公开(公告)号：US5285512A

公开(公告)日：1994-02-08

申请号：US903278

申请日：1992-06-24

申请人： Michael P. Duncan ,  Norris E. Lewis ,  Michael B. Miller ,  Robert T. Rogers, Sr.

发明人： Michael P. Duncan ,  Norris E. Lewis ,  Michael B. Miller ,  Robert T. Rogers, Sr.

IPC分类号： G02B6/38 ,  G02B6/42 ,  H04B10/24 ,  G02B6/00 ,  G02B6/36

CPC分类号： H04B10/40 ,  G02B6/4246 ,  G02B6/3845

摘要： A hybrid fiber optic transceiver is described which includes a transmitter for converting electrical data signals to corresponding light energy, a receiver for converting optical data signals back to electrical data signals and a clock recovery mechanism to maintain the electrical data signals outputs from the receiver in their proper order. The transceiver includes an optical splitter or coupler that allows light signals to be transmitted and received over a single fiber. The opto-electrical hybrid circuitry of the transceiver and the fiber optic coupler are enclosed in a small light weight package which is hermetically sealed.

摘要翻译： 描述了一种混合光纤收发器，其包括用于将电数据信号转换为相应的光能的发射器，用于将光学数据信号转换回电数据信号的接收器和用于将来自接收器的电气数据信号输出维持在其中的时钟恢复机制 正确的顺序 收发器包括允许光信号通过单个光纤传输和接收的光分路器或耦合器。 收发器和光纤耦合器的光电混合电路封装在密封密封的小型重量轻的封装中。

公开(公告)号：US4978567A

公开(公告)日：1990-12-18

申请号：US175707

申请日：1988-03-31

申请人： Michael B. Miller

发明人： Michael B. Miller

IPC分类号： H01L21/683 ,  C23C14/50 ,  C23C16/01 ,  C23C16/04 ,  C23C16/32 ,  C23C16/458 ,  H01L21/205 ,  H01L21/31

CPC分类号： C23C16/4581 ,  C23C14/50 ,  C23C16/01 ,  C23C16/042 ,  C23C16/325 ,  Y10S117/90 ,  Y10T428/131 ,  Y10T428/21 ,  Y10T428/24488 ,  Y10T428/24562 ,  Y10T428/24628 ,  Y10T428/24653 ,  Y10T428/30

摘要： A semiconductor wafer holding and support fixture having a low effective thermal mass comprises a planar surface having a recess for a wafer and consisting essentially of chemical vapor deposited silicon carbide. The wafer holder is specifically designed to isolate the wafer from regions of significant thermal mass of the holder. The wafer holder is particularly adapted for accomplishing chemical reactions in rapid thermal processing equipment in the fabrication of electronic integrated circuits. The method for making such an article comprises shaping a substrate, e.g. graphite, to provide a planar surface having a recess installing means for masking any regions of the substrate where silicon carbide is not desired, chemically vapor depositing a conformal outer coating of silicon carbide onto the substrate, removing the means for masking and removing the graphite by machining, drilling, grit-blasting, dissolving and/or burning.

公开(公告)号：US4861533A

公开(公告)日：1989-08-29

申请号：US121203

申请日：1987-11-18

申请人： Robert Bertin ,  Michael B. Miller ,  Burl M. Moon ,  Robert C. Post

发明人： Robert Bertin ,  Michael B. Miller ,  Burl M. Moon ,  Robert C. Post

IPC分类号： B23K20/00 ,  C23C16/01

CPC分类号： H01L24/85 ,  B23K20/007 ,  C23C16/01 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042

摘要： A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.

摘要翻译： 一种用于球形焊接工具的毛细管，用于将金属引线与微芯片上的焊盘和芯片支架上的焊盘或引线结合，通过化学气相沉积具有高电阻率的基本平滑的碳化硅涂层到基板上 通过蚀刻或燃烧除去。