公开(公告)号：US11495873B2

公开(公告)日：2022-11-08

申请号：US16810621

申请日：2020-03-05

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Rajneesh Kumar ,  Suhyung Hwang ,  Jaehyun Yeon ,  Mohammad Ali Tassoudji ,  Darryl Sheldon Jessie ,  Ameya Galinde

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/36 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US11258165B2

公开(公告)日：2022-02-22

申请号：US16236726

申请日：2018-12-31

Applicant: QUALCOMM Incorporated

Inventor： Hong Bok We ,  Chin-Kwan Kim ,  Jaehyun Yeon ,  Suhyung Hwang

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q9/12 ,  H01Q1/08 ,  H01Q5/364

Abstract: Certain aspects of the present disclosure provide an asymmetric antenna structure. An example antenna device generally includes a first antenna element, a second antenna element, and a flexible coupling element asymmetrically positioned between surfaces of the first and second antenna elements and electrically coupling the first antenna element to the second antenna element.

公开(公告)号：US11139224B2

公开(公告)日：2021-10-05

申请号：US16704789

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi Zhang ,  Rajneesh Kumar ,  Li-Sheng Weng ,  Darryl Sheldon Jessie ,  Suhyung Hwang ,  Jeahyeong Han ,  Xiaoming Chen ,  Jaehyun Yeon

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L21/67 ,  H01L23/31

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

公开(公告)号：US20210028539A1

公开(公告)日：2021-01-28

申请号：US16520140

申请日：2019-07-23

Applicant: QUALCOMM Incorporated

Inventor： Hong Bok WE ,  Jaehyun Yeon ,  Suhyung Hwang ,  Darryl Sheldon Jessie

IPC: H01Q3/08 ,  H01Q3/01 ,  H01Q1/08

Abstract: Methods and apparatuses for enhancing antenna modules with flexible portion are presented. An apparatus includes an antenna module having a first portion, a first antenna on the first portion, a second portion, a second antenna on the second portion, and a flexible portion physically connecting the first portion and the second portion. The flexible portion is arrangeable such that the first antenna and the second antenna are oriented to receive radio frequency signals from different directions or to transmit the radio frequency signals to different directions. At least one radio frequency integrated circuit is on the first portion. The first antenna and the second antenna, via the flexible portion, share the radio frequency integrated circuit for radio frequency signal transmission or reception.