摘要:
The invention relates to the soybean variety designated 4858197. Provided by the invention are the seeds, plants and derivatives of the soybean variety 4858197. Also provided by the invention are tissue cultures of the soybean variety 4858197 and the plants regenerated therefrom. Still further provided by the invention are methods for producing soybean plants by crossing the soybean variety 4858197 with itself or another soybean variety and plants produced by such methods.
摘要:
The invention relates to the soybean variety designated 4778469. Provided by the invention are the seeds, plants and derivatives of the soybean variety 4778469. Also provided by the invention are tissue cultures of the soybean variety 4778469 and the plants regenerated therefrom. Still further provided by the invention are methods for producing soybean plants by crossing the soybean variety 4778469 with itself or another soybean variety and plants produced by such methods.
摘要:
The invention relates to the soybean variety designated 4353363. Provided by the invention are the seeds, plants and derivatives of the soybean variety 4353363. Also provided by the invention are tissue cultures of the soybean variety 4353363 and the plants regenerated therefrom. Still further provided by the invention are methods for producing soybean plants by crossing the soybean variety 4353363 with itself or another soybean variety and plants produced by such methods.
摘要:
The present invention provides compositions and methods for the detection and characterization of mutations associated with cystic fibrosis. More particularly, the present invention provides compositions, methods and kits for using invasive cleavage structure assays (e.g. the INVADER assay) to screen nucleic acid samples, e.g., from patients, for the presence of any one of a collection of mutations in the CFTR gene associated with cystic fibrosis. The present invention also provides compositions, methods and kits for screening sets of CFTR alleles in a single reaction container.
摘要:
An electro-optical apparatus constructed according to various inventive principles disclosed herein provides flexibility in the type and arrangement of components. The electro-optical apparatus preferably includes a Printed Circuit Board (PCB). An interface device can be electrically connected to the PCB, and an electro-optical device can be electrically connected to the interface device. A lens is preferably arranged in optical communication with the electro-optical device. Numerous variations in component selection and arrangement are contemplated within the scope of these inventive principles. Various methods for configuring an electro-optical apparatus are also provided.
摘要:
The invention relates to the soybean variety designated 4587513. Provided by the invention are the seeds, plants and derivatives of the soybean variety 4587513. Also provided by the invention are tissue cultures of the soybean variety 4587513 and the plants regenerated therefrom. Still further provided by the invention are methods for producing soybean plants by crossing the soybean variety 4587513 with itself or another soybean variety and plants produced by such methods.
摘要:
A method and apparatus for avoiding dicing chip-outs in integrated circuit die comprises: (a) providing a wafer for forming a plurality of integrated circuit die thereon; (b) forming the plurality of integrated circuit die on the wafer; and (c) forming a saw street between the integrated circuit die on the wafer to relieve cutting stress in the wafer when the integrated circuit die are separated by a dicing saw.
摘要:
The instant invention relates to the soybean variety designated 0037393. Provided by the invention are the seeds, plants and derivatives of the soybean variety 0037393. Also provided by the invention are tissue cultures of the soybean variety 0037393 and the plants regenerated therefrom. Still further provided by the invention are methods for producing soybean plants by crossing the soybean variety 0037393 with itself or another soybean variety and plants produced by such methods.
摘要:
An integrated circuit package and method exploit the volume enclosed by the package substrate vias. In one embodiment, an integrated circuit package includes a first substrate having electrically conductive layers formed on substantially parallel surfaces of the first substrate, a second substrate having electrically conductive layers formed on substantially parallel surfaces of the second substrate, a substrate via formed through the first substrate and the second substrate to form an electrical connection between at least two electrically conductive layers of the first substrate and between at least two electrically conductive layers of the second substrate, an electrical component having a first end and a second end inserted into the substrate via so that the first end extends at least partially inside the first substrate and the second end extends at least partially inside the second substrate, and an electrically insulating layer formed between the first substrate and the second substrate.
摘要:
The quality and reliability of electro-optical modules can be improved, for instance, through improved testing and burn-in of an electro-optical sub-assembly. Reliability can also be enhanced through better methods of constructing an electro-optical module. By arranging both an electrical interface and an optical interface on a sub-assembly, for instance, testing can be performed on both interfaces in a single testing process. Burning-in an electro-optical sub-assembly can also improve the reliability of the module by identifying defects. A method of forming an electro-optical module can provide improved reliability by testing and/or burning-in an electro-optical sub-assembly before assembling the module.