公开(公告)号：US20160218039A1

公开(公告)日：2016-07-28

申请号：US15002009

申请日：2016-01-20

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg ,  Claus von Waechter ,  Michael Bauer ,  Holger Doepke ,  Dominic Maier ,  Daniel Porwol ,  Tobias Schmidt

IPC: H01L21/78 ,  H05K3/00 ,  H01L21/683

CPC classification number: H01L21/78 ,  B32B37/26 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/562 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H05K3/007 ,  Y10S156/93 ,  Y10S156/941

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

Abstract translation: 一种用于处理产品基板的方法包括将载体接合到产品基板。 将一层永久性粘合剂施加到载体的表面上。 提供了结构化的中间层。 施加的永久性粘合剂将载体粘合到产品基材上。 结构化中间层布置在产品基板和载体之间。 结构化中间层的表面和永久性粘合剂的表面直接接触产品基材的表面。 结构化中间层降低了产品基板和载体之间的结合强度。

公开(公告)号：US10332814B2

公开(公告)日：2019-06-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L23/31

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

公开(公告)号：US10056295B2

公开(公告)日：2018-08-21

申请号：US15002009

申请日：2016-01-20

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg ,  Claus von Waechter ,  Michael Bauer ,  Holger Doepke ,  Dominic Maier ,  Daniel Porwol ,  Tobias Schmidt

IPC: H01L21/78 ,  H01L21/683 ,  B32B37/26 ,  H01L21/56 ,  H01L23/00 ,  H05K3/00

CPC classification number: H01L21/78 ,  B32B37/26 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/562 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H05K3/007 ,  Y10S156/93 ,  Y10S156/941

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

公开(公告)号：US20180226276A1

公开(公告)日：2018-08-09

申请号：US15944306

申请日：2018-04-03

Applicant: Infineon Technologies AG

Inventor： Daniel Porwol ,  Edward Fuergut

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/566 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method for fabricating a semiconductor chip is disclosed. In an embodiment, the method includes providing a plurality of semiconductor chips, wherein each semiconductor chip comprises a first main face, a second main face opposite to the first main face and side faces connecting the first and second main faces, placing the semiconductor chips on a carrier with the second main faces facing the carrier and applying an encapsulation material by transfer molding thereby forming the semiconductor chip panel, wherein the encapsulation material is applied so that the side faces of the semiconductor chips are covered with the encapsulation material while the first main faces are not.

公开(公告)号：US20160379847A1

公开(公告)日：2016-12-29

申请号：US15261354

申请日：2016-09-09

Applicant: Infineon Technologies AG

Inventor： Daniel Porwol ,  Edward Fuergut

IPC: H01L21/56

CPC classification number: H01L21/566 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method for fabricating a semiconductor chip is disclosed. In an embodiment, the method includes providing a carrier, providing a plurality of semiconductor chips, the semiconductor chips each including a first main face and a second main face opposite to the first main face and side faces connecting the first and second main faces, placing the semiconductor chips on the carrier with the second main faces facing the carrier, and applying an encapsulation material to the side faces of the semiconductor chips.

Abstract translation: 公开了一种制造半导体芯片的方法。 在一个实施例中，该方法包括提供载体，提供多个半导体芯片，所述半导体芯片各自包括第一主面和与第一主面相对的第二主面以及连接第一和第二主面的侧面， 载体上的半导体芯片，其中第二主面面向载体，并且向半导体芯片的侧面施加封装材料。

公开(公告)号：US09455160B2

公开(公告)日：2016-09-27

申请号：US13741113

申请日：2013-01-14

Applicant: Infineon Technologies AG

Inventor： Daniel Porwol ,  Edward Fuergut

IPC: H01L23/34 ,  H01L21/56 ,  H01L23/28 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/566 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

Abstract: The method comprises providing a carrier, providing a plurality of semiconductor chips, the semiconductor chips each comprising a first main face and a second main face opposite to the first main face and side faces connecting the first and second main faces, placing the semiconductor chips on the carrier with the second main faces facing the carrier, and applying an encapsulation material to the side faces of the semiconductor chips.

Abstract translation: 该方法包括提供载体，提供多个半导体芯片，所述半导体芯片各自包括第一主面和与第一主面相对的第二主面以及连接第一和第二主面的侧面，将半导体芯片放置在 载体，其中第二主面面向载体，并且将包封材料施加到半导体芯片的侧面。