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公开(公告)号:US20090065594A1
公开(公告)日:2009-03-12
申请号:US12276444
申请日:2008-11-24
申请人: Noboru Kato , Yuya Dokai , Satoshi Ishino
发明人: Noboru Kato , Yuya Dokai , Satoshi Ishino
IPC分类号: G06K19/077
CPC分类号: H01Q1/2208 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01F17/0006 , H01F38/14 , H01L23/49855 , H01L2224/16225 , H01L2924/09701 , H01L2924/3011 , H01Q1/2283 , H01Q1/242 , H01Q1/50 , H01Q7/00 , H01Q23/00 , H01Q25/02
摘要: A wireless IC device includes a wireless IC chip, a feed circuit board having the wireless IC chip mounted thereon and including a feed circuit including inductance elements, and a radiation plate electromagnetically coupled to the inductance elements in the feed circuit. A high-permeability magnetic body made of a high-permeability magnetic material is provided in the feed circuit board and a portion of the inductance elements is provided in the high-permeability magnetic body.
摘要翻译: 无线IC器件包括无线IC芯片,其上安装有无线IC芯片的馈电电路板,并且包括具有电感元件的馈电电路,以及电磁耦合到馈电电路中的电感元件的辐射板。 由高磁导率磁性材料制成的高导磁率磁体设置在馈电电路板中,并且电感元件的一部分设置在高磁导率磁体中。
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公开(公告)号:US08676117B2
公开(公告)日:2014-03-18
申请号:US13567108
申请日:2012-08-06
申请人: Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人: Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC分类号: H04B5/00
CPC分类号: H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
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公开(公告)号:US07519328B2
公开(公告)日:2009-04-14
申请号:US11624382
申请日:2007-01-18
申请人: Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人: Yuya Dokai , Noboru Kato , Satoshi Ishino
CPC分类号: H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译: 无线IC器件包括无线IC芯片,安装有无线IC芯片的电源电路板,并且其中设置有电源电路,电源电路包括具有预定谐振频率的谐振电路,以及 辐射图案,其粘附到电源电路板的下侧,用于辐射从电源电路提供的传输信号,并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板,无线IC芯片和辐射图之间通过直流连接,磁耦合或电容耦合连接。
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公开(公告)号:US08544754B2
公开(公告)日:2013-10-01
申请号:US12276444
申请日:2008-11-24
申请人: Noboru Kato , Yuya Dokai , Satoshi Ishino
发明人: Noboru Kato , Yuya Dokai , Satoshi Ishino
IPC分类号: G06K19/06
CPC分类号: H01Q1/2208 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01F17/0006 , H01F38/14 , H01L23/49855 , H01L2224/16225 , H01L2924/09701 , H01L2924/3011 , H01Q1/2283 , H01Q1/242 , H01Q1/50 , H01Q7/00 , H01Q23/00 , H01Q25/02
摘要: A wireless IC device includes a wireless IC chip, a feed circuit board having the wireless IC chip mounted thereon and including a feed circuit including inductance elements, and a radiation plate electromagnetically coupled to the inductance elements in the feed circuit. A high-permeability magnetic body made of a high-permeability magnetic material is provided in the feed circuit board and a portion of the inductance elements is provided in the high-permeability magnetic body.
摘要翻译: 无线IC器件包括无线IC芯片,其上安装有无线IC芯片的馈电电路板,并且包括具有电感元件的馈电电路,以及电磁耦合到馈电电路中的电感元件的辐射板。 由高磁导率磁性材料制成的高导磁率磁体设置在馈电电路板中,并且电感元件的一部分设置在高磁导率磁体中。
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公开(公告)号:US08326223B2
公开(公告)日:2012-12-04
申请号:US12714607
申请日:2010-03-01
申请人: Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人: Yuya Dokai , Noboru Kato , Satoshi Ishino
CPC分类号: H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译: 无线IC器件包括无线IC芯片,安装有无线IC芯片的电源电路板,并且其中设置有电源电路,电源电路包括具有预定谐振频率的谐振电路,以及 辐射图案,其粘附到电源电路板的下侧,用于辐射从电源电路提供的传输信号,并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板,无线IC芯片和辐射图之间通过直流连接,磁耦合或电容耦合连接。
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公开(公告)号:US07764928B2
公开(公告)日:2010-07-27
申请号:US11930818
申请日:2007-10-31
申请人: Yuya Dokai , Noboru Kato , Satoshi Ishino
发明人: Yuya Dokai , Noboru Kato , Satoshi Ishino
CPC分类号: H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
摘要: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
摘要翻译: 无线IC器件包括无线IC芯片,安装有无线IC芯片的电源电路板,并且其中设置有电源电路,电源电路包括具有预定谐振频率的谐振电路,以及 辐射图案,其粘附到电源电路板的下侧,用于辐射从电源电路提供的传输信号,并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板,无线IC芯片和辐射图之间通过直流连接,磁耦合或电容耦合连接。
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公开(公告)号:US09064198B2
公开(公告)日:2015-06-23
申请号:US11740509
申请日:2007-04-26
申请人: Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
发明人: Noboru Kato , Ikuhei Kimura , Kimikazu Iwasaki , Satoshi Ishino
IPC分类号: G08B13/14 , G06K19/077
CPC分类号: H02J50/12 , G06K19/07749 , G06K19/07771 , G06K19/07773 , H01L2224/16227 , H02J17/00
摘要: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.
