-
公开(公告)号:US3964937A
公开(公告)日:1976-06-22
申请号:US534698
申请日:1974-12-20
CPC分类号: C23C16/34 , C23C16/32 , C23C28/04 , C23C28/044 , Y10S428/926 , Y10T428/12549 , Y10T428/265
摘要: Disclosed is a composite coating for wear surfaces comprising a layer of vapor deposited titanium nitride overlying a layer of titanium carbide. The composite coating is formed by successive chemical vapor depositions of titanium carbide and titanium nitride on a heated substrate.
摘要翻译: 公开了一种用于磨损表面的复合涂层,其包括覆盖在碳化钛层上的气相沉积氮化钛层。 复合涂层通过在加热的基底上连续化学气相沉积碳化钛和氮化钛而形成。
-
公开(公告)号:US4823736A
公开(公告)日:1989-04-25
申请号:US801978
申请日:1985-11-26
申请人: Robert C. Post , Kevin N. Bordelon , Burl M. Moon
发明人: Robert C. Post , Kevin N. Bordelon , Burl M. Moon
CPC分类号: C30B25/12
摘要: A multipiece susceptor assembly that includes a generally flat polyhedron shaped top and bottom defining a plurality of facets on which panels are secured for supporting wafers to be processed. Various embodiments are disclosed including a top plate that receives a slide. The polyhedron shape portion further includes a multifaced side which includes an open side face that receives a single face mounted on the slide. A bottom plate is provided that fits within the bottom frame. The single side face structure to mount on the slide and the bottom frame prevents displacement of the slide and holds the slide against the frame during rotation of the susceptor. In another embodiment each individual panel is secured to the top plate by a hanger on the panel inserted in a cavity on the top plate while the panel is secured to the bottom plate in a locking relation by a notch in the panel interfitting with a triangular tab extending outward from the bottom plate. A back draft on the tab secures the panel against outward movement. The individual panels are likewise joined together by a tongue and groove interfitting such that when assembled the panels collectively form on enclosure that protects the interior against entry of gases and light from the surrounding process environment.
摘要翻译: 一种多体基座组件,其包括大致平坦的多面体形状的顶部和底部,其限定多个小平面,面板固定在多个小面上,用于支撑要处理的晶片。 公开了包括接收滑块的顶板的各种实施例。 多面体形状部分还包括多面侧,其包括容纳安装在载玻片上的单面的开放侧面。 设置有底板,该底板装配在底架内。 安装在滑块和底架上的单个侧面结构可防止滑块的移动,并且在基座旋转期间将滑块保持在框架上。 在另一个实施例中,每个单独的面板通过插入顶板中的空腔中的面板上的悬挂器固定到顶板,同时面板通过与三角形接片相互配合的面板中的凹口以锁定关系固定到底板 从底板向外延伸。 标签上的后退草稿可确保面板不会向外移动。 单个面板同样通过舌和槽相互连接在一起,使得当组装时,面板共同形成在外壳上,保护内部免受来自周围工艺环境的气体和光的侵入。
-
公开(公告)号:US4861533A
公开(公告)日:1989-08-29
申请号:US121203
申请日:1987-11-18
申请人: Robert Bertin , Michael B. Miller , Burl M. Moon , Robert C. Post
发明人: Robert Bertin , Michael B. Miller , Burl M. Moon , Robert C. Post
CPC分类号: H01L24/85 , B23K20/007 , C23C16/01 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/78301 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042
摘要: A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.
摘要翻译: 一种用于球形焊接工具的毛细管,用于将金属引线与微芯片上的焊盘和芯片支架上的焊盘或引线结合,通过化学气相沉积具有高电阻率的基本平滑的碳化硅涂层到基板上 通过蚀刻或燃烧除去。
-
公开(公告)号:US4772498A
公开(公告)日:1988-09-20
申请号:US933007
申请日:1986-11-20
申请人: Robert Bertin , Michael B. Miller , Burl M. Moon , Robert C. Post
发明人: Robert Bertin , Michael B. Miller , Burl M. Moon , Robert C. Post
CPC分类号: H01L24/85 , B23K20/007 , C23C16/01 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85203 , H01L2224/85205 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19042 , Y10T428/131
摘要: A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.
摘要翻译: 一种用于球形焊接工具的毛细管,用于将金属引线与微芯片上的焊盘和芯片支架上的焊盘或引线结合,通过化学气相沉积具有高电阻率的基本平滑的碳化硅涂层到基板上 通过蚀刻或燃烧除去。
-
-
-