摘要:
An optical bidirectional link comprising: a module having a lower surface and an upper surface. The upper surface having disposed thereon a submodule having an optical transmitter and detector mounted thereon. Circuitry mounted on the upper surface. The circuitry having electronic components for effecting bidirectional communication via the optical transmitter and detector. A cover disposed over the upper surface of the module, wherein the submodule further comprises a silicon substrate having an optical fiber disposed in v-groove, a laser, reflective surfaces, and a holographic plate disposed on an upper surface of the silicon substrate.
摘要:
A camera system may include an optics stack including two substrates secured together in a vertical direction and an optical system on the two substrates, the two substrates having exposed sides, a detector on a detector substrate, and a stray light blocker directly on at least some sides of the optics stack.
摘要:
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers. An active element having a characteristic which changes in response to an applied field may be integrated on a bottom surface of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.
摘要:
An integrated micro-optical system includes at least two wafers with at least two optical elements provided on respective surfaces of the at least two wafers. An active element having a characteristic which changes in response to an applied field may be integrated on a bottom surface of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.
摘要:
An interface system includes separate optical and mechanical interfaces between opto-electronic devices and fibers. This allows each of these components to be optimized for their particular function. The mechanical interface includes an aperture through which light is transmitted between the fibers and optical element on the optical interface. Protruding features on the optical interface mate with the aperture in the mechanical interface to align the optics block with the mechanical interface.
摘要:
A micro-optical element includes a support substrate, a micro-optical lens in a cured replication material on a first surface of the support substrate, and an opaque material aligned with and overlapping the micro-optical lens along a vertical direction.
摘要:
In one aspect, the present invention provides a wafer level optical assembly comprising a first wafer level optical element, the first wafer level optical element comprising a first alignment structure and a second wafer level optical element, the second wafer level optical element comprising a second alignment structure, wherein the first alignment structure contacts the second alignment structure.
摘要:
The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.
摘要:
In one aspect, the present invention provides a wafer level optical assembly comprising a first wafer level optical element, the first wafer level optical element comprising a first alignment structure and a second wafer level optical element, the second wafer level optical element comprising a second alignment structure, wherein the first alignment structure contacts the second alignment structure.