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公开(公告)号:US08757500B2
公开(公告)日:2014-06-24
申请号:US12603608
申请日:2009-10-22
申请人: Noboru Kato , Yuya Dokai
发明人: Noboru Kato , Yuya Dokai
IPC分类号: G06K19/06
CPC分类号: G06K19/07749 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01Q1/2225 , H01Q1/40 , H01Q7/00
摘要: A wireless IC device has a structure such that the size of a radiation plate and a radiation characteristic may be determined irrespective of an impedance of a wireless IC chip. The wireless IC device includes a wireless IC chip that is arranged to process transmission and reception signals, a spiral matching inductance element and a plane electrode that are located on a surface of a feeder circuit substrate, and a coil-shaped radiation plate located on a radiation substrate. Plane electrodes connected to both ends of the radiation plate are electromagnetically coupled respectively to the inductance element and the plane electrode. The wireless IC chip is operated by a signal received by the radiation plate, and a response signal from the wireless IC chip is radiated outside from the radiation plate.
摘要翻译: 无线IC器件具有能够确定辐射板的尺寸和辐射特性而不考虑无线IC芯片的阻抗的结构。 无线IC器件包括布置成处理发送和接收信号的无线IC芯片,位于馈电电路基板的表面上的螺旋匹配电感元件和平面电极以及位于馈电电路基板的表面上的线圈形辐射板 辐射基板。 连接到辐射板两端的平面电极分别电磁耦合到电感元件和平面电极。 无线IC芯片由辐射板接收的信号操作,并且来自无线IC芯片的响应信号从辐射板向外辐射。
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公开(公告)号:US20090109102A1
公开(公告)日:2009-04-30
申请号:US12350307
申请日:2009-01-08
申请人: Yuya Dokai , Noboru Kato
发明人: Yuya Dokai , Noboru Kato
CPC分类号: H01Q1/2225 , G06K7/10178 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01Q21/28
摘要: An antenna includes a feeder terminal and a resonance circuit. The resonance circuit is defined by a capacitance element and an inductance element and includes first and second radiation plates. The capacitance element is electromagnetically coupled to the first radiation plate, and the inductance element is electromagnetically coupled to the second radiation plate. A radio IC device includes an electromagnetic coupling module including a feeder circuit substrate on which a radio IC chip is mounted, and radiation plates. The feeder circuit substrate includes an inductance element and a capacitance element. One of the radiation plates faces and is magnetically coupled to the inductance element. The other radiation plate faces and is electrically coupled to the capacitance element. The radio IC chip is operated by signals received by the radiation plates, and a response signal from the radio IC chip is radiated from the radiation plates.
摘要翻译: 天线包括馈线端子和谐振电路。 谐振电路由电容元件和电感元件限定,并且包括第一和第二辐射板。 电容元件与第一辐射板电磁耦合,电感元件与第二辐射板电磁耦合。 无线IC设备包括电磁耦合模块,其包括安装无线IC芯片的馈电电路基板和辐射板。 馈电电路基板包括电感元件和电容元件。 辐射板之一面向磁耦合到电感元件。 另一个辐射板面并且电耦合到电容元件。 无线电IC芯片由辐射板接收的信号操作,并且来自无线IC芯片的响应信号从辐射板辐射。
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公开(公告)号:US09024837B2
公开(公告)日:2015-05-05
申请号:US13613021
申请日:2012-09-13
申请人: Yuya Dokai , Noboru Kato
发明人: Yuya Dokai , Noboru Kato
CPC分类号: H01Q1/2208 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/16 , H01Q21/30
摘要: An antenna and a wireless communication device which are suitable for an RFID system and in which radiation characteristics are prevented from being changed as a result of impedance adjustment are configured such that the antenna includes a first loop electrode that has an external shape of a regular polygon or circle and that includes a pair of open ends, feeding portions arranged inside the first loop electrode, a second loop electrode connected to the feeding portions, and a coupling electrode that couples the first loop electrode and the second loop electrode to each other. The wireless communication device is obtained by coupling the wireless communication element which processes a high-frequency signal to the feeding portions.
摘要翻译: 适用于RFID系统并且其中防止辐射特性作为阻抗调整的结果的天线和无线通信设备被配置为使得天线包括具有正多边形的外部形状的第一环形电极 或圆形,并且包括一对开口端,布置在第一环形电极内部的馈电部分,连接到馈电部分的第二环形电极,以及将第一环形电极和第二环形电极彼此耦合的耦合电极。 通过将处理高频信号的无线通信元件耦合到馈送部分来获得无线通信设备。
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