公开(公告)号：US20170047237A1

公开(公告)日：2017-02-16

申请号：US15305088

申请日：2015-04-17

Applicant: EBARA CORPORATION

Inventor： Itsuki KOBATA ,  Keita YAGI ,  Katsuhide WATANABE ,  Yoichi SHIOKAWA ,  Toru MARUYAMA ,  Nobuyuki TAKAHASHI

IPC: H01L21/677 ,  H01L21/3105 ,  B24B37/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/306 ,  H01L21/321

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method.The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Abstract translation: 本发明提供了一种用于在处理液体存在下使基板和催化剂彼此接触来研磨基板的加工对象区域的基板处理装置。 基板处理装置包括：基板保持单元，其被构造成保持基板;催化剂保持单元，其构造成保持催化剂;以及驱动单元，被配置为使所述基板保持单元和所述催化剂保持单元相对于所述处理对象区域移动 的基底和催化剂保持彼此接触。 催化剂小于底物。

公开(公告)号：US20150093968A1

公开(公告)日：2015-04-02

申请号：US14563358

申请日：2014-12-08

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Satoru YAMAKI

IPC: B24B37/015 ,  H01L21/67 ,  B24B37/30 ,  H01L21/683

CPC classification number: B24B37/005 ,  B24B37/015 ,  B24B37/10 ,  B24B37/30 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838

Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

公开(公告)号：US20150017887A1

公开(公告)日：2015-01-15

申请号：US14327522

申请日：2014-07-09

Applicant: EBARA CORPORATION

Inventor： Yoichi KOBAYASHI ,  Katsuhide WATANABE ,  Yoichi SHIOKAWA ,  Keita YAGI ,  Masaki KINOSHITA

IPC: B24B37/013 ,  G01J3/42 ,  G01B11/06

CPC classification number: B24B37/013 ,  G01B11/0625 ,  G01B11/0683 ,  G01B11/0691

Abstract: A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness.

Abstract translation: 公开了一种能够实现高精度抛光结果的抛光装置。 抛光装置包括：在静止状态下测量基板的膜厚的直列式膜厚测量装置，以及设置在抛光台中的具有膜厚度传感器的原位光谱膜厚监视器， - 平面光谱膜厚度监视器被配置为从由在线膜厚测量装置测量的初始膜厚度减去由基板抛光之前的原位光谱膜厚度监测器测量的初始膜厚度 在对基板进行研磨之前，为了确定修正值，将修正值与基板正在研磨时测定的膜厚相加，得到监视膜厚，并根据监视膜监视基板的研磨进度 厚度。

公开(公告)号：US20130136884A1

公开(公告)日：2013-05-30

申请号：US13687263

申请日：2012-11-28

Applicant: EBARA Corporation

Inventor： Hozumi YASUDA ,  Katsuhide WATANABE ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Satoru YAMAKI ,  Shingo TOGASHI

IPC: B32B3/08

CPC classification number: B32B3/08 ,  B24B37/30 ,  B32B3/18 ,  B32B27/12 ,  Y10T428/21 ,  Y10T428/24174 ,  Y10T428/24851

Abstract: There is provided an elastic membrane which can uniformly reduce deformation (elongation) of its contact portion, having a contact surface for contact with a substrate, along the contact surface in substantially the entire area of the contact portion from the center to the periphery. The elastic membrane includes a contact portion having a contact surface for contact with the substrate; a first peripheral wall portion coupled to the peripheral end of the contact portion and extending upwardly; and a second peripheral wall portion located on the inside of the first peripheral wall portion, coupled to the contact portion and extending upwardly, and defining a first chamber on the outer side thereof and a second chamber on the inner side thereof. In the elastic membrane, substantially the entire area of the contact portion is reinforced with a reinforcing member having a higher rigidity than the elastic membrane.

Abstract translation: 提供了一种弹性膜，其能够均匀地减小其接触部分的接触部分的变形（伸长率），该接触部分具有与基板接触的接触表面，沿接触表面沿接触部分的中心到周边的大致整个区域。 弹性膜包括具有与基板接触的接触表面的接触部分; 耦合到所述接触部分的外周端并向上延伸的第一周壁部分; 以及位于所述第一周壁部分的内侧的第二周壁部分，其联接到所述接触部分并向上延伸，并且在其外侧上限定第一室，在其内侧限定第二室。 在弹性膜中，基本上接触部分的整个区域都被具有比弹性膜高的刚性的加强件增强。