公开(公告)号：US20250018649A1

公开(公告)日：2025-01-16

申请号：US18713978

申请日：2021-12-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Emre Hiro Discekici ,  Shannon Reuben Woodruff ,  Alay Yemane ,  Greg Scott Long

IPC: B29C64/30 ,  B29C64/295 ,  B29C71/00 ,  B29C71/02 ,  B29K77/00 ,  B33Y40/20

Abstract: Examples of the present disclosure are directed toward methods and system for reducing surface roughness of a cured three-dimensional (3D) printed object using a localized heat source. An example method includes applying a liquid solvent to the cured 3D printed object and heating the cured 3D printed object with the liquid solvent applied thereto to a temperature below a melting point of the cured 3D printed object using a localized heat source to reduce a surface roughness of the cured 3D printed object as compared to the cured 3D printed object prior to the application of heat.

公开(公告)号：US12121973B2

公开(公告)日：2024-10-22

申请号：US18125042

申请日：2023-03-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Mohammed S. Shaarawi ,  James McKinnell ,  Vladek Kasperchik ,  David A. Champion ,  Greg Scott Long

IPC: B22F12/63 ,  B22F1/10 ,  B22F1/107 ,  B22F9/04 ,  B22F10/14 ,  B22F10/20 ,  B22F10/64 ,  B29C64/165 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y40/20 ,  B33Y70/00 ,  B22F10/28 ,  B22F10/32 ,  B22F10/50 ,  B22F12/52 ,  B22F12/67 ,  B33Y70/10

CPC classification number: B22F9/04 ,  B22F1/10 ,  B22F1/107 ,  B22F10/14 ,  B22F10/20 ,  B22F10/64 ,  B29C64/165 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y40/20 ,  B33Y70/00 ,  B22F2009/041 ,  B22F10/28 ,  B22F10/32 ,  B22F10/50 ,  B22F12/52 ,  B22F12/63 ,  B22F12/67 ,  B33Y70/10

Abstract: In a three-dimensional printing method example, a liquid functional agent is selectively applied. The liquid functional agent includes an alloying agent. A metallic build material is applied. The liquid functional agent is selectively applied before the metallic build material, after the metallic build material, or both before and after the metallic build material. The liquid functional agent patterns the metallic build material to form a composite layer. At least some of the metallic build material is exposed to energy to melt the at least some of the metallic build material to form a layer. Upon contact or after energy exposure, the alloying agent and the build material alter a composition of the composite layer.

公开(公告)号：US20240240050A1

公开(公告)日：2024-07-18

申请号：US18289817

申请日：2021-06-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Emre Hiro Discekici ,  Greg Scott Long ,  Dennis J. Schissler ,  Shannon Reuben Woodruff

IPC: C09D177/04 ,  B29C64/165 ,  B29K21/00 ,  B29K23/00 ,  B29K77/00 ,  B29K105/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08K3/04 ,  C08K5/21 ,  C09D7/61 ,  C09D7/63

CPC classification number: C09D177/04 ,  B33Y70/00 ,  C09D7/61 ,  C09D7/63 ,  B29C64/165 ,  B29K2021/003 ,  B29K2023/12 ,  B29K2077/00 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  C08K3/04 ,  C08K5/21

Abstract: A three-dimensional printing kit can include a polymer build material and a fusing agent. The polymer build material can include from about 80 wt % to about 100 wt % polymeric particles. The fusing agent can include an aqueous liquid vehicle, an electromagnetic radiation absorber to absorb radiation energy and convert the radiation energy to heat, and an endothermic decomposition compound that can undergo thermal decomposition at a temperature ranging from about 60° C. to about 400° C.

公开(公告)号：US11633782B2

公开(公告)日：2023-04-25

申请号：US16073173

申请日：2016-04-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Mohammed S. Shaarawi ,  James McKinnell ,  Vladek Kasperchik ,  David A. Champion ,  Greg Scott Long

IPC: B22F3/105 ,  B22F1/107 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/165 ,  B33Y40/00 ,  B29C67/00 ,  B22F10/20 ,  B22F10/50 ,  B22F10/28 ,  B22F10/32 ,  B22F9/04 ,  B33Y70/10

Abstract: In a three-dimensional printing method example, a liquid functional agent is selectively applied. The liquid functional agent includes an alloying agent. A metallic build material is applied. The liquid functional agent is selectively applied before the metallic build material, after the metallic build material, or both before and after the metallic build material. The liquid functional agent patterns the metallic build material to form a composite layer. At least some of the metallic build material is exposed to energy to melt the at least some of the metallic build material to form a layer. Upon contact or after energy exposure, the alloying agent and the build material alter a composition of the composite layer.

