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39 条记录 (耗时 0.034 秒)

    Heating apparatus and driving method therefor
    21.
    发明申请
    Heating apparatus and driving method therefor 审中-公开
    加热装置及其驱动方法

    公开(公告)号：US20060237421A1

    公开(公告)日：2006-10-26

    申请号：US11397604

    申请日：2006-04-05

    申请人： Dong-woo Lee ,  Tae-gyu Kim ,  Jin-sung Lee ,  Bang-weon Lee

    发明人： Dong-woo Lee ,  Tae-gyu Kim ,  Jin-sung Lee ,  Bang-weon Lee

    IPC分类号： F27B9/06 ,  F27D11/00

    CPC分类号： F27B17/0025 ,  F27B5/04 ,  H01L21/67103

    摘要： A heating apparatus and a method of driving the same. The heating apparatus includes: a heating plate on which an object to be heated is loaded and which is partitioned into a plurality of heating zones; a main heating apparatus that is placed on a lower portion of the heating plate and uniformly heats the entire heating plate; and a plurality of subheaters located below the heating plate and disposed to respectively correspond to the heating zones, such that each of the subheaters heats a corresponding one of the heating zones.

    摘要翻译： 一种加热装置及其驱动方法。 加热装置包括：加热板，加热对象物被加载在该加热板上，并被分隔成多个加热区域; 主加热装置，放置在加热板的下部并均匀地加热整个加热板; 以及位于所述加热板下方并分别对应于所述加热区域的多个次要热源，使得每个所述辅助热器加热相应的所述加热区域。

    Heat treatment apparatus
    22.
    发明授权
    Heat treatment apparatus 失效
    热处理设备

    公开(公告)号：US07448604B2

    公开(公告)日：2008-11-11

    申请号：US11058279

    申请日：2005-02-16

    申请人： Tae-gyu Kim ,  Dong-woo Lee ,  Jin-sung Lee ,  Tae-sang Park ,  Bang-weon Lee

    发明人： Tae-gyu Kim ,  Dong-woo Lee ,  Jin-sung Lee ,  Tae-sang Park ,  Bang-weon Lee

    IPC分类号： B01F3/04

    CPC分类号： H01L21/67109 ,  B05B7/0441

    摘要： Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.

    摘要翻译： 提供一种热处理装置。 热处理装置包括：加热板，包括加热器; 包括冷却室的室壳体，并且联接到所述加热板的下部; 以及至少一个雾化单元，其安装在所述室壳体上以通过混合冷却液体和气体而产生液滴气溶胶，同时将所述液滴气溶胶喷射到所述冷却室中。

    Wafer bake apparatus
    23.
    发明申请
    Wafer bake apparatus 失效
    晶圆烘焙设备

    公开(公告)号：US20060049168A1

    公开(公告)日：2006-03-09

    申请号：US11206842

    申请日：2005-08-19

    申请人： Dong-woo Lee ,  Jin-sung Lee ,  Jong-kill Lim ,  Bang-weon Lee ,  Tae-sang Park ,  Tae-gyu Kim

    发明人： Dong-woo Lee ,  Jin-sung Lee ,  Jong-kill Lim ,  Bang-weon Lee ,  Tae-sang Park ,  Tae-gyu Kim

    IPC分类号： H05B3/68

    CPC分类号： H01L21/67109 ,  H01L21/67748 ,  H01L21/68 ,  H01L21/6838

    摘要： A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.

    摘要翻译： 晶片烘烤装置包括与晶片提升单元联动操作的气缸结构的气流控制单元，并且在晶片和热板之间引起空气流动。 因此，当将晶片放置在烘烤位置时，晶片和热板之间的空气下降。 结果，晶片不再受到空气阻力的影响，并且可以更准确地放置在烘烤位置。 此外，当烘烤的晶片被提升到卸载位置时，加热板和晶片之间的空气上升，这又支持晶片并防止晶片的变形。

    Heat treatment apparatus
    24.
    发明申请
    Heat treatment apparatus 失效
    热处理设备

    公开(公告)号：US20050280681A1

    公开(公告)日：2005-12-22

    申请号：US11058279

    申请日：2005-02-16

    申请人： Tae-gyu Kim ,  Dong-woo Lee ,  Jin-sung Lee ,  Tae-sang Park ,  Bang-weon Lee

    发明人： Tae-gyu Kim ,  Dong-woo Lee ,  Jin-sung Lee ,  Tae-sang Park ,  Bang-weon Lee

    IPC分类号： H01L21/324 ,  B05B7/04 ,  B41J2/04 ,  H01L21/00 ,  H01L21/02

    CPC分类号： H01L21/67109 ,  B05B7/0441

    摘要： Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.

