摘要:
The invention is embodied in a method of operating a plasma etch reactor, consisting of introducing a gas into the reactor which disassociates as a plasma into an etch species which etches oxide films on a work piece in the reactor and a non-etching species combinable with the etch species into an etch-preventing polymer condensable onto the work piece below a characteristic deposition temperature, providing an interior wall comprising a material which scavenges the etching species, and maintaining a temperature of the interior wall above the deposition temperature.
摘要:
The invention is embodied in a method of operating a plasma etch reactor, consisting of introducing a gas into the reactor which disassociates as a plasma into an etch species which etches oxide films on a work piece in the reactor and a non-etching species combinable with the etch species into an etch-preventing polymer condensable onto the work piece below a characteristic deposition temperature, providing an interior wall comprising a material which scavenges the etching species, and maintaining a temperature of the interior wall above the deposition temperature.
摘要:
The invention is embodied in a method of operating a plasma etch reactor, consisting of introducing a gas into the reactor which disassociates as a plasma into an etch species which etches oxide films on a work piece in the reactor and a non-etching species combinable with the etch species into an etch-preventing polymer condensable onto the work piece below a characteristic deposition temperature, providing an interior wall comprising a material which scavenges the etching species, and maintaining a temperature of the interior wall above the deposition temperature.
摘要:
A process for etching titanium nitride on a substrate 20 is described. In the process, a substrate 20 having a titanium nitride layer 24c thereon, and an insulative oxide layer 26 on the titanium nitride layer 24c is placed in a process chamber 42. Either a single stage, or a multiple stage version, of the process is then effected to etch the insulative oxide and titanium nitride layers. In the single stage version, the insulative oxide layer 26 and titanium nitride layer 24c are etched in a single stage, by introducing an etchant gas comprising carbon-fluoride gas and carbon-oxide gas into the process chamber 42, and generating a plasma from the etchant gas. The multiple stage version, comprises a first stage in which the insulative oxide layer 26 is etched using a plasma generated from carbon-fluoride gas, and a second stage in which the titanium nitride layer 24c is etched using a plasma generated from an etchant gas comprising carbon-fluoride gas and carbon-oxide gas. Suitable carbon-fluoride gases comprise CF.sub.3, CF.sub.4 , CH.sub.3 F, CHF.sub.3, C.sub.2 F.sub.6, C.sub.3 F.sub.8, C.sub.4 F.sub.8 or C.sub.4 F.sub.10, and suitable carbon-oxide gases comprise CO or CO.sub.2.
摘要翻译:对基板20上的氮化钛进行蚀刻的工序进行说明。 在该过程中,其上具有氮化钛层24c的衬底20和氮化钛层24c上的绝缘氧化物层26被放置在处理室42中。过程的单级或多级版本是 然后实现蚀刻绝缘氧化物和氮化钛层。 在单级版本中,通过将包含氟化碳气体和碳氧化物气体的蚀刻剂气体引入到处理室42中,在一个阶段中对绝缘氧化物层26和氮化钛层24c进行蚀刻,并从 蚀刻剂气体。 多级版本包括第一阶段,其中使用由氟化碳气体产生的等离子体来蚀刻绝缘氧化物层26;以及第二阶段,其中使用由蚀刻剂气体产生的等离子体蚀刻氮化钛层24c,第二阶段包括 碳氟化物气体和碳氧化物气体。 合适的碳氟化物气体包括CF 3,CF 4,CH 3 F,CHF 3,C 2 F 6,C 3 F 8,C 4 F 8或C 4 F 10,合适的碳氧化物气体包括CO或CO 2。
摘要:
In an apparatus for producing an electromagnetically coupled planar plasma comprising a chamber having a dielectric shield in a wall thereof and a planar coil outside of said chamber and adjacent to said window coupled to a radio frequency source, the improvement whereby a scavenger for fluorine is mounted in or added to said chamber. When a silicon oxide is etched with a plasma of a fluorohydrocarbon gas, the fluorine scavenger reduces the free fluorine radicals, thereby improving the selectivity and anisotropy of etching and improving the etch rate while reducing particle formation.
摘要:
In an apparatus for producing an electromagnetically coupled planar plasma comprising a chamber having a dielectric shield in a wall thereof and a planar coil outside of said chamber and adjacent to said window coupled to a radio frequency source, the improvement whereby a scavenger for fluorine is mounted in or added to said chamber. When a silicon oxide is etched with a plasma of a fluorohydrocarbon gas, the fluorine scavenger reduces the free fluorine radicals, thereby improving the selectivity and anisotropy of etching and improving the etch rate while reducing particle formation.
摘要:
In an apparatus for producing an electromagnetically coupled planar plasma comprising a chamber having a dielectric shield in a wall thereof and a planar coil outside of said chamber and adjacent to said window coupled to a radio frequency source, the improvement whereby a scavenger for fluorine is mounted in or added to said chamber. When a silicon oxide is etched with a plasma of a fluorohydrocarbon gas, the fluorine scavenger reduces the free fluorine radicals, thereby improving the selectivity and anisotropy of etching and improving the etch rate while reducing particle formation.
摘要:
The system generates a heat index for each player in a sporting event. Historical data is maintained over time and is available for display by a user. In one embodiment, the heat index is provided via a network such as the internet. In another embodiment, the heat index is displayed as part of an event or game broadcast. The heat index represents the current level of performance of a player pursuant to a calculation algorithm that includes objective and subjective information. The objective information includes statistical data from a game or contest. The subjective information may include references from announcers and input from viewers.
摘要:
A method for forming features in an etch layer is provided. A first mask is formed over the etch layer wherein the first mask defines a plurality of spaces with widths. A sidewall layer is formed over the first mask. Features are etched into the etch layer through the sidewall layer, wherein the features have widths that are smaller than the widths of the spaces defined by the first mask. The mask and sidewall layer are removed. An additional mask is formed over the etch layer wherein the additional mask defines a plurality of spaces with widths. A sidewall layer is formed over the additional mask. Features are etched into the etch layer through the sidewall layer, wherein the widths that are smaller than the widths of the spaces defined by the first mask. The mask and sidewall layer are removed.