METHOD FOR MANUFACTURING AERIAL IMAGE FORMATION DEVICE, AND AERIAL IMAGE FORMATION DEVICE

    公开(公告)号:US20240210724A1

    公开(公告)日:2024-06-27

    申请号:US18291347

    申请日:2022-03-10

    发明人: Makoto Otsubo

    摘要: An aerial image formation device 10 comprising two light control panels 28 each including a molding 21 being produced by using a transparent resin, the molding 21 including, on one surface side thereof, a plurality of straight grooves 18 disposed in parallel at a predetermined interval. The straight grooves 18 each have a trapezoidal cross section and expand on the one surface side of the molding 21, with one side surface serving as the vertical surface 16. In each of the two light control panels 28, an inner surface of each of the straight grooves 18 is covered with a light reflecting material 25 and an anti-reflection layer 27 is formed on a surface of the light reflecting material 25.

    Chip scale light-emitting diode package and manufacturing method thereof

    公开(公告)号:US12015101B2

    公开(公告)日:2024-06-18

    申请号:US17450181

    申请日:2021-10-07

    申请人: LUMENS CO., LTD.

    IPC分类号: H01L33/00 B29D11/00 H01L33/60

    摘要: A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.