公开(公告)号：US20230178686A1

公开(公告)日：2023-06-08

申请号：US17925152

申请日：2020-05-14

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI ,  Byungjoon RHEE ,  Kyuhyun BANG ,  Kyoungtae WI

IPC: H01L33/22 ,  H01L33/38 ,  H01L33/00

CPC classification number: H01L33/22 ,  H01L33/0008 ,  H01L33/38 ,  H01L27/15

Abstract: Discussed is a semiconductor light emitting device that can include a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer, a first pad electrode electrically connected to the first conductivity type semiconductor layer, a second pad electrode electrically connected to the second conductivity type semiconductor layer, a first pattern structure disposed on the first pad electrode, and a second pattern structure disposed on the second pad electrode, wherein the first pattern structure comprises a first metal pattern structure disposed on the first pad electrode, a first adhesive material disposed on the first metal pattern structure, and a first conductive particle disposed in the first metal pattern structure.

公开(公告)号：US20220416127A1

公开(公告)日：2022-12-29

申请号：US17780202

申请日：2020-01-23

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI ,  Yonghan LEE ,  Taehoon KIM

IPC: H01L33/38 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00

Abstract: The present invention relates to a display apparatus and a method for manufacturing same and, particularly, to a display apparatus using a semiconductor light emitting device having a size of several μm to dozens of μm. The present invention provides a display apparatus comprising: a substrate; a wiring electrode disposed on the substrate; multiple semiconductor light emitting devices electrically connected to the wiring electrode; multiple conductive particles arranged between the wiring electrode and the semiconductor light emitting devices; and a bonding layer disposed on the semiconductor light emitting devices to allow the multiple conductive particles to be fixed to the semiconductor light emitting devices, wherein each of the multiple semiconductor light emitting devices includes multiple conductive electrodes, and the conductive particles are selectively fixed to only the surfaces of the conductive electrodes.

公开(公告)号：US20220367771A1

公开(公告)日：2022-11-17

申请号：US17623855

申请日：2019-07-19

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI ,  Kyoungtae WI

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L33/54 ,  H01L33/60

Abstract: Disclosed in the present specification is a micro LED display device, and a manufacturing method therefor, the method forming, in advance, an anisotropic conductive adhesive paste layer only on a conductive electrode part of a semiconductor light emitting element and on a peripheral part thereof, and then transferring the anisotropic conductive adhesive paste layer to a wiring substrate, thereby simultaneously performing a transfer step and a stable wiring step.

公开(公告)号：US20220238759A1

公开(公告)日：2022-07-28

申请号：US17616550

申请日：2020-02-06

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI ,  Yonghan LEE

IPC: H01L33/38 ,  H01L33/62 ,  H01L25/075

Abstract: Discussed is a display device including a substrate including a plurality of electrode lines; and a plurality of semiconductor light emitting devices disposed on the substrate and electrically connected to the plurality of electrode lines; wherein each of the plurality of semiconductor light emitting devices includes: a first conductive semiconductor layer; a plurality of second conductive semiconductor layers formed on the first conductive semiconductor layer; and an active layer formed between the first and second conductive semiconductor layers, and wherein each of the plurality of semiconductor light emitting devices includes a plurality of active layers spaced apart from each other.

公开(公告)号：US20210391510A1

公开(公告)日：2021-12-16

申请号：US17349229

申请日：2021-06-16

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI

IPC: H01L33/50 ,  H01L27/146 ,  H01L51/52

Abstract: Disclosed herein is a transfer substrate used for manufacturing a display device using a light emitting semiconductor device. The transfer substrate include a base substrate, and a divided unit phosphor structure arranged on the base substrate and transferred onto the light emitting semiconductor device.

公开(公告)号：US20190288163A1

公开(公告)日：2019-09-19

申请号：US16465051

申请日：2017-01-31

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI ,  Yonghan LEE

IPC: H01L33/44 ,  H01L27/15 ,  H01L33/38

Abstract: The present invention relates to a display device and, particularly, to a display device using a semiconductor light emitting element. The display device according to the present invention comprises a plurality of semiconductor light emitting elements mounted on a substrate, wherein at least one of the semiconductor light emitting elements comprises: a first conductive electrode and a second conductive electrode; a first conductive semiconductor layer in which the first conductive electrode is disposed; a second conductive semiconductor layer which overlaps the first conductive semiconductor layer and in which the second conductive electrode is disposed; a first passivation layer formed to cover outer surfaces of the first conductive semiconductor layer and the second conductive semiconductor layer; and a second passivation layer formed to cover the first passivation layer and formed such that at least a portion thereof varies in thickness.

公开(公告)号：US20190252579A1

公开(公告)日：2019-08-15

申请号：US16310022

申请日：2017-03-07

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI ,  Yonghan LEE ,  Byungjoon RHEE ,  Jinhyoun JOE ,  Sungjin PARK

IPC: H01L33/50 ,  H01L33/62 ,  H01L25/075 ,  H01L33/58 ,  G02B5/20

Abstract: The present invention relates to a display device and, particularly, to a display device using a semiconductor light emitting element. The display device according to the present invention comprises: a substrate at which a wire electrode is formed; a plurality of semiconductor light emitting elements electrically connected to the wire electrode; a plurality of fluorescent material layers for converting a wavelength of light; a wavelength converting layer which has a plurality of partition wall portions formed between the plurality of fluorescent material layers and is disposed to cover the plurality of semiconductor light emitting elements; and a color filter which has a plurality of filtering portions for filtering blue, green, and red colors, and is disposed to cover the wavelength converting layer, wherein at least one of the plurality of filtering portions is configured to have a width different from those of the other filtering portions.