公开(公告)号：US09311765B2

公开(公告)日：2016-04-12

申请号：US13508178

申请日：2010-11-05

申请人： Toru Akamatsu ,  Masaki Inoue ,  Masakazu Sakata

发明人： Toru Akamatsu ,  Masaki Inoue ,  Masakazu Sakata

IPC分类号： G07F7/04 ,  G07D11/00 ,  B65H29/12 ,  B65H33/16 ,  B65H31/30

CPC分类号： G07D11/00 ,  B65H29/12 ,  B65H29/125 ,  B65H31/3009 ,  B65H31/3027 ,  B65H33/16 ,  G07D11/0003 ,  G07D11/0009 ,  G07D11/0018 ,  G07D11/0021 ,  G07D11/0024 ,  G07D11/0084

摘要： A banknote deposit apparatus includes: a storing box 70 configured to receive the banknote stacked in a stacking unit 60 so as to store the banknote; and a clamping and transporting mechanism 10 configured to clamp surfaces of the banknote stacked in the stacking unit 60 and to transport the banknote to a direction parallel to the surfaces of the clamped banknote so as to store the banknote in the storing box. A front opening 61 through which the stacked banknote is taken out from outside, and a front shutter unit 62 configured to open and close the front opening are disposed on a front surface of the stacking unit 60.

摘要翻译： 纸币存放装置包括：存储箱70，被配置为接收堆叠在堆垛单元60中以便存储钞票的纸币; 以及夹持传送机构10，其构造成夹持堆叠在堆叠单元60中的纸币的表面，并将纸币输送到与夹持的纸币的表面平行的方向，以将纸币存储在存储箱中。 堆叠的纸币从外部取出的前开口61和构造成打开和关闭前开口的前快门单元62设置在堆叠单元60的前表面上。

公开(公告)号：US09076644B2

公开(公告)日：2015-07-07

申请号：US13980144

申请日：2012-01-16

申请人： Masakazu Sakata ,  Hidehiro Yanai

发明人： Masakazu Sakata ,  Hidehiro Yanai

IPC分类号： C23C16/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/02104 ,  H01L21/6719 ,  H01L21/67781 ,  H01L21/68742 ,  H01L21/6875

摘要： A substrate processing apparatus of the present invention includes a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face; a heating element arranged in the substrate placement stage and configured to heat the substrate; a plurality of struts configured to support the flange from below, and an exhaust unit configured to exhaust an atmosphere in the process chamber, wherein the supporting member is provided between the substrate placement stage and the plurality of struts.

摘要翻译： 本发明的基板处理装置包括：安装在处理室中的基板放置台，其构造为将基板设置在基板配置面上，在其侧面设置有凸缘; 加热元件，其布置在所述基板放置台中并且构造成加热所述基板; 多个支柱，其构造成从下方支撑凸缘;以及排气单元，其构造成排出处理室中的气氛，其中所述支撑构件设置在所述基板放置台和所述多个支柱之间。

公开(公告)号：US07923380B2

公开(公告)日：2011-04-12

申请号：US12585342

申请日：2009-09-11

申请人： Hidehiro Yanai ,  Masakazu Sakata ,  Akira Takahashi

发明人： Hidehiro Yanai ,  Masakazu Sakata ,  Akira Takahashi

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L21/67748 ,  H01L21/6719

摘要： A substrate processing apparatus includes a processing chamber that processes a substrate, and a substrate placing base enclosed in the processing chamber, and a substrate transporting member that allows the substrate to wait temporarily on the substrate placing base, and exhaust holes provided so as to surround the substrate placing base, and a retracting space that allows the substrate transporting member to move in between lines each connecting the exhaust hole and an upper end of the substrate placing base and the substrate placing base.

摘要翻译： 基板处理装置包括处理基板的处理室和封装在处理室中的基板放置基板以及允许基板在基板放置基板上暂时等待的基板输送部件，以及围绕设置的排气孔 基板放置基座以及使基板搬运部件在连接排气孔和基板载置台以及基板载置台的上端的配线之间移动的回缩空间。

公开(公告)号：US20060028129A1

公开(公告)日：2006-02-09

申请号：US11091344

申请日：2005-03-29

申请人： Takahisa Sakakibara ,  Masakazu Sakata ,  Masaya Nakai ,  Hiroshi Kanno ,  Kazuki Nishimura ,  Hiroaki Izumi

发明人： Takahisa Sakakibara ,  Masakazu Sakata ,  Masaya Nakai ,  Hiroshi Kanno ,  Kazuki Nishimura ,  Hiroaki Izumi

IPC分类号： H05B33/12

CPC分类号： H01L51/5088 ,  H01L51/0078 ,  H01L51/0095 ,  H01L2251/558

摘要： A hole injection electrode of a transparent conductive film such as indium-zinc-oxide is formed on a substrate, and a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are formed in this order on the hole injection electrode. Then, an electron injection electrode made of a material such as aluminum is formed on the electron transport layer. The hole injection layer is made for example of fluorocarbon (CFx). The thickness of the hole injection layer is preferably in the range from 30 Å to 90 Å.

