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    Optical head structures including support substrates adjacent transparent substrates and related methods
    23.
    发明授权
    Optical head structures including support substrates adjacent transparent substrates and related methods 失效
    光头结构，包括与透明基板相邻的支撑基板和相关方法

    公开(公告)号：US5886971A

    公开(公告)日：1999-03-23

    申请号：US994281

    申请日：1997-12-19

    Applicant: Michael R. Feldman ,  Alan D. Kathman

    Inventor： Michael R. Feldman ,  Alan D. Kathman

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  G11B7/12 ,  G11B7/135 ,  G11B7/22 ,  H01L31/12 ,  H01S5/00 ,  G11B7/00

    CPC classification number: G02B6/4231 ,  G02B6/4232 ,  G11B7/123 ,  G11B7/1353 ,  G11B7/1372 ,  G11B7/1374 ,  G11B7/22 ,  G02B2006/12102 ,  G02B2006/12107 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4238 ,  G02B6/4239 ,  G02B6/43 ,  H01S5/005

    Abstract: An integrated optical head, such as, for a disk drive, preferably includes an optically transparent substrate. The substrate has a diffractive optical element formed on one face and a plurality of electrical contact pads exposed on the other face. A light source is positioned to emit light through the substrate, through the diffractive optical element, and toward data storage media. The light source includes a plurality of electrical contact pads corresponding to the plurality of electrical contact-pads exposed on the face of the substrate. An optical detector is positioned to detect light reflected from the data storage media, through the diffractive optical element, and through the substrate. The optical detector includes a plurality of exposed electrical contact pads corresponding to the plurality of electrical contact pads exposed on the face of the substrate. The substrate and the light source and optical detector are passively aligned using solder bumps between pairs of contact pads. A mechanical passive alignment arrangement is also disclosed.

    Abstract translation: 诸如用于磁盘驱动器的集成光学头优选地包括光学透明的基板。 衬底具有形成在一个面上的衍射光学元件和暴露在另一个面上的多个电接触焊盘。 光源被定位成通过基底，通过衍射光学元件和数据存储介质发光。 光源包括对应于暴露在基板的表面上的多个电接触焊盘的多个电接触焊盘。 光学检测器被定位成通过衍射光学元件和通过基底来检测从数据存储介质反射的光。 光学检测器包括对应于暴露在基板的表面上的多个电接触焊盘的多个暴露的电接触焊盘。 基板和光源和光学检测器被使用在成对的接触焊盘之间的焊料凸块被动对准。 还公开了一种机械被动对准装置。

    Beam-homogenizer
    25.
    发明授权
    Beam-homogenizer 失效
    梁均化器

    公开(公告)号：US5610733A

    公开(公告)日：1997-03-11

    申请号：US203188

    申请日：1994-02-28

    Applicant: Michael R. Feldman ,  John R. Rowlette, Sr.

    Inventor： Michael R. Feldman ,  John R. Rowlette, Sr.

    IPC: B23K26/06 ,  G02B5/32 ,  G02B27/09 ,  G02F1/01 ,  G03F7/20 ,  G03H1/08

    CPC classification number: G02B27/0927 ,  B23K26/06 ,  B23K26/064 ,  B23K26/066 ,  G02B27/09 ,  G02B27/0944 ,  G02B5/32 ,  G03F7/70058 ,  G03H1/0236 ,  G03H2001/303 ,  Y10S359/90

    Abstract: A beam homogenizer for converting an incident beam of non-uniform spatial power or energy distribution into an output beam of uniform spatial power or energy distribution. The homogenizer is a holographic optical element constructed from an array of facets or subholograms and positioned at a first plane in the path of an incident signal. The transmittance from each subhologram is uniformly spread across a target at a second plane that is spaced away from the first plane Another optical element, such as a holographic collimation element, may be placed at the second plane to collimate the transmittances thereupon.

