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    ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
    1.
    发明公开
    ELECTRICAL COMPONENT AND METHOD OF FORMING SAME 审中-公开

    公开(公告)号：US20230420191A1

    公开(公告)日：2023-12-28

    申请号：US18243274

    申请日：2023-09-07

    Applicant: MEDTRONIC, INC.

    Inventor： Mark R. Boone ,  Joachim Hossick-Schott ,  Mark Henschel ,  Chunho Kim

    IPC: H01G9/08 ,  H01G9/15 ,  H01G9/048

    CPC classification number: H01G9/08 ,  H01G9/15 ,  H01G9/048 ,  H01G9/0425

    Abstract: Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.

    Integrated circuit package and method of forming same
    2.
    发明授权
    Integrated circuit package and method of forming same 有权

    公开(公告)号：US11569178B2

    公开(公告)日：2023-01-31

    申请号：US17324548

    申请日：2021-05-19

    Applicant: Medtronic, Inc.

    Inventor： Chunho Kim ,  Mark R. Boone ,  Randolph E. Crutchfield

    IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/58 ,  H01L23/00

    Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.

    INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
    4.
    发明申请
    INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME 有权

    公开(公告)号：US20210272909A1

    公开(公告)日：2021-09-02

    申请号：US17324548

    申请日：2021-05-19

    Applicant: Medtronic, Inc.

    Inventor： Chunho Kim ,  Mark R. Boone ,  Randolph E. Crutchfield

    IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/58 ,  H01L23/00

    Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.

    THERAPY DELIVERY METHOD AND SYSTEM FOR IMPLANTABLE MEDICAL DEVICES
    7.
    发明申请
    THERAPY DELIVERY METHOD AND SYSTEM FOR IMPLANTABLE MEDICAL DEVICES 有权
    用于可植入医疗器械的治疗方法和系统

    公开(公告)号：US20150134021A1

    公开(公告)日：2015-05-14

    申请号：US14536881

    申请日：2014-11-10

    Applicant: Medtronic, Inc.

    Inventor： Randolph E. Crutchfield ,  Lonny V. Cabelka ,  Mark R. Boone ,  Marshall J. Rasmussen

    IPC: A61N1/39

    CPC classification number: A61N1/3981 ,  A61N1/371 ,  A61N1/3906 ,  A61N1/3956 ,  A61N1/3987

    Abstract: Recent advancements in power electronics technology have provided opportunities for enhancements to circuits of implantable medical devices. The enhancements have contributed to increasing circuit miniaturization and an increased efficiency in the operation of the implantable medical devices. The therapy delivery circuits and techniques of the disclosure facilitate generation of a therapy stimulation waveform that may be shaped based on the patient's physiological response to the stimulation waveform. The generated therapy stimulation waveforms include a stepped leading-edge that may be shaped having a varying slope and varying amplitudes associated with each of the segments of the slope. Unlike the truncated exponential waveform delivered by the conventional therapy delivery circuit which is based on the behavior of the output capacitors (i.e., i=C(dV/dt)), the stimulation waveform of the present disclosure may be dynamically shaped as a function of an individual patient's response. The dynamically shaped therapy stimulation waveforms facilitate achieving lower capture thresholds which reduces the device's supply consumption thereby increasing longevity of the device and facilitate a reduction of tissue damage.

    Abstract translation: 电力电子技术的最新进展为可植入医疗器械电路的增强提供了机会。 这些增强功能有助于增加电路小型化并提高可植入医疗装置的操作效率。 本公开的治疗递送电路和技术有助于产生可以基于患者对刺激波形的生理反应而变形的治疗刺激波形。 产生的治疗刺激波形包括阶梯形前缘，其可以被成形为具有与斜率的每个段相关联的变化的斜率和变化的幅度。 与基于输出电容器的行为（即，i = C（dV / dt））的传统治疗传递电路传递的截断指数波形不同，本公开的刺激波形可以动态地形成为 个人病人的反应。 动态形状的治疗刺激波形有助于实现更低的捕获阈值，这降低了装置的供应消耗，从而增加了装置的使用寿命，并有助于减少组织损伤。

    Optical based glucose sensor
    8.
    发明授权
    Optical based glucose sensor 有权

    公开(公告)号：US12186076B2

    公开(公告)日：2025-01-07

    申请号：US17171474

    申请日：2021-02-09

    Applicant: Medtronic, Inc.

    Inventor： David L. Probst ,  Mark R. Boone

    IPC: A61B5/1455 ,  A61B5/145 ,  A61B5/1459 ,  A61B5/1486 ,  A61K49/00 ,  A61B5/00

    Abstract: An example medical device includes an optical sensor, processing circuitry, an antenna, and a power source. The optical sensor includes a light source; a reference optical beacon having a first fluorophore that emits a first fluorescence proportional to a first concentration of a substance proximate the beacon; a test optical beacon having a reagent substrate that reacts with an analyte to produce the substance and a second fluorophore that emits a second fluorescence proportional to a second concentration of the substance proximate the test beacon; and a photodetector to detect the first and second fluorescence. The processing circuitry determines a difference between the first and second fluorescence, which is indicative of the concentration of the analyte. The antenna and power source enable the medical device to operate completely within a biological system for continuous analyte monitoring.

    Electrical component and method of forming same
    9.
    发明授权
    Electrical component and method of forming same 有权

    公开(公告)号：US11631549B2

    公开(公告)日：2023-04-18

    申请号：US17367828

    申请日：2021-07-06

    Applicant: Medtronic, Inc.

    Inventor： Mark R. Boone ,  Joachim Hossick-Schott

    IPC: H01G9/048 ,  H01G9/15 ,  H01G9/08 ,  H01G9/07

    Abstract: Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, an alloy layer disposed on the first major surface of a substrate, and tantalum material disposed on the alloy layer such that the alloy layer is between the tantalum material and the first major surface of the substrate. The tantalum material includes bonded tantalum particles. The electrical component can also include a dielectric layer disposed on the tantalum particles, a cathode electrode disposed over the tantalum material, and an anode electrode disposed on the second major surface of the substrate.

    OPTICAL BASED GLUCOSE SENSOR
    10.
    发明申请
    OPTICAL BASED GLUCOSE SENSOR 有权

    公开(公告)号：US20220248986A1

    公开(公告)日：2022-08-11

    申请号：US17171474

    申请日：2021-02-09

    Applicant: Medtronic, Inc.

    Inventor： David L. Probst ,  Mark R. Boone

    IPC: A61B5/145 ,  A61B5/1455 ,  A61B5/1486 ,  A61B5/1459 ,  A61K49/00

    Abstract: An example medical device includes an optical sensor, processing circuitry, an antenna, and a power source. The optical sensor includes a light source; a reference optical beacon having a first fluorophore that emits a first fluorescence proportional to a first concentration of a substance proximate the beacon; a test optical beacon having a reagent substrate that reacts with an analyte to produce the substance and a second fluorophore that emits a second fluorescence proportional to a second concentration of the substance proximate the test beacon; and a photodetector to detect the first and second fluorescence. The processing circuitry determines a difference between the first and second fluorescence, which is indicative of the concentration of the analyte. The antenna and power source enable the medical device to operate completely within a biological system for continuous analyte monitoring.

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