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公开(公告)号:US20230411575A1
公开(公告)日:2023-12-21
申请号:US18036358
申请日:2020-11-10
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae WI , Byungjoon RHEE , Hwanjoon CHOI
IPC: H01L33/62 , H01L25/075 , H01L33/38
CPC classification number: H01L33/62 , H01L25/0753 , H01L2933/0016 , H01L2933/0066 , H01L33/38
Abstract: Disclosed are a display device using a semiconductor light emitting element, and a method for manufacturing same. In order to achieve the above objective, the display device according to an embodiment of the present disclosure may comprise: a wiring substrate; wiring electrodes at least partially placed on the wiring substrate; light emitting elements each electrically connected to a wiring electrode corresponding thereto, among the wiring electrodes; adhesive patterns having an adhesive property for bonding the wiring electrodes and the light emitting elements and a transfer property required for transferring the light emitting elements to the wiring electrodes, wherein each of the adhesive patterns may be formed for at least one combined pair formed by a wiring electrode and a light emitting element electrically connected to each other, among the wiring electrodes and the light emitting elements, and the adhesive patterns are formed to be spaced apart from each other.
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2.
公开(公告)号:US20220123175A1
公开(公告)日:2022-04-21
申请号:US17257686
申请日:2018-09-27
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae WI , Byungjoon RHEE
IPC: H01L33/38 , H01L33/62 , H01L33/12 , H01L25/075
Abstract: Discussed is a display device, including a substrate, a wiring electrode disposed on the substrate, a plurality of semiconductor light-emitting elements electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the plurality of semiconductor light-emitting elements and formed of a mixture of conductive particles and an insulating material; and a buffer portion disposed on a lower surface of a semiconductor light-emitting element of the plurality of semiconductor light-emitting elements so as to allow the wiring electrode and the semiconductor light-emitting element to be spaced apart by a predetermined distance, and provided with at least one hole, wherein the mixture of the conductive particles and the insulating material is disposed inside the at least one hole, and the wiring electrode is electrically connected to the semiconductor light-emitting element through conductive particles disposed inside the at least one hole.
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3.
公开(公告)号:US20200373473A1
公开(公告)日:2020-11-26
申请号:US16965235
申请日:2018-01-29
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae WI , Sunghyun MOON , Jina JEON
Abstract: The present invention relates to a method for manufacturing a display device using semiconductor light-emitting elements and a display device. The method for manufacturing a display device according to the present invention comprises the steps of: transferring semiconductor light-emitting elements provided on a growth substrate to an adhesive layer of a temporary substrate; curing the adhesive layer of the temporary substrate; aligning the temporary substrate with a wiring substrate having a wiring electrode and a conductive adhesive layer; compressing the temporary substrate to the wiring substrate so that the semiconductor light-emitting elements bond to the wiring substrate together with the adhesive layer of the temporary substrate, and then removing the temporary substrate; and removing at least a part of the adhesive layer to expose the semiconductor light-emitting elements to the outside, and depositing electrodes on the semiconductor light-emitting elements.
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公开(公告)号:US20230178686A1
公开(公告)日:2023-06-08
申请号:US17925152
申请日:2020-05-14
Applicant: LG ELECTRONICS INC.
Inventor: Hwanjoon CHOI , Byungjoon RHEE , Kyuhyun BANG , Kyoungtae WI
CPC classification number: H01L33/22 , H01L33/0008 , H01L33/38 , H01L27/15
Abstract: Discussed is a semiconductor light emitting device that can include a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer, a first pad electrode electrically connected to the first conductivity type semiconductor layer, a second pad electrode electrically connected to the second conductivity type semiconductor layer, a first pattern structure disposed on the first pad electrode, and a second pattern structure disposed on the second pad electrode, wherein the first pattern structure comprises a first metal pattern structure disposed on the first pad electrode, a first adhesive material disposed on the first metal pattern structure, and a first conductive particle disposed in the first metal pattern structure.
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公开(公告)号:US20220367771A1
公开(公告)日:2022-11-17
申请号:US17623855
申请日:2019-07-19
Applicant: LG ELECTRONICS INC.
Inventor: Hwanjoon CHOI , Kyoungtae WI
IPC: H01L33/62 , H01L23/00 , H01L25/075 , H01L33/54 , H01L33/60
Abstract: Disclosed in the present specification is a micro LED display device, and a manufacturing method therefor, the method forming, in advance, an anisotropic conductive adhesive paste layer only on a conductive electrode part of a semiconductor light emitting element and on a peripheral part thereof, and then transferring the anisotropic conductive adhesive paste layer to a wiring substrate, thereby simultaneously performing a transfer step and a stable wiring step.
