公开(公告)号：US20070170069A1

公开(公告)日：2007-07-26

申请号：US10588686

申请日：2005-12-09

申请人： Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Masashi Kumagai

发明人： Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Masashi Kumagai

IPC分类号： C25D3/38

CPC分类号： C25D1/04 ,  C25D3/38

摘要： The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.

摘要翻译： 本发明的目的是在使用阴极鼓的电解铜箔制造中，在粗糙表面侧（与光泽面相反侧）获得具有低表面粗糙度的低剖面电解铜箔，特别是获得电解铜 箔具有优异的伸长率和拉伸强度，允许精细图案化。 另一个目的是获得一种铜电解溶液，其允许在2层柔性基板上均匀镀铜而没有针孔。 该铜电解液包含作为添加剂的具有下述通式（1）表示的特定骨架的化合物，其通过加成反应获得，其中将水加入到分子中具有一个或多个环氧基的化合物：其中A为 环氧化合物残基，n为1以上的整数。

公开(公告)号：US20070123681A1

公开(公告)日：2007-05-31

申请号：US10575336

申请日：2004-09-30

申请人： Hironori Kobayashi ,  Katsuyuki Tsuchida ,  Masashi Kumagai

发明人： Hironori Kobayashi ,  Katsuyuki Tsuchida ,  Masashi Kumagai

IPC分类号： C08G18/40 ,  C08G18/48

CPC分类号： C08G18/7831 ,  C08G18/289 ,  C08G18/6225 ,  C08K5/5442 ,  C08L75/04 ,  C09D175/04

摘要： As a resin composition that solves the problems such as unpleasant odor encountered when a tertiary amine compound is used as a catalyst in a reaction of a polyol and a polyisocyanate, and that promotes the curing of these resins and improves adhesion to metals, inorganic materials, and organic materials, the present invention provides a resin composition containing the following components as essential components, (A) a polyol (B) a polyisocyanate (C) a silane coupling agent containing an imidazole group (here, the ratio NCO/OH of the number of isocyanate groups in the polyisocyanate (B) to the number of hydroxyl groups in the polyol (A) in the above composition is from 0.6 to 4.0, and the weight ratio of {(A)+(B)}:(C) is from 100:0.01 to 100:10).

摘要翻译： 作为解决在多元醇与多异氰酸酯的反应中使用叔胺化合物作为催化剂时遇到的令人不愉快的气味，促进这些树脂的固化，提高与金属，无机材料的粘合性等问题的树脂组合物， 和有机材料，本发明提供了含有以下成分作为必要成分的树脂组合物，（A）多元醇（B），多异氰酸酯（C），含有咪唑基的硅烷偶联剂（这里，NCO / 多异氰酸酯（B）中的异氰酸酯基数与上述组成中的多元醇（A）中的羟基数为0.6〜4.0，{（A）+（B：（C））的重量比为 100：0.01〜100：10）。

公开(公告)号：US06916865B2

公开(公告)日：2005-07-12

申请号：US10451977

申请日：2002-08-27

申请人： Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

发明人： Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

IPC分类号： C07B61/00 ,  C07F7/18 ,  C08G59/40 ,  C08G59/42 ,  C08G59/58 ,  C09D5/03 ,  C09D163/00 ,  H05K3/28 ,  C07D213/69 ,  C07D233/72 ,  C07D235/12 ,  C07F7/10 ,  C08K5/11

CPC分类号： C08G59/58 ,  C07F7/1804 ,  C08G59/4238 ,  H05K3/287

摘要： The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing a basic silane coupling agent and an amine compound with a softening point or melting point of 40° C. or greater together with an organic carboxylic acid; a method for producing the same; an additive for epoxy resin that contains this as the active ingredient thereof; and an epoxy resin composition containing the same. The basic silane coupling agent should preferably be a specific imidazole-group containing silane coupling agent, amino group-containing silane coupling agent, dialkylamino group-containing silane coupling agent, monomethylamino group-containing silane coupling agent, benzimidazole group-containing silane coupling agent, benzotriazole group-containing silane coupling agent, and pyridine ring-containing silane coupling agent.

摘要翻译： 本发明提供一种具有长的使用寿命，固化环氧树脂和改善粘合性能的有机羧酸盐组合物，并且还提供了一种制备该组合物的方法。 通过将碱性硅烷偶联剂和软化点或熔点为40℃以上的胺化合物与有机羧酸一起加热混合而获得的有机羧酸盐组合物; 其制造方法; 含有作为其活性成分的环氧树脂添加剂; 和含有该环氧树脂组合物的环氧树脂组合物。 碱性硅烷偶联剂优选为特定的含咪唑基的硅烷偶联剂，含氨基的硅烷偶联剂，含二烷基氨基的硅烷偶联剂，含单甲基氨基的硅烷偶联剂，含苯并咪唑基的硅烷偶联剂， 含有苯并三唑基的硅烷偶联剂和含吡啶环的硅烷偶联剂。

公开(公告)号：US08449751B2

公开(公告)日：2013-05-28

申请号：US11906663

申请日：2007-10-03

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D1/04 ,  C25D7/06

CPC分类号： C25D7/0614 ,  C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/26

摘要： The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.

