公开(公告)号：US20180068877A1

公开(公告)日：2018-03-08

申请号：US15689071

申请日：2017-08-29

Applicant: Ebara Corporation

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B08B3/024 ,  H01L21/67046 ,  H01L21/68728

Abstract: According to one embodiment, a substrate cleaning apparatus that cleans a substrate while rotating the substrate, the substrate cleaning apparatus includes: a first cleaning liquid supplier that sprays cleaning liquid in a spray shape at a first spraying angle toward a center of the substrate; and a second cleaning liquid supplier that sprays cleaning liquid in a spray shape at a second spraying angle greater than the first spraying angle toward an area between the center of the substrate and an edge of the substrate.

公开(公告)号：US20170323809A1

公开(公告)日：2017-11-09

申请号：US15589695

申请日：2017-05-08

Applicant: EBARA CORPORATION

Inventor： Koichi FUKAYA ,  Tomoatsu ISHIBASHI ,  Hisajiro NAKANO

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B3/024 ,  H01L21/02052 ,  H01L21/67017 ,  H01L21/6708

Abstract: A substrate washing device includes a substrate holding mechanism 70 that holds a substrate W, a substrate rotating mechanism 72 that rotates the substrate W held by the substrate holding mechanism 70, and a two-fluid nozzle 46 that ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzle 46 is formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzle 46 can be suppressed.

公开(公告)号：US20170316960A1

公开(公告)日：2017-11-02

申请号：US15523078

申请日：2015-10-20

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  B08B1/04 ,  B08B3/02 ,  H01L21/02

CPC classification number: H01L21/67046 ,  A46B13/00 ,  B08B1/04 ,  B08B3/022 ,  H01L21/02052 ,  H01L21/304 ,  H01L21/67253 ,  H01L21/68728

Abstract: A substrate cleaning apparatus (50) that cleans a substrate (S) includes: circumference supporting members (51) that support and rotate the substrate (S); a sponge (541) having a cleaning surface that is brought into contact with the surface to be cleaned of the substrate (S) being rotated by the circumference supporting members (51), and cleans the surface to be cleaned; an arm (53) that moves the sponge (541) in a radial direction of the substrate (S) while maintaining the cleaning surface in contact with the surface to be cleaned; and a controller (60) that controls the contact pressure of the cleaning surface on the surface to be cleaned. When the sponge (541) is located near the edge of the substrate (S), the controller (60) adjusts the contact pressure to a smaller value than that of when the sponge (541) is located near the center of the substrate (S).

公开(公告)号：US20170209902A1

公开(公告)日：2017-07-27

申请号：US15480678

申请日：2017-04-06

Applicant: Ebara Corporation

Inventor： Tomoatsu ISHIBASHI

IPC: B08B1/04 ,  B08B1/02 ,  B08B3/04 ,  H01L21/687 ,  A46B13/02 ,  B08B11/00 ,  H01L21/67 ,  B08B1/00 ,  A46B9/00

CPC classification number: B08B1/04 ,  A46B9/005 ,  A46B13/02 ,  B08B1/003 ,  B08B1/02 ,  B08B3/041 ,  B08B11/00 ,  H01L21/00 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68735 ,  H01L21/68764

Abstract: A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.

公开(公告)号：US20150352600A1

公开(公告)日：2015-12-10

申请号：US14736036

申请日：2015-06-10

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: B08B1/00 ,  H01L21/67

CPC classification number: H01L21/67046 ,  B08B1/001 ,  B08B1/04 ,  B08B11/02

Abstract: A substrate cleaning apparatus includes outer circumference supporting members 32 that support the outer circumference of a rotating substrate W, a swing cleaning member 34 that swings between a first peripheral position B and a second peripheral position B′ of the substrate W while passing a center portion A of the substrate W to clean a front surface of the rotating substrate W, and an elongated supporting member 36 that extends long from a third peripheral position C to a fourth peripheral position C′ of the substrate W so as to pass the center portion A and supports the rear surface of the rotating substrate W. The first peripheral position B is disposed between a position D of the outer circumference supporting member 32 of the plurality of outer circumference supporting members 32 and closest to the third peripheral position C and the third peripheral position C.

Abstract translation: 基板清洗装置具有支撑旋转基板W的外周的外周支撑部件32，摆动清扫部件34，其通过基板W的第一周边位置B和第二周边位置B'之间摆动， 用于清洁旋转基板W的前表面的基板W的A以及从基板W的第三周边位置C延伸到第四周边位置C'的细长支撑构件36，以使中心部分A通过 并且支撑旋转基板W的后表面。第一周边位置B设置在多个外周支撑构件32的外周支撑构件32的位置D和最靠近第三周边位置C的第三周边位置 位置C.

公开(公告)号：US20150303078A1

公开(公告)日：2015-10-22

申请号：US14687758

申请日：2015-04-15

Applicant: Ebara Corporation

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67

CPC classification number: H01L21/67034 ,  H01L21/67028 ,  H01L21/67253

Abstract: The substrate drying apparatus includes a rinse agent nozzle configured to eject a rinse agent to the substrate while moving away from a center of the substrate relative to the substrate, a drying gas nozzle configured to spout a drying gas to the substrate while moving away from the center of substrate relative to the substrate with movement of the rinse agent nozzle, a liquid area sensor and a dried area sensor configured to sense a surface of the substrate around an interface of the rinse agent by moving away from the center of the substrate with movement of the rinse agent nozzle and the drying gas nozzle, and a control unit configured to control a drying condition based on the sensing results of the liquid area sensor and the dried area sensor.

