公开(公告)号：US06688914B1

公开(公告)日：2004-02-10

申请号：US10236614

申请日：2002-09-06

申请人： Leonard K. Espenshade ,  Kevin E. Walker

发明人： Leonard K. Espenshade ,  Kevin E. Walker

IPC分类号： H01R1360

CPC分类号： H01R13/6658 ,  H01R13/6641 ,  H01R13/7175 ,  H01R24/62

摘要： An electrical connector assembly (1) includes an insulative main housing (2) defining an upper cavity (21), a contact module (3) received in the upper cavity, and an electronic module (6) electrically connecting with the contact module for transmitting signals and eliminating undesirable noises. A pair of posts (26) projects from the main housing. The electronic module includes a receptacle portion (61). A pair of cutouts (613) are defined in the receptacle portion corresponding to and engaging with the post of the main housing, thereby mounting the electronic module on the main housing.

摘要翻译： 电连接器组件（1）包括限定上空腔（21）的绝缘主壳体（2），容纳在上空腔中的接触模块（3）和与触头模块电连接以便传输的电子模块 信号并消除不必要的噪音。 一个主楼（26）的项目。 电子模块包括插座部分（61）。 一对切口（613）被限定在与主壳体的柱对应并与其接合的插座部分中，从而将电子模块安装在主壳体上。

公开(公告)号：US06663437B2

公开(公告)日：2003-12-16

申请号：US10247460

申请日：2002-09-18

申请人： Iosif R. Korsunsky ,  Kevin E. Walker ,  James H. Hyland

发明人： Iosif R. Korsunsky ,  Kevin E. Walker ,  James H. Hyland

IPC分类号： H01R2400

CPC分类号： H01R13/6658 ,  H01R13/514 ,  H01R13/6466 ,  H01R13/6633 ,  H01R13/719 ,  H01R24/64 ,  Y10S439/941

摘要： A modular jack assembly (1) includes an insulating housing (2) and an electrical subassembly (3) disposed within the housing. The electrical subassembly includes first and second contact array assemblies (32, 34) each having a PCB (320, 340) and a number of contacts (322, 342) attached on the PCB, front and rear magnetic modules (300, 300′) respectively connected with the first and second PCBs, and a third PCB (36) containing signal conditioning components. The front and rear magnetic modules have upper pins (304, 304′), lower pins (306, 306′) for soldering to a mother board and magnetic coils (31, 31′) connecting with the upper and lower pins. The magnetic modules are electrically connecting with the first and second contacts via some of the upper pins thereof. The others of the upper pins of the magnetic modules are electrically connected to the signal conditioning components on the third PCB.

摘要翻译： 模块化插座组件（1）包括设置在壳体内的绝缘壳体（2）和电子组件（3）。 电子组件包括第一和第二接触阵列组件（32,34），每个具有连接在PCB上的PCB（320,340）和多个触点（322,342），前后磁性模块（300,300'） 分别与第一和第二PCB连接，以及包含信号调节部件的第三PCB（36）。 前后磁性模块具有用于焊接到母板的上销（304,304'），下销（306,306'）和与上销和下销连接的电磁线圈（31,31'）。 磁性模块通过其一些上部引脚与第一和第二触点电连接。 磁性模块的上部引脚中的其他引脚电连接到第三个PCB上的信号调节部件。

公开(公告)号：US06638112B1

公开(公告)日：2003-10-28

申请号：US10280218

申请日：2002-10-24

申请人： Kevin E. Walker ,  Iosif R. Korsunsky ,  James H. Hyland

发明人： Kevin E. Walker ,  Iosif R. Korsunsky ,  James H. Hyland

IPC分类号： H01R1366

CPC分类号： H05K1/145 ,  H01R13/6658 ,  H01R13/717 ,  H01R13/7175 ,  H01R24/64

摘要： A modular jack (100) in accordance with the present invention includes an insulative housing (1) defining a cavity for receiving a plug connector, a conductive shield (2) substantially surrounding the insulative housing and a module assembly (10) installed in the cavity of the insulative housing. The module assembly includes a magnetic module (3), a first printed circuit board (PCB, 4), a second PCB (5), and a grounding plate (9). A contact array (6) is soldered to the first PCB. The first PCB is attached on a bottom wall (312) of the magnetic module. The second PCB carries capacitors and resistors and a pair of light emitting diodes (LEDs 501, 502) soldered on a front portion thereof. The second PCB is attached on a top wall (311) of the magnetic module. The magnetic module defines a passageway (38) and the grounding plate has a flat portion (90) received therein.