摘要翻译： 本发明的目的是获得使用阴极鼓制造的电解铜箔制成的薄型电解铜箔，使得粗糙表面侧（与光泽表面的相反侧）的表面粗糙度低。 特别地，本发明的目的是获得可以精细图案化并且在正常和高温下具有优异的伸长率和拉伸强度的电解铜箔。 该目的通过使用含有有机硫化合物和具有特定骨架的胺化合物的铜电解溶液来实现，所述特定骨架通过使胺化合物和其分子中具有一个或多个环氧基的化合物相加至加成 反应。

公开(公告)号：US07651783B2

公开(公告)日：2010-01-26

申请号：US10486274

申请日：2002-07-17

申请人： Katsuyuki Tsuchida ,  Masashi Kumagai ,  Fumiaki Akase

发明人： Katsuyuki Tsuchida ,  Masashi Kumagai ,  Fumiaki Akase

IPC分类号： H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B15/08

CPC分类号： C23C28/00 ,  C23C30/00 ,  H05K3/384 ,  H05K3/389 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993 ,  Y10T428/31663

摘要： A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.

摘要翻译： 与用于更高频率应用的覆铜层压板的绝缘树脂具有改善的粘合性的表面处理铜箔包含在其至少一侧上依次具有耐热层和烯烃基硅烷偶联剂层的铜箔。 耐热处理后可以进行防锈处理。 铜箔优选为电解铜箔，这些层可以设置在S侧和/或M侧。 铜箔具有足够的粘合强度，即使没有在过去进行的粗糙化处理。 可以有利地使用锌，锌 - 锡，锌 - 镍，锌 - 钴，铜 - 锌，铜 - 镍 - 钴或镍 - 钴的薄膜作为耐热层，并且已经经历了锌 铬酸盐或铬酸盐处理可以有利地用作防腐层。

公开(公告)号：US20090092789A1

公开(公告)日：2009-04-09

申请号：US11992209

申请日：2006-08-22

申请人： Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Ryu Murakami ,  Masashi Kumagai

发明人： Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Ryu Murakami ,  Masashi Kumagai

IPC分类号： D06N7/04

CPC分类号： H05K1/09 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2307/206 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/108 ,  H05K3/28 ,  H05K3/382 ,  H05K3/388 ,  H05K2201/0355 ,  H05K2201/098 ,  H05K2203/0723 ,  Y10T428/24355

摘要： The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to resist.The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 μm, and wherein the average crystal grain size [of copper] is no greater than 0.8 μm at 1 μm from the insulator film in the cross section of the copper layer. Preferably, the insulator film is a polyimide film.

摘要翻译： 本发明提供一种没有表面缺陷且具有优异的蚀刻特性和抗粘附性的双层柔性基材。 双层柔性基板在不使用粘合剂的情况下，在绝缘膜的一面或两面上具有铜层，其中铜层的表面粗糙度（Ra）为0.10〜0.25μm，平均结晶粒径[ 的铜]在铜层的截面中距离绝缘膜1个1um时不大于0.8μm。 优选地，绝缘膜是聚酰亚胺膜。

公开(公告)号：US07045461B2

公开(公告)日：2006-05-16

申请号：US10767697

申请日：2004-01-29

申请人： Toru Imori ,  Masashi Kumagai ,  Junnosuke Sekiguchi

发明人： Toru Imori ,  Masashi Kumagai ,  Junnosuke Sekiguchi

IPC分类号： H01L21/44

CPC分类号： C23C18/30 ,  C23C18/1879

摘要： Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method.According to the metal plating method of the present invention, electroless plating is performed after the surface of a object to be plated is treated with a pretreatment agent obtained by reacting or mixing in advance a noble metal compound (catalyst) with a silane-coupling agent having functional groups capable of capturing metals. According to this method, metal plating can be securely applied to powders, resin cloths, semiconductor wafers, and other specular bodies. Moreover, the problem of the insufficient coverage of the seed layer on the inside walls of vias and trenches during the formation of fine wiring can be addressed by applying this method to semiconductor wafers. The silane-coupling agent may be a compound containing azole groups, preferably an imidazole.

摘要翻译： 树脂布，粉末，镜面物体和其他耐常规镀层的物体可用简单的方法镀金属。 根据本发明的金属镀覆方法，在将待镀镀物体的表面用预先将贵金属化合物（催化剂）与硅烷偶联剂进行反应或混合而获得的预处理剂进行处理之后进行化学镀 具有能够捕获金属的官能团。 根据该方法，可以将金属电镀牢固地施加到粉末，树脂布，半导体晶片和其它镜面体上。 此外，通过将该方法应用于半导体晶片，可以解决在形成精细布线期间通孔和沟槽的内壁上种子层覆盖不足的问题。 硅烷偶联剂可以是含有唑类，优选咪唑的化合物。

公开(公告)号：US20060011488A1

公开(公告)日：2006-01-19

申请号：US10486861

申请日：2003-09-17

申请人： Masashi Kumagai ,  Mikio Hanafusa

发明人： Masashi Kumagai ,  Mikio Hanafusa

IPC分类号： C25D3/38

CPC分类号： C25D3/38 ,  Y10T428/12993

摘要： There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.

