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    Vehicular camera system
    21.
    发明授权
    Vehicular camera system 有权

    公开(公告)号：US12162412B2

    公开(公告)日：2024-12-10

    申请号：US18337486

    申请日：2023-06-20

    Applicant: MAGNA ELECTRONICS INC.

    Inventor： Garret F. Achenbach ,  Brian J. Winden ,  Christopher L. Van Dan Elzen

    IPC: H04N5/235 ,  B60R1/04 ,  B60R1/12 ,  B60R11/04 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  B60K35/22 ,  B60K35/28 ,  B60K35/60 ,  B60R11/00 ,  H04N23/52

    Abstract: A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.

    Vehicular vision system with forward viewing camera module
    22.
    发明授权
    Vehicular vision system with forward viewing camera module 有权

    公开(公告)号：US11964617B2

    公开(公告)日：2024-04-23

    申请号：US18347756

    申请日：2023-07-06

    Applicant: MAGNA ELECTRONICS INC.

    Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

    IPC: B60R11/04 ,  B60R1/00 ,  H04N7/18 ,  H04N23/57 ,  H05K7/20

    CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N7/181 ,  H04N23/57 ,  H05K7/2039

    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.

    IMAGER ASSEMBLY FOR VEHICULAR CAMERA WITH FASTENERLESS LENS HOLDER TO CIRCUIT BOARD ATTACHMENT
    25.
    发明申请
    IMAGER ASSEMBLY FOR VEHICULAR CAMERA WITH FASTENERLESS LENS HOLDER TO CIRCUIT BOARD ATTACHMENT 有权

    公开(公告)号：US20210188190A1

    公开(公告)日：2021-06-24

    申请号：US17249686

    申请日：2021-03-10

    Applicant: Magna Electronics Inc.

    Inventor： Robert A. Devota ,  Garret F. Achenbach ,  David F. Olson ,  Matthew C. Sesti ,  John R. Garcia

    IPC: B60R11/04

    Abstract: An imager assembly for a vehicular camera module includes an imager circuit board and a lens holder. An imager is disposed at the imager circuit board. The lens holder includes a lens holding portion that accommodates a lens. The lens holder includes a plurality of pins extending from an attaching portion and extending in a direction away from the lens holding portion of the lens holder. With the attaching portion of the lens holder at the imager circuit board, individual pins of the plurality of pins are received at least partially through respective apertures of the imager circuit board to locate the lens holder at the imager circuit board. With the pins received at least partially through the apertures of the imager circuit board, and with the lens aligned with the imager at the imager circuit board, the pins are fixedly attached at the imager circuit board.

    Vehicular camera system
    26.
    发明授权
    Vehicular camera system 有权

    公开(公告)号：US10787125B2

    公开(公告)日：2020-09-29

    申请号：US15457056

    申请日：2017-03-13

    Applicant: MAGNA ELECTRONICS INC.

    Inventor： Garret F. Achenbach ,  Brian J. Winden ,  Christopher L. Van Dan Elzen

    IPC: H04N5/225 ,  H05K7/20 ,  B60R1/00 ,  B60R1/04 ,  B60R1/12 ,  B60R11/04 ,  B60R11/00

    Abstract: A camera system for a vehicle includes a camera module having an imager assembly, a main circuit board and a camera housing, with the imager assembly including (i) an imager disposed on an imager circuit board and (ii) a lens assembly having a lens barrel accommodating a lens. A bracket is configured to attach at the vehicle windshield and to receive the camera module. The lens barrel extends from a portion of the lens assembly that is enclosed by the camera housing through an aperture to protrude outside the camera housing. With the camera module received by the bracket and with the bracket attached at the windshield, a forward portion of the camera housing is below the lens barrel. A separate stray light shield is disposed at the forward portion of the camera housing to reduce incidence of stray light at the lens.

    FORWARD VIEWING CAMERA MODULE FOR VEHICULAR VISION SYSTEM
    27.
    发明申请
    FORWARD VIEWING CAMERA MODULE FOR VEHICULAR VISION SYSTEM 审中-公开

    公开(公告)号：US20180170279A1

    公开(公告)日：2018-06-21

    申请号：US15899131

    申请日：2018-02-19

    Applicant: MAGNA ELECTRONICS INC.

    Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

    IPC: B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N5/225 ,  H04N7/18

    CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N5/2257 ,  H04N7/181 ,  H05K7/2039

    Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.

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