摘要翻译： 根据本发明的模块化插座（100）包括限定用于接收插头连接器的空腔的绝缘壳体（1），基本上围绕绝缘壳体的导电屏蔽（2）和安装在腔体中的模块组件（10） 的绝缘房屋。 模块组件包括磁性模块（3），第一印刷电路板（PCB，4），第二PCB（5）和接地板（9）。 接触阵列（6）焊接到第一PCB。 第一PCB被附接在磁性模块的底壁（312）上。 第二PCB承载电容器和电阻器以及在其前部焊接的一对发光二极管（LED 501,502）。 第二PCB连接在磁性模块的顶壁（311）上。 磁性模块限定通道（38），并且接地板具有容纳在其中的平坦部分（90）。

公开(公告)号：US06634893B1

公开(公告)日：2003-10-21

申请号：US10120003

申请日：2002-04-09

申请人： Iosif Korsunsky ,  Kevin E. Walker ,  Joanne E. Shipe ,  Tod M. Harlan ,  Wei-Chen Lee ,  Robert W. Brown ,  James H. Hyland

发明人： Iosif Korsunsky ,  Kevin E. Walker ,  Joanne E. Shipe ,  Tod M. Harlan ,  Wei-Chen Lee ,  Robert W. Brown ,  James H. Hyland

IPC分类号： H01R1200

CPC分类号： H05K3/308 ,  H01R12/7017

摘要： An electrical connector (1) includes an insulative housing (10) and a number of contacts (28) attached to the housing. The contacts each have a contact tail (36) downwardly extending beyond a mounting surface (32) of the insulative housing for inserting into throughholes (42) of a PCB (40). The contact tails are overlapped in pairs and each pair of contact tails is inserted into the same throughhole of the PCB. Some pairs of contact tails, called retention contact tails (68), have protrusions (52) deviating from each other for bearing against peripheral walls of the throughholes of the PCB thereby producing retention force. The other pairs of contact tails, called non-retention contact tails (70), do not have protrusions and do not interfere with peripheral walls of the other throughholes thereby reducing the insertion force. The retention contact tails can be modified to the non-retention contact tails by severing the protrusions therefrom.

摘要翻译： 电连接器（1）包括绝缘壳体（10）和连接到壳体的多个触点（28）。 这些触点各自具有向下延伸超过绝缘壳体的安装表面（32）的接触尾部（36），用于插入到PCB（40）的通孔（42）中。 接触尾部成对重叠，每对接触尾部插入到PCB的同一个通孔中。 称为保持接触尾部（68）的一对接触尾部具有彼此偏离的突出部（52），用于支承PCB的通孔的周壁，从而产生保持力。 称为非保持接触尾部（70）的另一对接触尾部没有突起，并且不干扰其它通孔的周壁，从而减小插入力。 可以通过从其中切断突起来将保持接触尾部修改为非保持接触尾部。

公开(公告)号：US06612859B2

公开(公告)日：2003-09-02

申请号：US10161359

申请日：2002-06-03

申请人： Michael Anthony Yeomans ,  Kevin E. Walker

发明人： Michael Anthony Yeomans ,  Kevin E. Walker

IPC分类号： H01R13627

CPC分类号： H01R13/6583 ,  H01R13/6275 ,  Y10S439/906

摘要： A connector assembly is provided comprising a conductive upper shell having a top, sides, a front face and a back wall. A conductive lower shell is provided having sides, a bottom, a front face and a rear wall. The sides of the lower shell include recesses formed in edges thereof. Flanges are provided on the sides of the upper shell. The flanges have tabs extending downward therefrom. The tabs are received in the recesses in the edges of the sides of the lower shell when the upper and lower shells are joined. The recesses hold the flanges against the sides of the upper shell. A connector assembly is provided comprising an upper shell having a top, sides, a front face and a back wall. A lower shell has sides, a bottom, a front face and a back wall, wherein the front face of one of the upper and lower shells includes a pin and the front face of another of the upper and lower shells includes a cross member. The pin is held by the cross member to retain the front faces of the upper and lower shells joined with one another. The shells enclose a printed circuit board with an exposed end for connection to a mating connector.