摘要翻译： 在使用阴极鼓的电解铜箔的制造中，在粗糙表面侧（与光泽表面相反的一侧）获得具有小的表面粗糙度的薄型电解铜箔，更具体地说，是电解铜 箔，其允许精细图案化，并且在常温和高温下在伸长率和拉伸强度方面优异。 本发明提供一种铜电解液，其含有有机硫化合物和通过使具有二烷基氨基的丙烯酸类化合物的氮季铵化的化合物均聚而得到的季铵化合物聚合物，或将该化合物与其它化合物共聚 具有不饱和键，以及使用该电解液制造的电解铜箔。

公开(公告)号：US06835241B2

公开(公告)日：2004-12-28

申请号：US10362953

申请日：2003-05-01

申请人： Katsuyuki Tsuchida ,  Masashi Kumagai ,  Fumiaki Akase

发明人： Katsuyuki Tsuchida ,  Masashi Kumagai ,  Fumiaki Akase

IPC分类号： C09D18310

CPC分类号： H05K3/389 ,  C09D4/00 ,  C23C22/52 ,  C23C22/68 ,  C23C2222/20 ,  H05K2201/0355 ,  Y10T428/31663 ,  C08G77/04

摘要： The present invention provides a surface treatment agent that endows a copper foil with excellent adhesion to insulating resins. The surface treatment agent of the present invention has as its active components an organosilicic compound expressed by a following General Formula (1) and/or an organosilicic compound expressed by a General Formula (2) and an olefin-based silane coupling agent. The surface treatment agent of the present invention provides particularly excellent adhesion between an insulating resin and a low-profile copper foil used for a high-frequency-adaptable substrate. In Formulas (1) and (2), R1 is a hydroxyl group or a C1 to C5 alkyl group, and R2 is a C1 to C10 alkylene group that may contain oxygen.

摘要翻译： 本发明提供一种赋予铜离子对绝缘性树脂具有优异粘合性的表面处理剂。本发明的表面处理剂作为其活性成分，由以下通式（1）表示的有机硅化合物和/或有机硅 由通式（2）表示的化合物和烯烃系硅烷偶联剂。 本发明的表面处理剂在绝缘树脂和用于高频适应性基材的低剖面铜箔之间提供特别优异的粘附性。在式（1）和（2）中，R 1是羟基 基团或C1〜C5烷基，R 2为可含有氧的C1〜C10亚烷基。

公开(公告)号：US06710181B2

公开(公告)日：2004-03-23

申请号：US09936073

申请日：2001-09-05

申请人： Masashi Kumagai ,  Katsuyuki Tsuchida

发明人： Masashi Kumagai ,  Katsuyuki Tsuchida

IPC分类号： C07F702

CPC分类号： C08K5/5465 ,  C07F7/1804 ,  C08G73/0616 ,  C08K5/5442 ,  C23C2222/20

摘要： The present invention provides a novel imidazole/organic monocarboxylic acid salt derivative reaction product capable of improving the adhesion between a resin and a metal such as copper, steel or aluminum, or an inorganic material such as glass fiber, silica, aluminum oxide or aluminum hydroxide, a method for producing this imidazole/organic monocarboxylic acid salt derivative reaction product, and a surface treatment agent, resin additive and resin composition that use this imidazole/organic monocarboxylic acid salt derivative reaction product. The above imidazole/organic monocarboxylic acid salt derivative reaction product is obtained by reacting an imidazole compound represented by undermentioned general formula (1) with a silane compound having a glycidoxy group represented by undermentioned general formula (2) at 80 to 200° C., and then reacting the product thus obtained with an organic monocarboxylic acid at 50 to 200° C.

摘要翻译： 本发明提供了能够提高树脂与铜，钢或铝等金属或玻璃纤维，二氧化硅，氧化铝或氢氧化铝等无机材料的粘合性的新颖的咪唑/有机单羧酸盐衍生物反应产物 ，该咪唑/有机单羧酸盐衍生物反应产物的制备方法，以及使用该咪唑/有机一元羧酸盐衍生物反应产物的表面处理剂，树脂添加剂和树脂组合物。上述咪唑/有机单羧酸盐衍生物反应 通过使由下述通式（1）表示的咪唑化合物与具有由上述通式（2）表示的缩水甘油氧基的硅烷化合物在80〜200℃下反应，然后使得到的产物与有机物 一元羧酸在50〜200℃