公开(公告)号：US20070102396A1

公开(公告)日：2007-05-10

申请号：US11619789

申请日：2007-01-04

申请人： Frank Egitto ,  Kevin Knadle ,  Andrew Seman

发明人： Frank Egitto ,  Kevin Knadle ,  Andrew Seman

IPC分类号： H01B13/00

CPC分类号： H05K3/06 ,  B32B15/08 ,  B32B15/20 ,  B32B27/04 ,  B32B27/06 ,  B32B27/30 ,  B32B27/38 ,  H01L21/32134 ,  H01L21/4846 ,  H01L21/76838 ,  H01L2924/0002 ,  H05K3/027 ,  H05K3/061 ,  H05K3/064 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24802 ,  H01L2924/00

摘要： A method of making a circuitized substrate. A conductive layer having a substantially planar upper surface is formed on and in direct mechanical contact with an upper surface of a substrate. A portion of the conductive layer is removed to form an interim side wall in the conductive layer. A layer of patternable material is formed on the substantially planar upper surface and on the interim side wall. A portion of the layer of patternable material on the conductive layer is removed to expose the interim side wall. A portion of the substantially planar upper surface is removed to form a side wall in the layer of patternable material. Portions of the interim side wall in the conductive layer are removed to form a second side wall and a bottom wall defined by the upper surface of the substrate. The second side wall is substantially perpendicular to the bottom wall.

摘要翻译： 制造电路化基板的方法。 具有基本平坦的上表面的导电层形成在基板的上表面上并与基板的上表面直接机械接触。 去除导电层的一部分以在导电层中形成临时侧壁。 在基本平坦的上表面和临时侧壁上形成可图案化材料层。 去除导电层上图案化材料层的一部分以露出临时侧壁。 去除基本平坦的上表面的一部分以在可图案材料层中形成侧壁。 去除导电层中的临时侧壁的部分以形成由衬底的上表面限定的第二侧壁和底壁。 第二侧壁基本上垂直于底壁。