Abstract:
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers. An active element having a characteristic which changes in response to an applied field may be integrated on a bottom surface of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.
Abstract:
An optical bidirectional link comprising: a module having a lower surface and an upper surface. The upper surface having disposed thereon a submodule having an optical transmitter and detector mounted thereon. Circuitry mounted on the upper surface. The circuitry having electronic components for effecting bidirectional communication via the optical transmitter and detector. A cover disposed over the upper surface of the module, wherein the submodule further comprises a silicon substrate having an optical fiber disposed in v-groove, a laser, reflective surfaces, and a holographic plate disposed on an upper surface of the silicon substrate.
Abstract:
An integrated optical head, such as, for a disk drive, preferably includes an optically transparent substrate. The substrate has a diffractive optical element formed on one face and a plurality of electrical contact pads exposed on the other face. A light source is positioned to emit light through the substrate, through the diffractive optical element, and toward data storage media. The light source includes a plurality of electrical contact pads corresponding to the plurality of electrical contact-pads exposed on the face of the substrate. An optical detector is positioned to detect light reflected from the data storage media, through the diffractive optical element, and through the substrate. The optical detector includes a plurality of exposed electrical contact pads corresponding to the plurality of electrical contact pads exposed on the face of the substrate. The substrate and the light source and optical detector are passively aligned using solder bumps between pairs of contact pads. A mechanical passive alignment arrangement is also disclosed.
Abstract:
A method of fabricating a diffractive optical element includes the steps of: etching a negative of a desired multi-level diffraction pattern onto a molding surface of a quartz master element using photolithography, assembling the master element as a portion of a mold,and injecting a plastic molding composition into the mold and against the molding surface of the master element to injection mold a diffractive optical element whereby the optical element has the desired diffraction pattern on its surface. The diffraction pattern is preferably formed on the quartz master using VLSI photolithography.
Abstract:
A beam homogenizer for converting an incident beam of non-uniform spatial power or energy distribution into an output beam of uniform spatial power or energy distribution. The homogenizer is a holographic optical element constructed from an array of facets or subholograms and positioned at a first plane in the path of an incident signal. The transmittance from each subhologram is uniformly spread across a target at a second plane that is spaced away from the first plane Another optical element, such as a holographic collimation element, may be placed at the second plane to collimate the transmittances thereupon.
Abstract:
A multichip module having high density optical and electrical interconnections between integrated circuit chips. An optically transparent substrate is positioned overlying an array of integrated circuit chips mounted on a mounting substrate. The mounting substrate may include a heat sink to remove excess heat from the integrated circuit chips. The multichip module includes integrated circuit chips having optical detectors and optical transmitters to establish optical interconnections therebetween. A hologram is positioned in the optical path between the optical transmitters and the optical detectors. A planar mirror is preferably positioned opposite the hologram to direct the optical beams. The optically transparent substrate also includes an array of electrical contact pads to establish electrical connections with corresponding electrical contact pads on the underlying integrated circuit chips. A pattern of electrical interconnection lines is provided on at least one of the mounting substrate or the transparent substrate to electrically interconnect predetermined ones of the integrated circuit chips.
Abstract:
A programmable optical interconnection apparatus and method in which a plurality of spatial light modulators (SLM) form a plurality of spatially modulated beams from a data signal. A hologram is responsive to the spatially modulated beams for generating at least two destructively interfering coherent beams at a first optical detector to thereby disconnect the data signal therefrom, and for simultaneously generating at least two constructively interfering coherent beams at a second optical detector to thereby connect the data signal beam thereto. The hologram is preferably a computer generated thin hologram which does not rely on Bragg diffraction. A low cost, high density, high efficiency programmable optical interconnect is thereby provided.
Abstract:
An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.
Abstract:
An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.
Abstract:
An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.