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    SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE AND DISPLAY DEVICE COMPRISING SAME
    3.
    发明公开
    SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE AND DISPLAY DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：US20240038933A1

    公开(公告)日：2024-02-01

    申请号：US18010085

    申请日：2020-06-15

    Applicant: LG ELECTRONICS INC.

    Inventor： Bongseok CHOI ,  Sungjin PARK ,  Joonkwon MOON ,  Taesu OH

    IPC: H01L33/38 ,  H01L25/075 ,  H01L33/40 ,  H01L33/54 ,  H01L33/62

    CPC classification number: H01L33/38 ,  H01L25/0753 ,  H01L33/405 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2933/005

    Abstract: The embodiment relates to a semiconductor light emitting device package and a display device including the same. Semiconductor light emitting device package according to an embodiment can comprises a light emitting structure 155 including a first conductivity type semiconductor layer 155a, an active layer 155b, and a second conductivity type semiconductor layer 155c; a first electrode 151 and a second electrode 152 electrically connected to the first conductivity type semiconductor layer 155a and the second conductivity type semiconductor layer 155c of the light emitting structure 155, respectively; an interlayer insulating layer disposed on the side of the light emitting structure 155 and an adhesive layer 158 disposed on the light emitting structure 155.
    The first electrode 151 can include a first reflective electrode 151a and a first pad electrode 151b, the second electrode 152 also can include a second reflective electrode 152a and a second pad electrode 152b, and a cross-sectional shape of the first reflective electrode 151a and the second reflective electrode 152a can comprise a cup shape.

    MULTI-LINK AGGREGATION
    6.
    发明申请
    MULTI-LINK AGGREGATION 有权

    公开(公告)号：US20230120236A1

    公开(公告)日：2023-04-20

    申请号：US17796223

    申请日：2021-01-29

    Applicant: LG ELECTRONICS INC.

    Inventor： Insun JANG ,  Jeongki KIM ,  Jinsoo CHOI ,  Suhwook KIM ,  Namyeong KIM ,  Sungjin PARK ,  Taewon SONG

    IPC: H04W74/08

    Abstract: A multi-link device (MLD) in a wireless local area network (WLAN) system is proposed. The MLD may include an access point (AP) MLD. The AP MLD may receive receiving, from a non-simultaneous transmit and receive (Non-STR) station (STA) MLD, a multilink aggregation request signal through a first link. The multilink aggregation request signal may include first information related to a second link for which aggregation is requested and second information related to a transmission opportunity (TXOP) to be set in the second link. The AP MLD may obtain the TXOP based on the second information in the second link. The AP MLD may transmit, to the Non-STR STA MLD, a first multilink aggregation response signal through the first link and a second multilink aggregation response signal through the second link.

    ACK TRANSMISSION USING MULTILINK
    8.
    发明申请
    ACK TRANSMISSION USING MULTILINK 有权

    公开(公告)号：US20220385403A1

    公开(公告)日：2022-12-01

    申请号：US17757045

    申请日：2020-08-14

    Applicant: LG ELECTRONICS INC.

    Inventor： Taewon SONG ,  Jeongki KIM ,  Jinsoo CHOI ,  Suhwook KIM ,  Namyeong KIM ,  Sungjin PARK ,  Insun JANG

    IPC: H04L1/16 ,  H04W76/15

    Abstract: In a wireless local area network system, a receiving device may receive a Block Acknowledgment Request (BAR) frame including information related to a link for which an ACK is requested, and transmit a Block ACK (BA) frame on the basis of the BAR frame. The receiving device is a Multi-Link Device (MLD), which supports communication over multiple links. Each link of the multiple links can be configured based on 2.4 GHz band, 5 GHz band, and/or 6 GHz band defined in a conventional wireless local area network system.

    SIGNAL TRANSMISSION USING PLURALITY OF APS IN WIRELESS LAN SYSTEM
    10.
    发明申请
    SIGNAL TRANSMISSION USING PLURALITY OF APS IN WIRELESS LAN SYSTEM 有权

    公开(公告)号：US20220070755A1

    公开(公告)日：2022-03-03

    申请号：US17310114

    申请日：2020-01-20

    Applicant: LG ELECTRONICS INC.

    Inventor： Sungjin PARK ,  Kiseon RYU ,  Eunsung PARK ,  Jinsoo CHOI

    IPC: H04W40/02 ,  H04W48/16

    Abstract: A method performed in a wireless local area network (LAN) system is presented. Particularly, a first type access point (AP) #1 can receive a trigger frame from a second type AP. The first type AP #1 can transmit a null data packet (NDP) request frame to a first station (STA). The first type AP #1 can receive a first NDP frame from the first STA, and receive a second NDP frame from a second STA. The first type AP #1 can receive a feedback request frame from the second type AP. The first type AP #1 can transmit an NDP feedback frame to the second type AP on the basis of the first and second NDP frames.

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