公开(公告)号：US20100181100A1

公开(公告)日：2010-07-22

申请号：US12690949

申请日：2010-01-21

申请人： Hiroshi NAKANO ,  Hitoshi SUZUKI ,  Toshio HABA ,  Haruo AKAHOSHI ,  Hiroshi YOSHIDA ,  Akira CHINDA

发明人： Hiroshi NAKANO ,  Hitoshi SUZUKI ,  Toshio HABA ,  Haruo AKAHOSHI ,  Hiroshi YOSHIDA ,  Akira CHINDA

IPC分类号： H05K1/09 ,  H05K1/00 ,  H05K1/11 ,  B05D5/12 ,  C25D5/02

CPC分类号： C25D3/38 ,  C25D5/02 ,  H05K1/111 ,  H05K3/045 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/09472 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/0108 ,  H05K2203/0723

摘要： A copper wiring board having fine wiring, and a method for manufacturing the same are provided. The copper wiring board of the present invention is a wiring board comprising an insulating substrate, a plurality of wire trenches formed in the insulating substrate, and wires filled in the wire trenches, wherein when any two of the wires are selected, and cross sections are taken perpendicular to a direction of current flow in the wires, a wire width in one wire cross section is narrower than a wire width in the other wire cross section, and a wire thickness in the one wire cross section is thicker than a wire thickness in the other wire cross section.

摘要翻译： 提供具有精细布线的铜布线板及其制造方法。 本发明的铜线路板是包括绝缘基板，形成在绝缘基板中的多个线沟槽和填充在线槽中的导线的布线板，其中当选择任何两条导线时，横截面为 垂直于电线中的电流方向取向，一根线横截面中的线宽比另一条线截面中的线宽窄，并且一条线横截面中的线厚度比线材厚度厚 另一条线截面。

公开(公告)号：US20080019807A1

公开(公告)日：2008-01-24

申请号：US11736357

申请日：2007-04-17

申请人： Hitoshi SUZUKI ,  Toshihiko Miyajima

发明人： Hitoshi SUZUKI ,  Toshihiko Miyajima

IPC分类号： H01L21/677

CPC分类号： H01L21/6719 ,  Y10S414/139

摘要： In a load port apparatus, a slit is formed between an inner circumferential surface of an opening on a wall of the chamber of the apparatus and an outer circumferential surface of a door. In a predetermined section of the slit, the slit width at the chamber side opening of the slit is made larger than the slit width at other positions with respect to the depth direction of the slit. By this feature, gas flow from the interior of the load port apparatus to the exterior through a clearance formed between the inner surface of the opening that allows to bring wafers out of/into a pod and the door that substantially closes the opening can be made stable.

摘要翻译： 在装载口装置中，在装置的室壁的开口的内周面与门的外周面之间形成狭缝。 在狭缝的预定部分中，狭缝的室侧开口处的狭缝宽度比在狭缝的深度方向的其它位置处的狭缝宽度大。 通过这个特征，可以使气流从负载端口装置的内部通过形成在允许将晶片排出/进入荚的开口的内表面之间的间隙和基本上封闭开口的门形成的外部 稳定。