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公开(公告)号:US09945578B2
公开(公告)日:2018-04-17
申请号:US15719099
申请日:2017-09-28
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Randy Vanberg , Hamid Reza Zareie Rajani , Seyed Reza Larimi , Morteza Abbasi
CPC classification number: G01F1/115 , F01P1/06 , F01P2025/00 , F24D19/10 , F24F11/30 , F24F11/52 , F24F11/62 , F24F11/63 , F24F11/64 , F24F11/89 , F24F2110/00 , F24H9/20 , F28F19/00 , F28F27/00
Abstract: A monitored heat exchanger system that includes a heat exchanger unit in operable engagement with a heat generating device, with an at least one service fluid being transferable therebetween, and a monitoring module coupled to the heat exchanger unit. The monitoring module includes a primary microcontroller in operable communication with an at least one sensor assembly. The at least one sensor assembly includes a mounting frame; a support platform; a circuit board; an inner sensor housing configured to extend out and around the circuit board and the support platform; a first magnet coupled to an underside of the inner sensor housing; and a rotating member comprising a plurality of blades, the rotating member being disposed on top of the inner sensor housing.
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公开(公告)号:US20170292803A1
公开(公告)日:2017-10-12
申请号:US15616153
申请日:2017-06-07
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Randy Vanberg , Hamid Reza Zareie Rajani , Seyed Reza Larimi , Morteza Abbasi
CPC classification number: F28G15/003 , B60K11/08 , F04D19/002 , F04D25/068 , F04D25/166 , F28D1/024 , F28D1/04 , F28D2021/0031 , F28D2021/008 , F28D2021/0091 , F28F27/00 , G06F1/20 , G06F1/206 , H01L23/467
Abstract: Embodiments of the disclosure pertain to a method for monitoring a heat exchanger unit that may include the steps of: associating a monitoring module with an airflow side of the heat exchanger unit; operating the monitoring module whereby a microcontroller performs tasks related to data acquisition, data comparison, and providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the airflow side; a logic circuit in operable communication with the at least one sensor, and further comprising the microcontroller.
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公开(公告)号:US20170292735A1
公开(公告)日:2017-10-12
申请号:US15477097
申请日:2017-04-02
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Derek Hjorth , John Gaska , Randy Vanberg , Kevin Visscher , Iqbal Lotey , Bob Peng
CPC classification number: F24H3/06 , E21B43/26 , E21B43/267 , F24F1/0007
Abstract: Embodiments of the disclosure pertain to a heat exchanger unit that includes a frame and a plurality of coolers coupled therewith. The heat exchanger unit has a reference axis, namely a vertical axis. The frame has a top region, a bottom region, and a plurality of side regions. Each of the plurality of coolers may be coupled with the frame proximate to a respective side region of the plurality of side regions. The heat exchanger unit includes an airflow region therein. The heat exchanger unit includes a first set of baffles, each baffle of the first set of baffles is configured at an angle to the vertical axis.
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