审中-公开
    用于保护点到多点标签开关路径的方法,装置和系统

    公开(公告)号:US20090219806A1

    公开(公告)日:2009-09-03

    申请号:US12437336

    申请日:2009-05-07

    申请人: Guoyi Chen Wei Cao

    发明人: Guoyi Chen Wei Cao

    IPC分类号: H04L12/26

    摘要: A method for protecting the head node of a Point to Multipoint Label Switched Path (P2MP LSP) includes: a Backup Head Node (BHN) establishes a backup LSP from the BHN to all Merge Points (MPs), where the backup LSP bypasses a Master Head Node (MHN); the MHN forwards data along an LSP already established between the MHN and the MPs; when a head node switchover condition is met, the BHN is switched to a master mode to forward data along the backup LSP established between the BHN and the MPs. A system and apparatus for protecting the head node are also provided. With the head node protection solution provided by the present disclosure, the head node is well protected and the protection mechanisms for the P2MP LSP are therefore more complete. This can further promote the scale deployment of P2MP systems.

    摘要翻译: 一种用于保护点到多点标签交换路径(P2MP LSP)的头节点的方法包括:备份头节点(BHN)建立从BHN到所有合并点(MP)的备份LSP,其中备用LSP绕过主节点 头节点(MHN); MHN沿着已经建立在MHN和MP之间的LSP转发数据; 当满足头节点切换条件时,BHN切换到主模式,沿着BHN和MP之间建立的备份LSP转发数据。 还提供了一种用于保护头部节点的系统和装置。 利用本公开提供的头节点保护解决方案,头节点受到良好保护,因此P2MP LSP的保护机制更加完整。 这可以进一步促进P2MP系统的规模部署。

    SEQUENTIAL DEPOSITION OF TANTALUM NITRIDE USING A TANTALUM-CONTAINING PRECURSOR AND A NITROGEN-CONTAINING PRECURSOR
    23.
    发明申请
    SEQUENTIAL DEPOSITION OF TANTALUM NITRIDE USING A TANTALUM-CONTAINING PRECURSOR AND A NITROGEN-CONTAINING PRECURSOR 有权
    使用含TANTALUM的前驱体和含氮的前驱体的氮化钛的顺序沉积

    公开(公告)号:US20090197406A1

    公开(公告)日:2009-08-06

    申请号:US12417439

    申请日:2009-04-02

    IPC分类号: H01L21/768 H01L21/3205

    摘要: Embodiments of the invention provide a method for forming tantalum nitride materials on a substrate by employing an atomic layer deposition (ALD) process. The method includes heating a tantalum precursor within an ampoule to a predetermined temperature to form a tantalum precursor gas and sequentially exposing a substrate to the tantalum precursor gas and a nitrogen precursor to form a tantalum nitride material. Thereafter, a nucleation layer and a bulk layer may be deposited on the substrate. In one example, a radical nitrogen compound may be formed from the nitrogen precursor during a plasma-enhanced ALD process. A nitrogen precursor may include nitrogen or ammonia. In another example, a metal-organic tantalum precursor may be used during the deposition process.

    摘要翻译: 本发明的实施例提供了一种通过采用原子层沉积(ALD)工艺在衬底上形成氮化钽材料的方法。 该方法包括将安瓿内的钽前体加热至预定温度以形成钽前体气体,并将基底依次暴露于钽前体气体和氮气前体以形成氮化钽材料。 此后,可以在基板上沉积成核层和体层。 在一个实例中,在等离子体增强的ALD工艺期间可以由氮前体形成自由基氮化合物。 氮前体可以包括氮或氨。 在另一个实例中,在沉积过程中可以使用金属 - 有机钽前体。

    Bottom conductor for integrated MRAM
    24.
    发明授权
    Bottom conductor for integrated MRAM 有权
    集成MRAM的底部导体

    公开(公告)号:US07358100B2

    公开(公告)日:2008-04-15

    申请号:US11891923

    申请日:2007-08-14

    IPC分类号: H01L21/00

    CPC分类号: H01L43/12 H01L27/228

    摘要: A method to fabricate an MTJ device and its connections to a CMOS integrated circuit is described. The device is built out of three layers. The bottom layer serves as a seed layer for the center layer, which is alpha tantalum, while the third, topmost, layer is selected for its smoothness, its compatibility with the inter-layer dielectric materials, and its ability to protect the underlying tantalum.