    Abstract translation: 一种用于将不均匀的空间功率或能量分布的入射光束转换成均匀的空间功率或能量分布的输出光束的光束均化器。 均化器是由面或子像素阵列构成的全息光学元件，并且位于入射信号的路径中的第一平面处。 来自每个子电子照相的透射率在与第一平面间隔开的第二平面上在靶上均匀地分布。另一个光学元件，例如全息准直元件，可以放置在第二平面上，以准直其上的透射率。

    Microelectronic module having optical and electrical interconnects
    26.
    发明授权
    Microelectronic module having optical and electrical interconnects 失效
    具有光电互连的微电子模块

    公开(公告)号：US5237434A

    公开(公告)日：1993-08-17

    申请号：US787938

    申请日：1991-11-05

    Applicant: Michael R. Feldman ,  Iwona Turlik ,  Gretchen M. Adema

    Inventor： Michael R. Feldman ,  Iwona Turlik ,  Gretchen M. Adema

    IPC: G02B6/10 ,  G02B6/42 ,  G02B6/43 ,  H01L23/48

    CPC classification number: H01L24/73 ,  G02B6/43 ,  H01L23/48 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15192

    Abstract: A multichip module having high density optical and electrical interconnections between integrated circuit chips. An optically transparent substrate is positioned overlying an array of integrated circuit chips mounted on a mounting substrate. The mounting substrate may include a heat sink to remove excess heat from the integrated circuit chips. The multichip module includes integrated circuit chips having optical detectors and optical transmitters to establish optical interconnections therebetween. A hologram is positioned in the optical path between the optical transmitters and the optical detectors. A planar mirror is preferably positioned opposite the hologram to direct the optical beams. The optically transparent substrate also includes an array of electrical contact pads to establish electrical connections with corresponding electrical contact pads on the underlying integrated circuit chips. A pattern of electrical interconnection lines is provided on at least one of the mounting substrate or the transparent substrate to electrically interconnect predetermined ones of the integrated circuit chips.

    Abstract translation: 集成电路芯片之间具有高密度光电互连的多芯片模块。 光学透明基板定位在安装在安装基板上的集成电路芯片的阵列上。 安装基板可以包括散热器以从集成电路芯片去除多余的热量。 多芯片模块包括具有光学检测器和光发射器的集成电路芯片，以在它们之间建立光学互连。 全息图位于光发射器和光学检测器之间的光路中。 平面镜优选地与全息图相对定位以引导光束。 光学透明基板还包括电接触焊盘的阵列，以与底层集成电路芯片上的对应电接触焊盘建立电连接。 电连接线的图案设置在安装基板或透明基板的至少一个上，以将预定的集成电路芯片电互连。

    Apparatus and method for programmable optical interconnections
    27.
    发明授权
    Apparatus and method for programmable optical interconnections 失效
    可编程光学互连的装置和方法

    公开(公告)号：US5159473A

    公开(公告)日：1992-10-27

    申请号：US661855

    申请日：1991-02-27

    Applicant: Michael R. Feldman

    Inventor： Michael R. Feldman

    IPC: G02B5/32 ,  G02B6/43 ,  H04Q3/52

    CPC classification number: G02B6/43 ,  G02B5/32

    Abstract: A programmable optical interconnection apparatus and method in which a plurality of spatial light modulators (SLM) form a plurality of spatially modulated beams from a data signal. A hologram is responsive to the spatially modulated beams for generating at least two destructively interfering coherent beams at a first optical detector to thereby disconnect the data signal therefrom, and for simultaneously generating at least two constructively interfering coherent beams at a second optical detector to thereby connect the data signal beam thereto. The hologram is preferably a computer generated thin hologram which does not rely on Bragg diffraction. A low cost, high density, high efficiency programmable optical interconnect is thereby provided.

    Abstract translation: 一种可编程光互连装置和方法，其中多个空间光调制器（SLM）从数据信号形成多个空间调制光束。 全息图响应于空间调制的光束，用于在第一光学检测器处产生至少两个相干干涉的相干光束，从而从其断开数据信号，并且用于在第二光学检测器处同时产生至少两个建设性干扰相干光束，从而连接 数据信号波束。 全息图优选是不依赖于布拉格衍射的计算机生成的薄全息图。 从而提供了低成本，高密度，高效率的可编程光学互连。

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