    摘要翻译： 提供一种热处理装置。 热处理装置包括：加热板，包括加热器; 包括冷却室的室壳体，并且联接到所述加热板的下部; 以及至少一个雾化单元，其安装在所述室壳体上以通过混合冷却液体和气体而产生液滴气溶胶，同时将所述液滴气溶胶喷射到所述冷却室中。

    HEAT TREATMENT APPARATUS
    26.
    发明申请
    HEAT TREATMENT APPARATUS 审中-公开
    热处理设备

    公开(公告)号：US20090013698A1

    公开(公告)日：2009-01-15

    申请号：US12236014

    申请日：2008-09-23

    申请人： Tae-gyu Kim ,  Dong-Woo Lee ,  Jin-Sung Lee ,  Tae-Sang Park ,  Bang-Weon Lee

    发明人： Tae-gyu Kim ,  Dong-Woo Lee ,  Jin-Sung Lee ,  Tae-Sang Park ,  Bang-Weon Lee

    IPC分类号： F25D31/00

    CPC分类号： H01L21/67109 ,  B05B7/0441

    摘要： Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.

    摘要翻译： 提供一种热处理装置。 热处理装置包括：加热板，包括加热器; 包括冷却室的室壳体，并且联接到所述加热板的下部; 以及至少一个雾化单元，其安装在所述室壳体上以通过混合冷却液体和气体而产生液滴气溶胶，同时将所述液滴气溶胶喷射到所述冷却室中。

    Bake system
    28.
    发明授权
    Bake system 失效
    烤制

    公开(公告)号：US07317172B2

    公开(公告)日：2008-01-08

    申请号：US11156530

    申请日：2005-06-21

    申请人： Dong-woo Lee ,  Tae-gyu Kim ,  Jin-sung Lee

    发明人： Dong-woo Lee ,  Tae-gyu Kim ,  Jin-sung Lee

    IPC分类号： F27B5/08 ,  F27B5/10 ,  F27B9/06

    CPC分类号： H01L21/6719 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/67109 ,  H01L21/67126

    摘要： Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled to the case to form a chamber; and a second cover is disposed in the first cover, and directly above the substrate in the bake process for preventing heat convection on the substrate.

    摘要翻译： 提供了烘烤系统。 烘烤系统包括具有在上表面上具有衬底的加热板的加热板。 在加热板下面设置一个壳体来支撑加热板; 第一盖设置在加热板的上方并联接到壳体以形成室; 并且第二盖设置在第一盖中，并且在烘烤过程中直接在基板上方，用于防止基板上的热对流。

    Bake system
    30.
    发明申请
    Bake system 失效
    烤制

    公开(公告)号：US20060011605A1

    公开(公告)日：2006-01-19

    申请号：US11156530

    申请日：2005-06-21

    申请人： Dong-woo Lee ,  Tae-gyu Kim ,  Jin-sung Lee

    发明人： Dong-woo Lee ,  Tae-gyu Kim ,  Jin-sung Lee

    IPC分类号： F27B9/06

    CPC分类号： H01L21/6719 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/67109 ,  H01L21/67126

    摘要： Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled to the case to form a chamber; and a second cover is disposed in the first cover, and directly above the substrate in the bake process for preventing heat convection on the substrate.

    摘要翻译： 提供了烘烤系统。 烘烤系统包括具有在上表面上具有衬底的加热板的加热板。 在加热板下面设置一个壳体来支撑加热板; 第一盖设置在加热板的上方并联接到壳体以形成室; 并且第二盖设置在第一盖中，并且在烘烤过程中直接在基板上方，用于防止基板上的热对流。