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    METHOD FOR PRODUCING MULTILAYER CERAMIC ELECTRONIC COMPONENT
    21.
    发明申请
    METHOD FOR PRODUCING MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20180269000A1

    公开(公告)日：2018-09-20

    申请号：US15916727

    申请日：2018-03-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： HIDEHIKO TANAKA ,  Toshikazu Makino ,  Shinji Otani

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008

    Abstract: A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.

    Multilayer ceramic capacitor
    22.
    发明授权
    Multilayer ceramic capacitor 有权

    公开(公告)号：US09947473B2

    公开(公告)日：2018-04-17

    申请号：US15173811

    申请日：2016-06-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji Otani

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/005 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

    Abstract: A multilayer ceramic capacitor includes a multilayer body and a pair of outer electrodes on end surfaces of the multilayer body. The multilayer body includes a stack of ceramic layers and inner electrodes electrically connected to the outer electrodes. Each of the pair of outer electrodes includes an underlying electrode layer on a surface of the multilayer body, an intermediate metal layer on a surface of the underlying electrode layer, and a conductive resin layer on a surface of the intermediate metal layer. The underlying electrode layer contains Ni, and the intermediate metal layer contains a Cu—Ni—Sn alloy.

    Solid electrolytic capacitor and manufacturing method therefor
    24.
    发明授权
    Solid electrolytic capacitor and manufacturing method therefor 有权
    固体电解电容器及其制造方法

    公开(公告)号：US09490076B2

    公开(公告)日：2016-11-08

    申请号：US14295626

    申请日：2014-06-04

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Shinji Otani ,  Koji Fujimoto ,  Yoshihiro Koshido

    IPC: H01G9/00 ,  H01G9/012 ,  H01G9/14 ,  H01G9/15

    CPC classification number: H01G9/012 ,  H01G9/0032 ,  H01G9/14 ,  H01G9/15 ,  Y10T29/417

    Abstract: A solid electrolytic capacitor that includes: a laminated body having a plurality of capacitor elements stacked to have principal surfaces thereof overlapped with each other. The capacitor elements each include a valve-action metallic substrate having two principal surfaces opposed to each other, a dielectric oxide film covering a surface of the valve-action metallic substrate, and a cathode layer covering a surface of the dielectric oxide film. The laminated body has two principal surfaces and more than one side surface, and has at least one of the side surfaces with the valve-action metallic substrates exposed. An anode terminal is electrically connected to the side surface of the laminated body having the valve-action metallic substrates exposed therefrom, and the cathode layers and the anode terminal are insulated with insulators interposed therebetween, the insulators being obtained from the cathode layers.

    Abstract translation: 一种固体电解电容器，包括：层叠体，其具有堆叠成使其主面重叠的多个电容器元件。 电容器元件各自包括具有彼此相对的两个主表面的阀作用金属基板，覆盖阀作用金属基板的表面的电介质氧化物膜和覆盖电介质氧化物膜的表面的阴极层。 层叠体具有两个主表面和多于一个侧表面，并且具有露出有阀作用的金属基底的至少一个侧表面。 阳极端子电连接到具有从其暴露的阀作用金属基板的层叠体的侧表面，阴极层和阳极端子绝缘，绝缘体插入其间，绝缘体由阴极层获得。

    Chip-type ceramic electronic component and producing method thereof
    25.
    发明授权
    Chip-type ceramic electronic component and producing method thereof 有权
    片式陶瓷电子元件及其制造方法

    公开(公告)号：US09078359B2

    公开(公告)日：2015-07-07

    申请号：US13864617

    申请日：2013-04-17

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Shinji Otani

    IPC: H01G4/30 ,  H01G4/228 ,  H05K1/02 ,  H01G4/12 ,  H01G4/232 ,  H05K1/03

    CPC classification number: H05K1/0271 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/0306 ,  Y10T29/435

    Abstract: The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz1 and Rz2 satisfies the following requirement: Rz1>Rz2, Rz1>3.3 μm, and Rz2

    Abstract translation: 电子部件具有在陶瓷基体的表面上构成外部电极的树脂电极。 至少在本体的另一面上延伸的树脂电极区域的末端部分接合到陶瓷基体上，并且Rz1和Rz2之间的关系满足以下要求：Rz1> Rz2，Rz1>3.3μm，Rz2 < 3.2μm，其中Rz1是陶瓷基体的与顶部接合的表面的第一区域的十点平均表面粗糙度，Rz2是表面的第二区域的十点平均表面粗糙度 不形成外部电极的陶瓷基体。

    Electronic component
    26.
    发明授权
    Electronic component 有权

    公开(公告)号：US12020852B2

    公开(公告)日：2024-06-25

    申请号：US17371793

    申请日：2021-07-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji Otani ,  Hiroki Imaeda ,  Namiko Sasajima ,  Tomohiro Sunaga ,  Masami Okado ,  Yoshimasa Yoshioka

    IPC: H01F27/29 ,  H01F27/255 ,  H01F27/28

    CPC classification number: H01F27/292 ,  H01F27/255 ,  H01F27/2804 ,  H01F2027/2809

    Abstract: An electronic component includes a composite body made of a composite material of resin and magnetic metal particles, an inner electrode which is provided in the composite body and which has an end surface exposed from an outer surface of the composite body, and a metal film provided on the outer surface of the composite body and on the end surface of the inner electrode. The metal film includes a first region provided on the end surface of the inner electrode and a second region which is in contact with the magnetic metal particles exposed at the outer surface of the composite body and which is provided on the outer surface of the composite body. The thickness of the first region is less than the thickness of the second region.

    Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component
    29.
    发明授权
    Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component 有权

    公开(公告)号：US11626250B2

    公开(公告)日：2023-04-11

    申请号：US17031971

    申请日：2020-09-25

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji Otani ,  Hidehiko Tanaka

    IPC: H01G4/30 ,  H01G4/012

    Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

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