公开(公告)号：US11555964B1

公开(公告)日：2023-01-17

申请号：US17363846

申请日：2021-06-30

申请人： GLOBALFOUNDRIES U.S. Inc.

发明人： Michal Rakowski ,  Petar I. Todorov ,  Yusheng Bian ,  Won Suk Lee ,  Asif J. Chowdhury ,  Kenneth J. Giewont

IPC分类号： G02B6/125 ,  G02F1/01 ,  G02B6/136 ,  G02B6/12

摘要： Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide. Thus, the heating element is usable for thermally tuning the closed-curve waveguide via the closed-curve thermal coupler to minimize any temperature-dependent resonance shift (TDRS).

公开(公告)号：US20220268994A1

公开(公告)日：2022-08-25

申请号：US17179532

申请日：2021-02-19

申请人： GLOBALFOUNDRIES U.S. Inc.

发明人： Asli Sahin ,  Karen A. Nummy ,  Thomas Houghton ,  Kevin K. Dezfulian ,  Kenneth J. Giewont ,  Yusheng Bian

IPC分类号： G02B6/122 ,  G02B6/13

摘要： A photonics integrated circuit includes a semiconductor substrate; a buried insulator layer positioned over the semiconductor substrate; and a back-end-of-line (BEOL) insulator stack over a first portion of the buried insulator layer. In addition, the PIC includes a silicon nitride (SiN) waveguide edge coupler positioned in a first region over the buried insulator layer and at least partially under the BEOL insulator stack. An oxide layer extends over a side of the BEOL insulator stack. The SiN waveguide edge coupler provides better power handling and fabrication tolerance than silicon waveguide edge couplers, despite the location under various BEOL layers. The PIC can also include silicon waveguide edger coupler(s).

公开(公告)号：US20220247148A1

公开(公告)日：2022-08-04

申请号：US17167201

申请日：2021-02-04

申请人： GLOBALFOUNDRIES U.S. Inc.

发明人： Yusheng Bian ,  Roderick A. Augur ,  Michal Rakowski ,  Kenneth J. Giewont ,  Karen A. Nummy

IPC分类号： H01S5/026 ,  H01S5/30 ,  H01S5/323

摘要： A laser structure, including: a dielectric matrix formed of a first material; a laser source formed within the dielectric matrix and formed of a semiconductor material; and a plurality of side confining features formed within the dielectric matrix and extending parallel to and along a length of the laser source. The plurality of side confining features are formed of the semiconductor material.

公开(公告)号：US11378743B1

公开(公告)日：2022-07-05

申请号：US17146864

申请日：2021-01-12

申请人： GLOBALFOUNDRIES U.S. Inc.

发明人： Yusheng Bian ,  Roderick A. Augur ,  Kenneth J. Giewont ,  Karen Nummy ,  Edward Kiewra ,  Steven M. Shank

IPC分类号： G02B6/122 ,  G02B6/34 ,  G02B6/136 ,  G02B6/12

摘要： Structures including a grating coupler and methods of fabricating a structure including a grating coupler. The structure includes structure includes a dielectric layer on a substrate, a first waveguide core positioned in a first level over the dielectric layer, and a second waveguide core positioned in a second level over the dielectric layer. The second level differs in elevation above the dielectric layer from the first level. The first waveguide core includes a tapered section. The structure further includes a grating coupler having a plurality of segments positioned in the second level adjacent to the second waveguide core. The segments of the grating coupler and the tapered section of the first waveguide core are positioned in an overlapping arrangement.

公开(公告)号：US11105980B1

公开(公告)日：2021-08-31

申请号：US16841963

申请日：2020-04-07

申请人： GLOBALFOUNDRIES U.S. Inc.

发明人： Shuren Hu ,  Andreas D. Stricker ,  Karen A. Nummy ,  David B. Riggs ,  Kenneth J. Giewont ,  Jessie C. Rosenberg

IPC分类号： G02B6/28 ,  G02B6/293 ,  H04J14/02

摘要： Embodiments of the disclosure provide a demultiplexer for processing a multiplexed optical input. The demultiplexer may include a plurality of Mach-Zehnder Interferometric (MZI) stages for converting the multiplexed optical input into a plurality of component optical signals. Each of the plurality of component optical signals corresponds to a respective wavelength-space component of the multiplexed optical input. A plurality of bandpass filters, each having a respective wavelength passband, may receive one of the plurality of component optical signals. The plurality of bandpass filters generates a plurality of demultiplexed optical signals based on the plurality of component optical signals.