摘要:
A method for analyzing asymmetric structures (including isolated and periodic structures) includes a split detector for use in a broadband spectrometer. The split has detector has separate right and left halves. By independently measuring and comparing the right and left scattered rays, information about asymmetries can be determined.
摘要:
A composite metrology tool, measures basic optical parameters of thin films (e.g., thickness, index of refraction, and birefringence) and stress (e.g., wafer displacements, such as bow and warp). These measurements are combined (e.g. in a processor) using optimization techniques to yield accurate overall information of the wafer parameters.
摘要:
An method and apparatus are disclosed for accurately and repeatably determining the thickness of a thin film on a substrate. A rotating compensator ellipsometer is used which generates both 2&ohgr; and 4&ohgr; output signals. The. 4&ohgr; omega signal is used to provide an indication of the temperature of the sample. This information is used to correct the analysis of the thin film based on the 2&ohgr; signal. These two different signals generated by a single device provide independent measurements of temperature and thickness and can be used to accurately analyze a sample whose temperature is unknown.
摘要:
An optical measurement system is disclosed for evaluating samples with multi-layer thin film stacks. The optical measurement system includes a reference ellipsometer and one or more non-contact optical measurement devices. The reference ellipsometer is used to calibrate the other optical measurement devices. Once calibration is completed, the system can be used to analyze multi-layer thin film stacks. In particular, the reference ellipsometer provides a measurement which can be used to determine the total optical thickness of the stack. Using that information coupled with the measurements made by the other optical measurement devices, more accurate information about individual layers can be obtained.
摘要:
A method and apparatus is disclosed for measuring the thickness or other optical constants of a thin film on a sample. The apparatus includes a laser for generating a linearly polarized probe beam. The probe beam is tightly focused on the sample surface to create a spread of angles of incidence. The reflected probe beam is passed through a quarter-wave plate and linear polarizer before impinging on a quad cell photodetector. The output signals from the photodetector represent an integration of the intensity of individual rays having various angles of incidence. By taking the difference between the sums of the output signals of diametrically opposed quadrants, a value can be obtained which varies linearly with film thickness for very thin films. The subject device can be used in conjunction with other prior devices to enhance sensitivity for thicker films.
摘要:
A method and apparatus is disclosed for evaluating surface and subsurface features in a sample by detecting scattering of a probe beam. More particularly, the subject invention relates to the detection of thermal and/or plasma waves through the phenomenon of optical scattering. The apparatus includes a periodic excitation source for supplying energy to the surface of the sample to generate thermal and/or plasma waves. A radiation probe is directed to the surface of the sample within the area that is being periodically excited and in a manner that the probe beam is scattered from the excited area. Variations of the intensity of the scattered probe beam are detected and processed to evaluate surface and subsurface characteristics of the sample.
摘要:
A method for analyzing asymmetric structures (including isolated and periodic structures) includes a split detector for use in a broadband spectrometer. The split has detector has separate right and left halves. By independently measuring and comparing the right and left scattered rays, information about asymmetries can be determined.
摘要:
A method is disclosed for evaluating isolated and aperiodic structure on a semiconductor sample. A probe beam from a coherent laser source is focused onto the structure in a manner to create a spread of angles incidence. The reflected light is monitored with an array detector. The intensity or polarization state of the reflected beam as a function of radial position within the beam is measured. Each measurement includes both specularly reflected light as well as light that has been scattered from the aperiodic structure into that detection position. The resulting output is evaluated using an aperiodic analysis to determine the geometry of the structure.
摘要:
The teachings of the subject invention lead to a new application of the XRR and RXRR systems. In particular, it has been recognized for the first time that such systems can be used to measure thickness of a variety of thin films (both dielectric, opaque and metal films) on patterned wafers where the feature size is smaller than the measurement spot. Broadly speaking, one aspect of the invention is the recognition that XRR and RXRR systems can be used not only on test wafers but on patterned wafers as well. The approach of the present invention to measuring the film thicknesses of patterned semiconductor wafers using XRR relies on the recognition that the measured X-ray reflection curve can be attributed primarily to the thicknesses of the layers rather than the structure of the pattern. In one aspect of the present invention, analysis of the patterned wafer may be reduced to the problem of analyzing an unpatterned wafer through a relatively simple transformation of the data. In another aspect of the present invention, analysis of the patterned wafer may be simplified by using a Fourier transform analysis.
摘要:
This invention provides a measurement device that includes both an X-ray reflectometer and a thermal or plasma wave measurement module for determining the characteristics of a sample. Preferably, these two measurement modules are combined into a unitary apparatus and arranged to be able to take measurements at the same location on the wafer. A processor will receive data from both modules and combine that data to resolve ambiguities about the characteristics of the sample. The processor can be part of the device or separate therefrom as long as the measurement data is transferred to the processor.