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    METHODS AND APPARATUSES FOR SHIFTING CHROMATICITY OF LIGHT
    21.
    发明申请
    METHODS AND APPARATUSES FOR SHIFTING CHROMATICITY OF LIGHT 审中-公开
    改变光色度的方法和装置

    公开(公告)号：US20140014987A1

    公开(公告)日：2014-01-16

    申请号：US13545876

    申请日：2012-07-10

    申请人： Paul Panaccione ,  Arvind S. Baliga

    发明人： Paul Panaccione ,  Arvind S. Baliga

    IPC分类号： H01L33/50

    CPC分类号： H01L33/44

    摘要： The present disclosure relates to shifting a chromaticity of light generated from a light-emitting device. A light-emitting device may incorporate an optical element (e.g., filter) so that light emitted from a light-generating surface having an initial chromaticity may be altered. The optical element may shift the chromaticity of emitted light having the initial chromaticity to a final chromaticity that is different from the initial chromaticity. Thus, the chromaticity of emitted light from the manufactured LEDs that would otherwise be unacceptable for having chromaticity coordinates that fall outside of a desired chromaticity bin is shifted so as to have chromaticity coordinates that fall within suitable parameters. Accordingly, a number of the manufactured LEDs that would normally be discarded may be salvaged.

    摘要翻译： 本公开涉及移动从发光装置产生的光的色度。 发光装置可以并入光学元件（例如滤光片），使得可以改变从具有初始色度的发光表面发射的光。 光学元件可以将具有初始色度的发射光的色度偏移到与初始色度不同的最终色度。 因此，来自所制造的LED的发射光的色度将以不利于色度坐标落在期望的色度仓之外而被不可接受地偏移，以便具有落在合适的参数内的色度坐标。 因此，可以回收通常被丢弃的多个制造的LED。

    Packaging Method and System for LEDs
    22.
    发明申请
    Packaging Method and System for LEDs 有权
    LED的包装方法和系统

    公开(公告)号：US20130175551A1

    公开(公告)日：2013-07-11

    申请号：US13468227

    申请日：2012-05-10

    申请人： Michael Lim ,  Paul Panaccione ,  Aaron Breen ,  Michael Hadley

    发明人： Michael Lim ,  Paul Panaccione ,  Aaron Breen ,  Michael Hadley

    IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/62

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.

    摘要翻译： 一种细长的LED封装，其被配置为处理具有窄宽度的宽电流，LED芯片安装区域位于封装内的中心对称位置，安装孔与安装区域等距离设置，其中多个封装可以布置成具有交替的阳极和阴极端 可以产生高功率密度辐射通量线的方式。 一些实施例包括位于LED芯片安装区域的另一侧上的电流密度管理区域。

    CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICES
    25.
    发明申请
    CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICES 审中-公开
    CHIP-SCALE包装发光设备

    公开(公告)号：US20090218588A1

    公开(公告)日：2009-09-03

    申请号：US12327910

    申请日：2008-12-04

    申请人： Paul Panaccione ,  Charles W.C. Lin ,  Chia-Chung Wang ,  Cheng-Chung Chen

    发明人： Paul Panaccione ,  Charles W.C. Lin ,  Chia-Chung Wang ,  Cheng-Chung Chen

    IPC分类号： H01L33/00 ,  H01L21/50

    CPC分类号： H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Light-emitting devices, and related components, systems, and methods associated therewith are provided. A light-emitting device can comprise a light-emitting die comprising a light-generating region capable of generating light and an emission surface through which generated light is capable of being emitted, and a package layer at least partially disposed over at least a portion of the light-emitting die emission surface, wherein the package layer has an aperture through which light from the light-emitting die is capable of being emitted. The light-emitting device can be a chip-scale packaged device where the device area can be less than 3 times the light-emitting die emission surface area and/or the device thickness can be less than 2 times the light-emitting die thickness.

    摘要翻译： 提供了发光器件以及与之相关的组件，系统和方法。 发光装置可以包括发光管芯，其包括能够产生光的发光区域和能够发射产生的光的发射表面，以及至少部分地设置在至少一部分 发光管芯发射表面，其中封装层具有能够发射来自发光管芯的光的孔。 发光装置可以是芯片级封装器件，其中器件面积可以小于发光管芯发射表面积的3倍，和/或器件厚度可以小于发光管芯厚度的2倍。

    Low profile optoelectronic device package
    27.
    发明申请
    Low profile optoelectronic device package 审中-公开
    薄型光电器件封装

    公开(公告)号：US20110057216A1

    公开(公告)日：2011-03-10

    申请号：US12584779

    申请日：2009-09-10

    申请人： Ming-Kuen Chiu ,  Chin-Ta Fan ,  Chien-Cheng Wei ,  Paul Panaccione

    发明人： Ming-Kuen Chiu ,  Chin-Ta Fan ,  Chien-Cheng Wei ,  Paul Panaccione

    IPC分类号： H01L33/00 ,  H01L31/0232

    CPC分类号： H01L31/0203 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A low profile optoelectronic device package has a matalized transparent substrate, a chip and a dam ring. The matalized transparent substrate has a transparent board, a window area, and a metal pattern formed on a face of the transparent board and around the window area and having at least one outer contact pad and at least two contact pads. An active face of the chip is mounted to the at least two inner contact pads and aligned to the window area. A bottom face of the chip, that is opposite to the active face is further added a soldering layer. The dam ring is sealed a joint between the chip and the matalized transparent substrate so as to define an air cavity among the chip, the matalized transparent substrate and the dam ring. The matalized transparent substrate is used as a substrate and an optical cover of a conventional device package, so the optoelectronic device package provides low profile, small area outline, low fabricating cost and high lighting efficiency.

    摘要翻译： 薄型光电子器件封装具有成熟的透明衬底，芯片和坝环。 成熟的透明基板具有透明板，窗口区域和形成在透明板的表面上并且在窗口区域周围的金属图案，并且具有至少一个外部接触垫和至少两个接触垫。 芯片的主动面被安装到至少两个内部接触垫并与窗口区域对准。 芯片的与有源面相反的底面进一步添加了焊接层。 该密封环密封在芯片和金属化的透明基板之间的接头，以便在芯片，成熟的透明基板和坝环之间形成空气腔。 成熟的透明基板用作传统器件封装的基板和光学盖，因此光电子器件封装提供低轮廓，小面积轮廓，低制造成本和高照明效率。