公开(公告)号：US09902162B2

公开(公告)日：2018-02-27

申请号：US14770049

申请日：2013-02-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/155 ,  B41J2/16

CPC classification number: B41J2/17526 ,  B41J2/14072 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/17553 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In one example, a print bar includes multiple printhead dies molded into an elongated, monolithic body. The dies are arranged generally end to end along a length of the body and the body has a channel therein through which fluid may pass directly to the dies.

公开(公告)号：US20170305167A1

公开(公告)日：2017-10-26

申请号：US15644235

申请日：2017-07-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/175 ,  B41J2/14 ,  B41J2/16 ,  B41J2/155

Abstract: In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.

公开(公告)号：US09623657B2

公开(公告)日：2017-04-18

申请号：US14850129

申请日：2015-09-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Silam J. Choy ,  Garrett E. Clark ,  Rio Rivas ,  Ed Friesen ,  Kelly Ronk

IPC: B41J2/14 ,  B05B1/14

CPC classification number: B41J2/1433 ,  B05B1/14 ,  B41J2/14145 ,  B41J2002/14387 ,  B41J2002/14419 ,  B41J2202/07 ,  B41J2202/11

Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.

公开(公告)号：US10603911B2

公开(公告)日：2020-03-31

申请号：US15749073

申请日：2015-10-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/155

Abstract: A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.

公开(公告)号：US10369790B2

公开(公告)日：2019-08-06

申请号：US15465563

申请日：2017-03-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Silam J. Choy ,  Garrett E. Clark ,  Rio Rivas ,  Ed Friesen ,  Kelly Ronk

IPC: B41J2/14 ,  B05B1/14

Abstract: A fluid dispenser may include an array of fluid delivery assemblies. Each fluid delivery assembly may include orifices through which fluid is to be ejected and slots. Each slot extends to a respective one of the orifices. The slots have different geometric shapes.

公开(公告)号：US20190118535A1

公开(公告)日：2019-04-25

申请号：US16226904

申请日：2018-12-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J. Choy ,  Devin Mourey ,  Eric L. Nikkel

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155

Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

公开(公告)号：US10189257B2

公开(公告)日：2019-01-29

申请号：US15897625

申请日：2018-02-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J. Choy ,  Rhonda Lynn Wilson

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/145 ,  B41J2/175 ,  B41J2/155

Abstract: In one example, a print bar structure includes a beam having two flanges connected by a web and a planar surface along a longitudinal edge of each flange, a printhead mounting structure attached to the beam along the planar surfaces to mount a printhead, and a fluid flow structure positioned between the flanges to carry printing fluid to the printhead mounting structure.

公开(公告)号：US10029467B2

公开(公告)日：2018-07-24

申请号：US14770608

申请日：2013-09-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J. Choy ,  Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

IPC: B41J2/16 ,  B41J2/14

Abstract: In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.

公开(公告)号：US20180201017A1

公开(公告)日：2018-07-19

申请号：US15918411

申请日：2018-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Gary G. Lutnesky ,  Silam J. Choy

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/155 ,  B41J2/165

CPC classification number: B41J2/1433 ,  B41J2/155 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2/16535 ,  B41J2002/14491 ,  B41J2202/11 ,  B41J2202/19 ,  B41J2202/20

Abstract: In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.

公开(公告)号：US09707753B2

公开(公告)日：2017-07-18

申请号：US14771008

申请日：2013-06-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/14

CPC classification number: B41J2/155 ,  B41J2/14 ,  B41J2/1404 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/145 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1637 ,  B41J25/34 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In one example, a printhead die includes a structure having a thickness 100 μm or less and a ratio of length to width of at least 50 and containing, within its thickness, multiple fluid ejectors and multiple fluid chambers each near an ejector and each having an inlet through which printing fluid may enter the chamber and an outlet through which printing fluid may be ejected from the chamber.