Abstract translation: 基材干燥装置包括漂洗剂喷嘴，该冲洗剂喷嘴被配置为在从衬底的中心相对于基板移开的同时将冲洗剂喷射到基板;干燥气体喷嘴，被配置为在远离基板的同时向基板喷出干燥气体 冲洗剂喷嘴的移动使衬底相对于衬底的中心，液体区域传感器和干燥区域传感器，该区域传感器和干燥区域传感器被配置为通过移动离开衬底的中心来感测漂洗剂界面周围的衬底的表面 的冲洗剂喷嘴和干燥气体喷嘴，以及控制单元，其被配置为基于液体区域传感器和干燥区域传感器的感测结果来控制干燥条件。

公开(公告)号：US20140352608A1

公开(公告)日：2014-12-04

申请号：US14254829

申请日：2014-04-16

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: B05C5/02

CPC classification number: B24B57/02 ,  B05C5/0254 ,  B24B37/04 ,  H01L21/67051 ,  H01L21/67219

Abstract: A substrate processing apparatus capable of preventing corrosion of metal interconnects of a substrate formed thereon is disclosed. The substrate processing apparatus includes a substrate holder configured to hold a substrate horizontally and rotate the substrate, and a slit nozzle configured to supply a processing liquid onto a surface of the substrate. The slit nozzle is adjacent to the surface of the substrate and extends in approximately a radial direction of the substrate.

Abstract translation: 公开了能够防止形成在其上的基板的金属互连件的腐蚀的基板处理装置。 基板处理装置包括：基板保持器，其被构造成水平地保持基板并旋转基板;以及狭缝喷嘴，被配置为将处理液体供应到基板的表面上。 狭缝喷嘴与基板的表面相邻并且在基板的大致径向方向上延伸。

公开(公告)号：US20130220368A1

公开(公告)日：2013-08-29

申请号：US13758226

申请日：2013-02-04

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: B08B7/04 ,  B08B1/00 ,  B08B3/02

CPC classification number: H01L21/02074 ,  H01L21/02063 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/68728

Abstract: A substrate cleaning method can prevent corrosion of copper interconnects even when the cleaning method, which uses two-fluid jet cleaning, is used for cleaning of a surface of a substrate after polishing. The substrate cleaning method includes: carrying out primary cleaning of a surface of a substrate by scrub cleaning using a neutral or alkaline liquid chemical as a cleaning liquid; carrying out finish cleaning of the surface of the substrate by two-fluid jet cleaning which cleans the surface of the substrate in a non-contact manner by jetting carbonated water, comprising pure water or ultrapure water containing dissolved CO2 gas, from a two-fluid nozzle toward the surface of the substrate; and subsequently carrying out final finish cleaning of the surface of the substrate by scrub cleaning using a neutral or alkaline liquid chemical as a cleaning liquid, and then drying the surface of the substrate.

Abstract translation: 即使当使用双流体射流清洗的清洁方法用于清洁抛光后的基板的表面时，基板清洁方法也可以防止铜互连的腐蚀。 基板清洗方法包括：通过使用中性或碱性液体化学品作为清洗液进行擦洗清洗来对基材表面进行主要清洗; 通过双流体喷射清洗进行基材表面的完整清洁，其通过从双液体喷射包含纯水或含有溶解的CO 2气体的超纯水的碳酸水，以非接触的方式清洁基材表面 喷嘴朝向基板的表面; 然后通过使用中性或碱性液体化学品作为清洗液进行擦洗清洗，然后干燥基材的表面，对基材的表面进行最终的完成清洁。

公开(公告)号：US20240213045A1

公开(公告)日：2024-06-27

申请号：US18394735

申请日：2023-12-22

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  B08B1/12 ,  B08B1/20 ,  B08B1/34 ,  B08B1/36 ,  B08B3/04 ,  B08B3/08

CPC classification number: H01L21/67046 ,  B08B1/12 ,  B08B1/20 ,  B08B1/34 ,  B08B1/36 ,  B08B3/041 ,  B08B3/08 ,  H01L21/67051

Abstract: A substrate cleaning apparatus according to the present invention comprises a cleaning member that contacts with a substrate to clean the substrate; and a supply mechanism that provides an organic solvent for dissolution to the substrate after the substrate is cleaned by the cleaning member. The organic solvent for dissolution can dissolve a foreign substance generation factor caused by the cleaning member.

公开(公告)号：US20220410343A1

公开(公告)日：2022-12-29

申请号：US17780923

申请日：2020-12-07

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: B24B51/00 ,  B08B1/04 ,  B08B13/00 ,  B08B3/02 ,  B24B31/02 ,  G05B13/02 ,  G06T7/00

Abstract: The present invention relates to a substrate cleaning apparatus, a polishing apparatus, a buffing apparatus, a substrate processing apparatus, a machine learning apparatus used for any of these apparatuses, and a substrate cleaning method, which are improved in terms of both performance and throughput. The substrate cleaning apparatus (16) includes: a cleaning tool (77) configured to clean a substrate (W) held by a substrate holder (71, 72, 73, 74); a surface-property measuring device configured to obtain surface data of the cleaning tool (77); and a controller (30) configured to determine a replacement time of the cleaning tool (77) based on the surface data. The surface-property measuring device is configured to obtain surface data of the cleaning tool (77) at at least two measurement points (PA, PB) of the cleaning tool (77) each time a predetermined number of substrates (W) are scrubbed, and the controller (30) is configured to determine the replacement time of the cleaning tool (77) based on a difference in the surface data obtained.