摘要翻译： 在衬底上形成诸如氧化铟锌的透明导电膜的空穴注入电极，并且在空穴注入层，空穴传输层，发光层和电子传输层上依次形成 空穴注入电极。 然后，在电子传输层上形成由诸如铝的材料制成的电子注入电极。 空穴注入层例如由碳氟化合物（CFx）制成。 空穴注入层的厚度优选在30〜90的范围内。

公开(公告)号：US20050084709A1

公开(公告)日：2005-04-21

申请号：US10813624

申请日：2004-03-31

申请人： Yuji Hamada ,  Masakazu Sakata

发明人： Yuji Hamada ,  Masakazu Sakata

IPC分类号： H01L51/50 ,  G09G3/30 ,  H01L51/00 ,  H05B33/00 ,  H05B33/12 ,  H05B33/14 ,  H05B33/18 ,  H05B33/22

CPC分类号： H01L51/0025 ,  H01L51/5012 ,  H01L51/5048

摘要： In an organic EL device whose any layer of organic compound layers contains a phenylamine derivative (NPB, for instance), the weight concentration of copper atoms contained in the organic compound layer is controlled to not higher than 500 ppm, the weight concentration of aluminum atoms contained in the organic compound layer is controlled to not higher than 800 ppm, and the weight concentration of iron atoms contained in the organic compound layer is controlled to not higher than 800 ppm. Furthermore, the weight concentration of nickel atoms contained in the organic compound layer is controlled to not higher than 900 ppm, and the weight concentration of sodium atoms contained in the organic compound layer is controlled to not higher than 1000 ppm.

摘要翻译： 在有机化合物层的任何层含有苯胺衍生物（例如，NPB）的有机EL元件中，将有机化合物层中所含的铜原子的重量浓度控制为不高于500ppm，铝原子的重量浓度 将含有有机化合物层中的铁原子的重量浓度控制在不高于800ppm的范围内。 此外，将有机化合物层中所含的镍原子的重量浓度控制为不高于900ppm，将有机化合物层中所含的钠原子的重量浓度控制为不高于1000ppm。

公开(公告)号：US4874646A

公开(公告)日：1989-10-17

申请号：US196170

申请日：1988-05-17

申请人： Yoshikazu Tsujino ,  Yuuji Hamada ,  Masakazu Sakata ,  Takanori Fujii ,  Yukinori Kuwano

发明人： Yoshikazu Tsujino ,  Yuuji Hamada ,  Masakazu Sakata ,  Takanori Fujii ,  Yukinori Kuwano

IPC分类号： C25D7/00 ,  B05D3/06 ,  B23K26/00 ,  B29C49/00 ,  B29C49/58 ,  B29C67/00 ,  B29D23/00 ,  G02B6/13 ,  G03F7/00 ,  G03F7/26 ,  H01L21/027 ,  H01L23/473

CPC分类号： H01L23/473 ,  B05D3/06 ,  B29C49/58 ,  B29C67/00 ,  G02B6/13 ,  B29C2791/009 ,  B29C49/00 ,  B29L2023/00 ,  B29L2031/756 ,  H01L2924/0002 ,  Y10S428/913 ,  Y10S430/146 ,  Y10T428/13 ,  Y10T428/1321

摘要： An ultrafine tube is produced by a method comprising the steps of applying a highly polymerized material on a substrate to form a resist layer on a surface of said substrate, applying a laser beam to the resist layer under such a condition that said resist layer is melted to form an ultrafine tube between the substrate and resist layer in the predetermined pattern.

摘要翻译： 通过以下方法制造超细管，该方法包括以下步骤：在基板上施加高度聚合的材料，以在所述基板的表面上形成抗蚀剂层，在所述抗蚀剂层熔化的条件下，将激光束施加到抗蚀剂层 以预定图案在基板和抗蚀剂层之间形成超细管。

公开(公告)号：US08789511B2

公开(公告)日：2014-07-29

申请号：US13211551

申请日：2011-08-17

申请人： Masakazu Sakata

发明人： Masakazu Sakata

IPC分类号： F02M1/00 ,  F02D41/38 ,  F02D41/24

CPC分类号： F02D41/2451 ,  F02D41/2464 ,  F02D41/3863 ,  F02D2200/0602

摘要： A controller for a pressure reducing valve is applied to a fuel injection system which is provided with a pressure reducing valve in a common-rail and a fuel pressure sensor detecting a fuel pressure in a fuel supply passage from the accumulator to an injection port of the fuel injector. The controller includes a fuel-pressure-variation detector for detecting a fuel pressure variation timing at which a detection value of the fuel pressure sensor is varied due to an opening operation or a closing operation of the pressure reducing valve. The controller further includes a response-delay-time computing portion for computing a response delay time of the pressure reducing valve based on a command timing and a fuel pressure variation timing.