摘要翻译： 提供一种连接器组件，包括具有顶部，侧面，前表面和后壁的导电上壳体。 导电的下壳体具有侧面，底部，前表面和后壁。 下壳的侧面包括在其边缘形成的凹部。 法兰在上壳体的两侧设置。 凸缘具有从其向下延伸的凸片。 当上壳体和下壳体接合时，突片被接收在下壳体的侧面的边缘的凹部中。 凹槽将凸缘保持抵靠上壳体的侧面。 提供一种连接器组件，包括具有顶部，侧面，前表面和后壁的上壳体。 下壳具有侧面，底部，前表面和后壁，其中上壳体和下壳体中的一个的前表面包括销，并且上壳体和下壳体中的另一个的前表面包括横向构件。 该销由横梁保持，以保持彼此连接的上壳和下壳的前表面。 壳体封装具有暴露端的印刷电路板，用于连接到配合连接器。

公开(公告)号：US5330359A

公开(公告)日：1994-07-19

申请号：US038738

申请日：1993-03-26

申请人： Kevin E. Walker

发明人： Kevin E. Walker

IPC分类号： H01L23/32 ,  H01R4/02 ,  H01R12/04 ,  H01R13/11 ,  H01R13/24 ,  H01R33/92 ,  H05K7/02 ,  H05K7/10 ,  H01R9/09

CPC分类号： H05K7/023 ,  H05K7/1023 ,  H01L2924/0002 ,  H01R13/24 ,  H01R4/02

摘要： A socket supports a plurality of integrated circuit chips in a vertical stack and interconnects the chips to circuit traces on a substrate. The socket includes a dielectric base having a top surface and a bottom surface. The base holds a plurality of electrical contacts. Each of the contacts has a foot portion which extends below the bottom surface for electrical connection with one of the traces, and a main body portion which extends above the top surface for electrical connection with respective electrical leads extending from the chips. Each of the main body portions has a solder coating on one side. The contacts are arranged such that the solder coated sides abut their respective leads, and the contacts are electrically connectable with the leads by reflow of the solder coating.

摘要翻译： 插座支撑垂直堆叠中的多个集成电路芯片，并将芯片与衬底上的电路迹线互连。 插座包括具有顶表面和底表面的电介质基底。 基座保持多个电触点。 每个触头具有在底表面下方延伸的脚部，用于与其中一个迹线电连接;以及主体部分，其在顶表面上方延伸，用于与从芯片延伸的各个电引线电连接。 每个主体部分在一侧具有焊料涂层。 触头被布置成使得焊料涂覆的侧面邻接它们各自的引线，并且触点通过焊料涂层的回流与引线电连接。

公开(公告)号：US5066245A

公开(公告)日：1991-11-19

申请号：US611247

申请日：1990-11-09

申请人： Kevin E. Walker

发明人： Kevin E. Walker

IPC分类号： H01R13/46 ,  H01L21/673 ,  H01R33/76 ,  H01R33/97 ,  H05K7/10

CPC分类号： H05K7/1023

摘要： A retention device (10) for retaining a bumperless plastic quad flat pack (80) in a socket cover (12) is disclosed. The device (10) includes an engaging member (54) at the end of a resilient arm (50) and which has a slanted surface (66) which engages a slanted surface (94) of a reverse orientation on the flat pack (80) to urge it in a direction against the restraining force of the leads (104) of the pack (80), which are received in slots (32) in the cover side walls (26).

公开(公告)号：US5022869A

公开(公告)日：1991-06-11

申请号：US431794

申请日：1989-11-06

申请人： Kevin E. Walker

发明人： Kevin E. Walker

IPC分类号： H05K7/10

CPC分类号： H05K7/1023

摘要： Chip carrier sockets have terminals provided therein for receipt of chip carriers which have leads extending therefrom. The chip carrier sockets have covers which are provided with resilient retention arms, the resilient retention arms cooperate with the chip carriers to retain the chip carriers in the cover. However, with various chip carriers, no structure is provided to cooperate with the resilient retention means of the cover. Therefore, an adapter is provided to cooperate with the chip carrier, to insure that the chip carrier is accurately inserted and maintained in the cover of the chip carrier socket. The adapter has projections which extend from the corners of the frame, the projections dimensioned to be received in the retention arms of the cover to insure that the adapter is maintained in position.

