Abstract:
Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.
Abstract:
Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.
Abstract:
Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.
Abstract:
The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.
Abstract:
An implantable medical device includes a low-power circuit, a high-power circuit, and a dual-cell power source. The power source is coupled to a transformer having first and second primary windings, each of which is selectively coupled to the power source and a plurality of secondary windings that are magnetically coupled to the first and second primary windings. The plurality of secondary windings are interlaced along a length of each of the secondary windings. Each of the plurality of secondary transformer windings is coupled to a capacitor, and the capacitors are all connected in a series configuration. The low power circuit is coupled to the power source and issues a control signal to control the delivery of charge from the power source to the plurality of capacitors through the first and second transformers.
Abstract:
Apparatus and methods for generating an induction waveform for performing threshold testing in an implantable medical device are disclosed. Such tests may be performed during the implant procedure, or during a device checkup procedure, or routinely during the lifetime of the device. The threshold test may include induction of an arrhythmia (such as ventricular fibrillation) followed by delivery of therapy at various progressively-increasing stimulation parameters to terminate the arrhythmia. As such, the capability to induce fibrillation within the device is desired. Induction of the arrhythmias may be accomplished via delivery of a relatively low energy shock or through delivery of an induction stimulation pulse to the cardiac tissue timed concurrently with the vulnerable period of the cardiac cycle.
Abstract:
Recent advancements in power electronics technology have provided opportunities for enhancements to implantable medical device circuits. The enhancements have contributed to increasing circuit miniaturization and increased efficiency in the operation of the implantable medical devices. Stimulation therapy waveforms generated by the circuits include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. A charging circuit having a single primary transformer winding and a single secondary transformer winding that is coupled to a plurality of capacitors is utilized to generate the therapy stimulation waveforms. The stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response. Such stimulation waveforms facilitate achieving lower capture thresholds which reduces the device's supply consumption thereby increasing longevity of the device and facilitate a reduction of tissue damage.
Abstract:
A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.
Abstract:
Recent advancements in power electronics technology have provided opportunities for enhancements to circuits of implantable medical devices. The enhancements have contributed to increasing circuit miniaturization and an increased efficiency in the operation of the implantable medical devices. The therapy delivery circuits and techniques of the disclosure facilitate generation of a therapy stimulation waveform that may be shaped based on the patient's physiological response to the stimulation waveform. The generated therapy stimulation waveforms include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. Unlike the truncated exponential waveform delivered by the conventional therapy delivery circuit which is based on the behavior of the output capacitors (i.e., i=C(dV/dt)), the stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response. The dynamically shaped therapy stimulation waveforms facilitate achieving lower capture thresholds which reduces the device's supply consumption thereby increasing longevity of the device and facilitate a reduction of tissue damage.
Abstract:
Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and cavity disposed in the substrate. The cavity extends between the first major surface and a recessed surface. Tantalum material is disposed within the cavity. Further, the tantalum material includes tantalum particles. The electrical component also includes a dielectric layer disposed on the tantalum particles and an electrolyte cathode layer disposed on the dielectric layer. The electrical component further includes a cathode electrode disposed on the electrolyte cathode layer and over the cavity.