    摘要翻译: 描述了一种制造MTJ器件及其与CMOS集成电路的连接的方法。 该设备由三层构建。 底层用作中心层的种子层,其为α钽,而第三最顶层选择为其平滑度,其与层间电介质材料的相容性以及其保护下面的钽的能力。

    Magnetic tunnel junction patterning using Ta/TaN as hard mask
    26.
    发明申请
    Magnetic tunnel junction patterning using Ta/TaN as hard mask 有权
    磁隧道结图案使用Ta / TaN作为硬掩模

    公开(公告)号:US20070215911A1

    公开(公告)日:2007-09-20

    申请号:US11378555

    申请日:2006-03-17

    IPC分类号: H01L29/82 H01L21/00

    CPC分类号: H01L43/12 H01L43/08

    摘要: An MTJ MRAM cell is formed by using a reactive ion etch (RIE) to pattern an MTJ stack on which there has been formed a bilayer Ta/TaN hard mask. The hard mask is formed by patterning a masking layer that has been formed by depositing a layer of TaN over a layer of Ta on the MTJ stack. After the stack is patterned, the TaN layer serves at least two advantageous purposes: 1) it protects the Ta layer from oxidation during the etching of the stack and 2) it serves as a surface having excellent adhesion properties for a subsequently deposited dielectric layer.

    摘要翻译: 通过使用反应离子蚀刻(RIE)来形成已经形成双层Ta / TaN硬掩模的MTJ叠层来形成MTJ MRAM电池。 硬掩模通过图案化掩模层而形成,该掩模层通过在MTJ堆叠上的Ta层上沉积TaN层而形成。 在堆叠被图案化之后,TaN层起至少两个有利的作用:1)它在保护叠层的过程中保护Ta层免受氧化,2)它用作随后沉积的介电层具有优异粘合性能的表面。

    Tantalum barrier layer for copper metallization
    29.
    发明申请
    Tantalum barrier layer for copper metallization 有权
    用于铜金属化的钽阻挡层

    公开(公告)号:US20050074968A1

    公开(公告)日:2005-04-07

    申请号:US10693775

    申请日:2003-10-25

    摘要: A method of forming barrier layers in a via hole extending through an inter-level dielectric layer and including a preformed first barrier coated onto the bottom and sidewalls of the via holes. In a single plasma sputter reactor, a first step sputters the wafer rather than the target with high energy ions to remove the barrier layer from the bottom of the via but not from the sidewalls and a second step sputter deposits a second barrier layer, for example of Ta/TaN, onto the via bottom and sidewalls. The two steps may be differentiated by power applied to the target, by chamber pressure, or by wafer bias. The second step may include the simultaneous removal of the first barrier layer from the via bottom and sputter deposition of the second barrier layer onto the via sidewalls.

    摘要翻译: 在穿过层间电介质层的通孔中形成阻挡层的方法,包括涂覆在通孔的底部和侧壁上的预先形成的第一屏障。 在单个等离子体溅射反应器中,第一步骤以高能离子将晶片而不是目标物喷射,以从通孔的底部除去阻挡层,而不是从侧壁排出,第二步骤溅射沉积第二阻挡层,例如 的Ta / TaN,通过底部和侧壁。 这两个步骤可以通过施加到靶,通过室压力或通过晶片偏置的功率来区分。 第二步骤可以包括从通孔底部同时移除第一阻挡层并将第二阻挡层溅射到通孔侧壁上。

    SERUM-FREE FREEZING MEDIUM USED IN ADIPOSE-DERIVED STEM CELLS AND ESTABLISHMENT OF ADIPOSE-DERIVED STEM CELL LIBRARY
    30.
    发明申请
    SERUM-FREE FREEZING MEDIUM USED IN ADIPOSE-DERIVED STEM CELLS AND ESTABLISHMENT OF ADIPOSE-DERIVED STEM CELL LIBRARY 有权
    用于ADIPOSE衍生干细胞的无血清冷冻介质和ADIPOSE衍生的干细胞库的建立

    公开(公告)号:US20150011429A1

    公开(公告)日:2015-01-08

    申请号:US14369448

    申请日:2012-08-06

    IPC分类号: C12N5/071 C12N5/00

    摘要: Disclosed is a serum-free freezing medium used in adipose-derived stem cells and a method for establishing an adipose-derived stem cell library. The serum-free freezing medium comprises a serum-free culture medium, dimethyl sulfoxide and a serum substitution component KSR; the defects of unstable freezing quality of the adipose-derived stem cells and influence of harmful factors in serum on the adipose-derived stem cells are solved, and the adipose-derived stem cells stored have the advantages of high survival percentage, well adherence growth and strong differentiation capacity.

    摘要翻译: 公开了用于脂肪来源的干细胞的无血清冷冻培养基和建立脂肪来源的干细胞文库的方法。 无血清冷冻培养基包含无血清培养基,二甲基亚砜和血清替代成分KSR; 解决了脂肪干细胞不稳定冻结质量缺陷和血清中有害因素对脂肪干细胞的影响,储存的脂肪干细胞具有生存率高,附着力增长和 强分化能力。