摘要翻译： 芯片载体插座具有用于接收具有从其延伸的引线的芯片载体的端子。 芯片载体插座具有设置有弹性保持臂的盖，弹性保持臂与芯片载体配合以将芯片载体保持在盖中。 然而，对于各种芯片载体，没有提供与盖的弹性保持装置配合的结构。 因此，提供适配器以与芯片载体协作，以确保芯片载体被精确地插入并保持在芯片载体插座的盖中。 适配器具有从框架的角部延伸的突起，突出部的尺寸设计成被容纳在盖的保持臂中，以确保适配器保持在适当位置。

公开(公告)号：US07896559B2

公开(公告)日：2011-03-01

申请号：US12317653

申请日：2008-12-23

申请人： Chong Yi ,  Kevin E. Walker ,  Pei Tsao ,  Stephen Sedio

发明人： Chong Yi ,  Kevin E. Walker ,  Pei Tsao ,  Stephen Sedio

IPC分类号： G02B6/38 ,  G02B6/30 ,  H01R33/00

CPC分类号： G02B6/3817 ,  G02B6/32 ,  G02B6/3821 ,  G02B6/3885 ,  H01R9/034 ,  H01R13/502 ,  H01R13/6315 ,  H01R13/6471 ,  H01R13/6593

摘要： A cable assembly (100) includes an insulative housing (2) having a base portion (21) and a tongue portion (22) extending forwardly therefrom, at least a mounting cavity (2212) and a curved slot (2213) defined in a low section of the insulated housing, said curved slot located behind and communicated to the mounting cavity; a plurality of contacts (4) supported by the base portion, each contact having a mating portion arranged proximate to the top side of the tongue portion, and a tail portion extending beyond a back surface of the base portion; an optical module (6) accommodated in the mounting cavity and a spring member (63) arranged between the optical module and a back side of the mounting cavity; an optical fiber (53) extending through the curved slot and connected to the optical module; and a metal shell (8) having a mating frame enclosing the tongue portion and the optical module therein.

摘要翻译： 电缆组件（100）包括具有基部（21）和从其向前延伸的舌部（22）的绝缘壳体（2），至少一个安装腔（2212）和弯曲狭槽（2213） 所述弯曲槽位于所述绝缘壳体的后面并且连通到所述安装腔; 由所述基部支撑的多个触点（4），每个触点具有靠近所述舌部的顶侧布置的匹配部分，以及延伸超过所述基部的后表面的尾部; 容纳在所述安装腔中的光学模块（6）和布置在所述光学模块和所述安装腔的后侧之间的弹簧构件（63） 延伸穿过弯曲槽并连接到光学模块的光纤（53）; 以及金属壳（8），其具有围绕所述舌部的配合框架和所述光学模块。

公开(公告)号：US07658621B2

公开(公告)日：2010-02-09

申请号：US12148273

申请日：2008-04-17

申请人： Robert W. Brown ,  Tod M. Harlan ,  Kevin E. Walker ,  Terrance F. Little

发明人： Robert W. Brown ,  Tod M. Harlan ,  Kevin E. Walker ,  Terrance F. Little

IPC分类号： H01R12/00

CPC分类号： H01R12/52 ,  H01R12/7047 ,  H05K1/141 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/2018

摘要： A connector assembly (100) includes a mother board (12), a mother receptacle (11), a daughter board (22), a daughter receptacle (21), and a connecting device (30) mounted between said two boards. The connecting device includes a shroud (31), a pair of standoffs (32) mounted at opposite sides of the shroud and engageable with the two boards, and an extender (33) positioned alongside the shroud and between the pair of standoffs. The extender defines a lower interface (332) mating with the mother receptacle and an upper interface (331) mating with the daughter receptacle.

摘要翻译： 连接器组件（100）包括母板（12），母插座（11），子板（22），子插座（21）和安装在所述两个板之间的连接装置（30）。 连接装置包括护罩（31），安装在护罩的相对侧并可与两个板卡合的一对支座（32），以及沿护罩并位于该对支座之间的延伸器（33）。 扩展器限定与母插座配合的下界面（332）和与子插座配合的上接口（331）。