公开(公告)号：US11721469B2

公开(公告)日：2023-08-08

申请号：US16995176

申请日：2020-08-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinji Otani ,  Hiroki Imaeda ,  Namiko Sasajima ,  Tomohiro Sunaga ,  Masami Okado ,  Yoshimasa Yoshioka

IPC: H01F17/04 ,  H01F27/255 ,  H01F41/04 ,  H01F1/14 ,  H01F1/06 ,  H01F1/26 ,  H01F27/29 ,  H01F41/10 ,  H01F17/00

CPC classification number: H01F17/04 ,  H01F1/06 ,  H01F1/14 ,  H01F1/26 ,  H01F27/255 ,  H01F27/292 ,  H01F41/04 ,  H01F41/046 ,  H01F41/10 ,  H01F17/0006 ,  H01F2017/0066 ,  H01F2017/048 ,  Y10T428/32

Abstract: An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Ni and is in contact with the resin and the magnetic metal powder.

公开(公告)号：US11810706B2

公开(公告)日：2023-11-07

申请号：US16830170

申请日：2020-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Namiko Sasajima ,  Hiroki Imaeda ,  Masami Okado ,  Shinji Otani ,  Tomohiro Sunaga ,  Yoshimasa Yoshioka

IPC: H01F27/06 ,  H01F27/255 ,  H01F27/29

CPC classification number: H01F27/06 ,  H01F27/255 ,  H01F27/29

Abstract: An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.

公开(公告)号：US11798723B2

公开(公告)日：2023-10-24

申请号：US16830178

申请日：2020-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Namiko Sasajima ,  Hiroki Imaeda ,  Masami Okado ,  Shinji Otani ,  Tomohiro Sunaga ,  Yoshimasa Yoshioka

IPC: H01F27/29 ,  H01F27/06 ,  H01F41/04 ,  H01F27/255

CPC classification number: H01F27/06 ,  H01F27/255 ,  H01F27/29 ,  H01F41/04

Abstract: A multilayer metal film disposed on a base having insulating properties includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film covering the first metal film from a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film, the catalytic layer having a protruding portion protruding toward the second metal film, the protruding portion extending into the second metal film.

公开(公告)号：US12288636B2

公开(公告)日：2025-04-29

申请号：US17371693

申请日：2021-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinji Otani ,  Hiroki Imaeda ,  Namiko Sasajima ,  Tomohiro Sunaga ,  Masami Okado ,  Yoshimasa Yoshioka

IPC: H01F27/28 ,  H01F27/25 ,  H01F27/255 ,  H01F41/04

Abstract: An electronic component includes a composite body containing resin and magnetic metal particles, a first metal film provided on an outer surface of the composite body, and a second metal film provided on the first metal film. At least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film. The first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface. The film thickness of the first metal film on the exposed surface is 2.9 μm or more.

公开(公告)号：US20150072165A1

公开(公告)日：2015-03-12

申请号：US14547262

申请日：2014-11-19

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Tomohiro Sunaga ,  Daisuke Megumi ,  Yoshihiko Takano ,  Hidekiyo Takaoka

IPC: H05K3/40 ,  B23K35/26 ,  B23K35/02 ,  C25D3/56 ,  C25D5/16

CPC classification number: H05K3/40 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/226 ,  B23K35/262 ,  B23K2101/42 ,  C23C28/02 ,  C23C28/021 ,  C25D3/56 ,  C25D3/58 ,  C25D5/10 ,  C25D5/16 ,  C25D5/18 ,  C25D5/505 ,  C25D21/12 ,  C25D21/14 ,  H05K3/225 ,  H05K3/244 ,  H05K3/341 ,  H05K2201/0338 ,  H05K2203/04 ,  Y10T428/12458

Abstract: A bonding member that includes a plating film containing a Cu—Ni alloy as its main constituent. In this plating film, the Cu mass ratio Cu/(Cu+Ni) is increased and decreased between 0.7 and 0.97 in the film thickness direction. In addition, the amplitude between the increase and decrease in the Cu mass ratio is larger than 0.1. Therefore, when the plating film containing the Cu—Ni alloy as its main constituent and Sn-based solder material or the like are joined by soldering, an intermetallic compound layer with a high melting point is formed. In addition, the plating film has a layer with a slow reaction rate, and thus can slow the reaction rate of alloying reaction between the Cu—Ni alloy and a Sn-based metal.

Abstract translation: 一种接合构件，其包括以Cu-Ni合金为主要成分的镀膜。 在该镀膜中，铜质量比Cu /（Cu + Ni）在膜厚方向上增加0.7〜0.97。 此外，Cu质量比的增加和减小之间的幅度大于0.1。 因此，当通过焊接将包含Cu-Ni合金作为其主要成分的电镀膜和Sn基焊料等接合时，形成具有高熔点的金属间化合物层。 此外，电镀膜具有反应速度慢的层，因此可以降低Cu-Ni合金与Sn系金属之间的合金化反应的反应速度。

公开(公告)号：US12020852B2

公开(公告)日：2024-06-25

申请号：US17371793

申请日：2021-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinji Otani ,  Hiroki Imaeda ,  Namiko Sasajima ,  Tomohiro Sunaga ,  Masami Okado ,  Yoshimasa Yoshioka

IPC: H01F27/29 ,  H01F27/255 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F27/255 ,  H01F27/2804 ,  H01F2027/2809

Abstract: An electronic component includes a composite body made of a composite material of resin and magnetic metal particles, an inner electrode which is provided in the composite body and which has an end surface exposed from an outer surface of the composite body, and a metal film provided on the outer surface of the composite body and on the end surface of the inner electrode. The metal film includes a first region provided on the end surface of the inner electrode and a second region which is in contact with the magnetic metal particles exposed at the outer surface of the composite body and which is provided on the outer surface of the composite body. The thickness of the first region is less than the thickness of the second region.

公开(公告)号：US11804325B2

公开(公告)日：2023-10-31

申请号：US16995103

申请日：2020-08-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinji Otani ,  Hiroki Imaeda ,  Namiko Sasajima ,  Tomohiro Sunaga ,  Masami Okado ,  Yoshimasa Yoshioka

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/255 ,  H01F41/02 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F27/255 ,  H01F41/0246 ,  H01F41/041 ,  H01F2027/2809

Abstract: An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Cu, further contains Fe, and is in contact with the resin and the magnetic metal powder.

公开(公告)号：US11694839B2

公开(公告)日：2023-07-04

申请号：US16890947

申请日：2020-06-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Namiko Sasajima ,  Hiroki Imaeda ,  Masami Okado ,  Shinji Otani ,  Tomohiro Sunaga ,  Yoshimasa Yoshioka

IPC: H01F27/29 ,  H01F17/00

CPC classification number: H01F27/292 ,  H01F17/0013

Abstract: A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.