Heat pipe with multiple stages of cooling

    公开(公告)号:US11800684B2

    公开(公告)日:2023-10-24

    申请号:US17152178

    申请日:2021-01-19

    Abstract: A heat pipe is provided for cooling an electronic component of a printed circuit board. The heat pipe includes a tube having an inner diameter surface defining a bore, with the tube having first and second ends along the bore. The heat pipe further includes a sorbent material coated onto the inner diameter surface of the tube, a first liquid contained within the bore, and a second liquid adsorbed by the sorbent material. The second liquid has a second boiling temperature that is higher than a first boiling temperature of the first liquid. The first liquid vaporizes into a first vapor, in response to the tube receiving heat from the electronic component and the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material and vaporizes into a second vapor in response to the second liquid reaching the second boiling temperature.

    POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM

    公开(公告)号:US20220230938A1

    公开(公告)日:2022-07-21

    申请号:US17152084

    申请日:2021-01-19

    Abstract: A vascular jet cooling system for use with a planar power module and a coolant supply includes a manifold housing and one or more jet impingement plates. The manifold housing is constructed of a dielectric polymer molding material, and defines a coolant inlet port configured to fluidly connect to the coolant supply, an internal cavity in fluid communication with the coolant inlet port and containing the power module, and a coolant outlet port in fluid communication with the internal cavity. The jet impingement plate(s) is arranged in the internal cavity. Openings of the plates direct coolant passing through the coolant inlet port onto a respective major surface of the power module. A power module assembly includes a planar power module and the vascular jet cooling system. A method of constructing the power module assembly uses sacrificial materials and overmolding of the jet impingement plates.

    Direct cooling of inverter switches

    公开(公告)号:US11224147B1

    公开(公告)日:2022-01-11

    申请号:US16952149

    申请日:2020-11-19

    Abstract: A switch of an inverter module is disposed in a coolant channel, is configured to be immersed in coolant in the coolant channel, and includes: a first terminal disposed on a first plane and configured to connect to a direct current (DC) reference potential; a second terminal disposed on a second plane and configured to connect to an alternating current (AC) reference potential; a gate, an emitter, and a collector; first cooling features that extend away from the first and second planes, that directly contact the first terminal, and that are configured to allow coolant flow therethrough; and second cooling features that extend away from the first cooling features, the first plane, and the second plane, that directly contact the second terminal, and that are configured to allow coolant flow therethrough.

    RETRACTABLE AERODYNAMIC PANEL
    27.
    发明申请

    公开(公告)号:US20210086597A1

    公开(公告)日:2021-03-25

    申请号:US16576376

    申请日:2019-09-19

    Abstract: A retractable aerodynamic panel for an automotive truck cargo bed comprises a first support rail adapted to be mounted onto a top edge of a first side wall of an automotive truck bed and a second support rail adapted to be mounted onto a top edge of a second side wall of an automotive truck cargo bed, a panel adapted to be mounted onto a tailgate of the automotive truck cargo bed, the panel adapted to extend between a retracted position, wherein the automotive truck cargo bed is substantially open, and a deployed position, wherein the panel extends outward from the tailgate across a portion of the automotive truck cargo bed between the top edges of the first and second side walls, the panel supported between side walls within the support rails, and an actuator adapted to selectively extend the panel between the retracted and deployed positions.

    Brake temperature monitoring system

    公开(公告)号:US10562509B2

    公开(公告)日:2020-02-18

    申请号:US15643047

    申请日:2017-07-06

    Abstract: A brake temperature monitoring system configured to monitor at least one of a rotor and hydraulic fluid of a brake mechanism for a vehicle. The system including a controller including a processor and an electronic storage medium, a vehicle velocity sensor, an ambient temperature sensor, and a pre-programmed module. The vehicle velocity sensor is configured to output a velocity signal to the processor. The ambient temperature sensor is configured to output an ambient temperature signal to the processor. The model is pre-programmed into the electronic storage medium, and is adapted to estimate the temperature of at least one of the rotor and the hydraulic fluid. The estimation is based on an ambient air temperature, and a pre-established relationship between a conductive heat transfer factor and a convective heat transfer factor. The convective heat transfer factor is a function of vehicle velocity.

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