公开(公告)号：US20210129429A1

公开(公告)日：2021-05-06

申请号：US16605064

申请日：2018-01-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Greg Scott Long ,  Phil D Matlock ,  Jake Wright ,  David L Erickson

IPC: B29C64/165 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y80/00

Abstract: Some examples include an additive manufacturing method for controlling electrostatic discharge of a build object. The method includes receiving data related to a build object, the data including conductivity data, selectively depositing a first portion of a printing agent onto a build material layer in a pattern of an object layer of a build object, the printing agent being electrically conductive at a predetermined dosage, the first portion deposited at less than the predetermined dosage, selectively depositing a second portion of the printing agent onto the build material layer at an area of the pattern, the printing agent at the area deposited at or above the predetermined dosage, and applying fusing energy to form the object layer, the object layer of the build object including a shell formed at the area and a core, the shell being electrically conductive and the core being electrically non-conductive.

公开(公告)号：US10676806B2

公开(公告)日：2020-06-09

申请号：US15329202

申请日：2014-07-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Elmer Abbott, Jr. ,  Greg Scott Long ,  Roberto A. Pugliese

IPC: C22C45/10 ,  C23C26/00 ,  C22C45/00 ,  C23C30/00 ,  B41J2/14 ,  C09D5/38

Abstract: A wear resistant coating may comprise an amorphous metal comprising at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and a metalloid. An amorphous metal may comprise at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and a metalloid. A coating may comprise at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and silicon. In some examples, the amorphous metal is TaWSi. In one example, the refractory metals may comprise Niobium, Molybdenum, Tantalum, Tungsten, Rhenium, or combinations thereof.

公开(公告)号：US10449763B2

公开(公告)日：2019-10-22

申请号：US16067788

申请日：2016-06-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  The State of Oregon State Board of Higher Education on behalf of Oregon State University

Inventor： James Elmer Abbott, Jr. ,  John M McGlone ,  Kristopher Olsen ,  Roberto A Pugliese ,  Greg Scott Long ,  Douglas A Keszler ,  John Wager

IPC: B41J2/14 ,  C23C14/00 ,  H01B1/02 ,  B41J2/16 ,  C22C45/00 ,  C23C14/08 ,  C23C14/18 ,  C23C28/04

Abstract: An amorphous thin metal film can include a combination of metals or metalloids including: 5 at % to 74 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 74 at % of a first metal; 5 at % to 74 at % of a second metal; and 5 at % to 70 at % of a dopant. The first and second metals can be independently selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum, wherein the first metal and the second metal can be different metals. The dopant can be selected from the group of oxygen, nitrogen, or combinations thereof. The metalloid, first metal, second metal, and dopant can account for at least 70 at % of the amorphous thin metal film.

公开(公告)号：US10359392B2

公开(公告)日：2019-07-23

申请号：US15381041

申请日：2016-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Elmer Abbott, Jr. ,  Greg Scott Long ,  Michael A. Delos-Reyes

IPC: G01N27/403 ,  C23C14/34

Abstract: A well is formed in a body of dielectric material and has a chamfered edge about a top side of the well. A top electrode layer is on a top face of the body and on the chamfered edge of the well. A bottom electrode is on a floor of the well.

公开(公告)号：US20190119101A1

公开(公告)日：2019-04-25

申请号：US16068261

申请日：2016-06-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  The State of Oregon State Board of Higher Education on behalf of Oregon State University

Inventor： James Elmer Abbott, Jr. ,  John M McGlone ,  Kristopher Olsen ,  Roberto A Pugliese ,  Greg Scott Long ,  John Wager ,  Douglas A Keszler ,  T. Stafford Johnson ,  William F Stickel

IPC: B81B7/00 ,  C23C14/18 ,  C23C8/10 ,  C23C14/34 ,  B81C1/00 ,  B41J2/14

Abstract: An amorphous thin film stack can include a first layer including a combination metals or metalloids including: 5 at % to in 90 at % of a metalloid; 5 at % to 90 at % of a first metal and a second metal independently selected from titanium, vanadium, chromium, iron, cobalt, nickel, niobium, molybdenum, ruthenium, rhodium, palladium, tantalum, tungsten, osmium, iridium, or platinum. The three elements may account for at least 70 at % of the amorphous thin film stack. The stack can further include a second layer formed on a surface of the first layer. The second layer can be an oxide layer, a nitride layer, or a combination thereof. The second layer can have an average thickness of 10 angstroms to 200 microns and a thickness variance no greater than 15% of the average thickness of the second layer.

公开(公告)号：US20170160224A1

公开(公告)日：2017-06-08

申请号：US15381041

申请日：2016-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Elmer Abbott, JR. ,  Greg Scott Long ,  Michael A. Delos-Reyes

IPC: G01N27/403 ,  C23C14/34

CPC classification number: G01N27/403 ,  C23C14/34

Abstract: A well is formed in a body of dielectric material and has a chamfered edge about a top side of the well. A top electrode layer is on a top face of the body and on the chamfered edge of the well. A bottom electrode is on a floor of the well.