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公开(公告)号:US20240421247A1
公开(公告)日:2024-12-19
申请号:US18706613
申请日:2021-11-18
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae WI , Byungjoon RHEE
IPC: H01L33/00 , H01L25/075 , H01L33/56 , H01L33/62
Abstract: The present disclosure is applicable to a technical field related to a display device, and relates to: a display device using, for example, a micro light-emitting diode (LED); and a manufacturing method therefor. In order to accomplish the described objective, the present disclosure may comprise the steps of: preparing a growth substrate having light-emitting elements; preparing a wiring substrate having wiring electrodes; forming a first adhesive pattern on a first wiring electrode from among the wiring electrodes and/or a first light-emitting element from among the light-emitting elements; transferring the first light-emitting element onto the first wiring electrode so that the first light-emitting element from among the light-emitting elements is adhered to the first wiring electrode by means of the first adhesive pattern; forming, on a second wiring electrode adjacent to the first wiring electrode from among the wiring electrodes and/or a second light-emitting element adjacent to the first light-emitting element from among the light-emitting elements, a second adhesive pattern having a height that differs from the height of the first adhesive pattern; and transferring the second light-emitting element onto the second wiring electrode so that the second light-emitting element from among the light-emitting elements is adhered to the second wiring electrode by means of the second adhesive pattern.
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公开(公告)号:US20170170152A1
公开(公告)日:2017-06-15
申请号:US15376888
申请日:2016-12-13
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae WI , Byungjoon RHEE , Bongchu SHIM
IPC: H01L25/075 , H01L23/00 , H01L33/38 , H01L33/60 , H01L33/62
CPC classification number: H01L25/0753 , G06F1/1652 , H01L24/29 , H01L24/32 , H01L24/95 , H01L27/156 , H01L33/38 , H01L33/385 , H01L33/504 , H01L33/507 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/2929 , H01L2224/32225 , H01L2924/07811 , H01L2924/12041 , H01L2933/0091 , H05K1/189 , H05K3/323 , H05K2201/10106
Abstract: A display device including a substrate including a wiring electrode; a conductive adhesive layer including an anisotropic conductive medium, and disposed to cover the wiring electrode; and a plurality of semiconductor light emitting devices adhered to the conductive adhesive layer and electrically connected to the wiring electrode through the anisotropic conductive medium. Further, the conductive adhesive layer includes a first layer disposed on the substrate; a second layer deposited on the first layer and including the anisotropic conductive medium; and a third layer deposited on the second layer, to which the semiconductor light emitting devices are adhered. Further, at least one of the second layer and the third layer includes a white pigment configured to reflect light emitted by the semiconductor light emitting device.
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公开(公告)号:US20230117219A1
公开(公告)日:2023-04-20
申请号:US18083152
申请日:2022-12-16
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae WI , Sunghyun MOON , Jina JEON
Abstract: A display device can include a wiring substrate including a first electrode, a plurality of semiconductor light-emitting elements electrically connected to the first electrode, a conductive adhesive layer on the wiring substrate and around the plurality of semiconductor light-emitting elements, an upper layer on one surface of the conductive adhesive layer and including a plurality of through holes corresponding to the plurality of semiconductor light-emitting elements, respectively, and a second electrode on the upper layer and electrically connected to the plurality of semiconductor light-emitting elements. The upper layer can include a thermosetting adhesive.
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9.
公开(公告)号:US20230017298A1
公开(公告)日:2023-01-19
申请号:US17780909
申请日:2020-01-23
Applicant: LG ELECTRONICS INC.
Inventor: Byungjoon RHEE , Kyoungtae WI
IPC: H01L33/62 , H01L33/38 , H01L25/075 , H01L33/00
Abstract: Discussed is a display device and a method for manufacturing the display device, where the display device includes a substrate, a wiring electrode disposed on the substrate, semiconductor light emitting devices electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the semiconductor light emitting devices and includes conductive particles and an insulating material, and a light-transmitting layer formed between the semiconductor light emitting devices, where the semiconductor light emitting devices includes first semiconductor light emitting devices emitting a first color and second semiconductor light emitting devices emitting a second color different from the first color, and where the first and second semiconductor light emitting devices are alternately disposed with each other.
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10.
公开(公告)号:US20230006102A1
公开(公告)日:2023-01-05
申请号:US17782481
申请日:2019-12-05
Applicant: LG ELECTRONICS INC.
Inventor: Kyoungtae WI , Byungjoon RHEE
IPC: H01L33/38 , H01L25/075 , H01L33/62 , H01L33/00
Abstract: The present invention provides a display device including a substrate, a wiring electrode disposed on the substrate, and a plurality of semiconductor light emitting devices electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the semiconductor light emitting devices and made of a mixture of conductive particles and an insulating material, and a light transmitting layer formed between the semiconductor light emitting devices. And the anisotropic conductive layer is formed in plurality, and any one of the plurality of anisotropic conductive layers is formed to surround one semiconductor light emitting device or to surround a plurality of semiconductor light emitting devices adjacent to each other.
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