摘要翻译： 用于减压阀的控制器被施加到在共轨中设置有减压阀的燃料喷射系统和检测来自蓄能器的燃料供给通道中的燃料压力到燃料压力传感器的喷射口的燃料压力传感器 喷油器。 控制器包括燃料压力变化检测器，用于检测由于减压阀的打开操作或关闭操作而使燃料压力传感器的检测值发生变化的燃料压力变化定时。 控制器还包括响应延迟时间计算部分，用于基于指令定时和燃料压力变化定时计算减压阀的响应延迟时间。

公开(公告)号：US20140004710A1

公开(公告)日：2014-01-02

申请号：US13980144

申请日：2012-01-16

申请人： Masakazu Sakata ,  Hidehiro Yanai

发明人： Masakazu Sakata ,  Hidehiro Yanai

IPC分类号： H01L21/02

CPC分类号： H01L21/02104 ,  H01L21/6719 ,  H01L21/67781 ,  H01L21/68742 ,  H01L21/6875

摘要： A substrate processing apparatus of the present invention includes a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face; a heating element arranged in the substrate placement stage and configured to heat the substrate; a plurality of struts configured to support the flange from below, and an exhaust unit configured to exhaust an atmosphere in the process chamber, wherein the supporting member is provided between the substrate placement stage and the plurality of struts.

摘要翻译： 本发明的基板处理装置包括：安装在处理室中的基板放置台，其构造为将基板设置在基板配置面上，在其侧面设置有凸缘; 加热元件，其布置在所述基板放置台中并且构造成加热所述基板; 多个支柱，其构造成从下方支撑凸缘;以及排气单元，其构造成排出处理室中的气氛，其中所述支撑构件设置在所述基板放置台和所述多个支柱之间。

公开(公告)号：US08444363B2

公开(公告)日：2013-05-21

申请号：US12619050

申请日：2009-11-16

申请人： Masakazu Sakata ,  Akira Takahashi ,  Hidehiro Yanai ,  Motonari Takebayashi ,  Shinya Tanaka

发明人： Masakazu Sakata ,  Akira Takahashi ,  Hidehiro Yanai ,  Motonari Takebayashi ,  Shinya Tanaka

IPC分类号： H01L21/677

CPC分类号： H01L21/67781 ,  H01L21/6719 ,  H01L21/67259 ,  H01L21/67745 ,  H01L21/67754 ,  H01L21/68707

摘要： Provided is a substrate processing apparatus configured to attain conflicting purposes of high throughput and footprint reduction. The substrate processing apparatus comprises a carrying chamber, and a loadlock chamber and at least two process chambers that are arranged around the carrying chamber. The carrying chamber comprises a substrate carrying unit configured to carry a substrate between the loadlock chamber and the process chambers. The substrate carrying unit comprises a first arm provided with a first finger and a second finger, and leading ends of the first and second fingers extend horizontally in the same direction. Each of the process chambers comprises a first process unit and a second process unit, and the second process unit is disposed at a side of the process chamber distant from the carrying chamber with the first process unit being disposed therebetween.

摘要翻译： 提供了一种被配置为实现高吞吐量和占地面积减小的冲突目的的基板处理装置。 基板处理装置包括承载室和负载锁定室以及布置在承载室周围的至少两个处理室。 承载室包括衬底承载单元，其构造成在负荷锁定室和处理室之间承载衬底。 基板承载单元包括设置有第一指状物和第二手指的第一臂，并且第一和第二指状物的前端沿相同方向水平延伸。 每个处理室包括第一处理单元和第二处理单元，并且第二处理单元设置在处理室远离输送室的一侧，其中第一处理单元设置在其间。

公开(公告)号：US20100068895A1

公开(公告)日：2010-03-18

申请号：US12585342

申请日：2009-09-11

申请人： Hidehiro Yanai ,  Masakazu Sakata ,  Akira Takahashi

发明人： Hidehiro Yanai ,  Masakazu Sakata ,  Akira Takahashi

IPC分类号： H01L21/285 ,  B05C13/00

CPC分类号： H01L21/67748 ,  H01L21/6719

摘要： A substrate processing apparatus includes a processing chamber that processes a substrate, and a substrate placing base enclosed in the processing chamber, and a substrate transporting member that allows the substrate to wait temporarily on the substrate placing base, and exhaust holes provided so as to surround the substrate placing base, and a retracting space that allows the substrate transporting member to move in between lines each connecting the exhaust hole and an upper end of the substrate placing base and the substrate placing base.

摘要翻译： 基板处理装置包括处理基板的处理室和封装在处理室中的基板放置基板以及允许基板在基板放置基板上暂时等待的基板输送部件，以及围绕设置的排气孔 基板放置基座以及使基板搬运部件在连接排气孔和基板载置台以及基板载置台的上端的配线之间移动的回缩空间。