公开(公告)号：US20230309258A1

公开(公告)日：2023-09-28

申请号：US17701333

申请日：2022-03-22

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Ching-Yi SHIH ,  Po-Cheng SHEN

IPC: H05K7/20 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K7/20181 ,  H05K7/20154 ,  H05K5/0256 ,  H05K5/03 ,  H05K7/20145 ,  F04D29/703

Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.

公开(公告)号：US20220346273A1

公开(公告)日：2022-10-27

申请号：US17242035

申请日：2021-04-27

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/06

Abstract: A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.

公开(公告)号：US20220225541A1

公开(公告)日：2022-07-14

申请号：US17149151

申请日：2021-01-14

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: H05K7/20

Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.

公开(公告)号：US20210365087A1

公开(公告)日：2021-11-25

申请号：US16878026

申请日：2020-05-19

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Hsin-Yu LIN

IPC: G06F1/20

Abstract: Cooling devices, such as fans, installed in a computing device can be automatically identified by reading an encoded signal from the cooling device's tachometer signal line. A cooling device can temporarily output an encoded signal in response to a trigger event, such as a power on event (e.g., powering-on of the cooling device). A controller, such as a baseboard management controller (BMC), can receive the encoded signal and decode the signal to determine identification information about the cooling device, such as vendor information and/or model information. The identification information about the cooling device can be stored, logged, output, and/or used to customize the operation of the cooling device.

公开(公告)号：US20210173457A1

公开(公告)日：2021-06-10

申请号：US16707913

申请日：2019-12-09

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Jen-Mao CHEN ,  Chih-Wei YANG

IPC: G06F1/20 ,  G06F1/3225 ,  G06F1/3296 ,  G06F11/30

Abstract: An electronic device operating in standby mode is provided. The electronic device includes a power supply unit, a cooling device coupled to the power supply unit, at least one electronic component cooled by the cooling device, and a controller coupled to the cooling device. The controller is operable to periodically monitor power data and the temperature of the at least one electronic component in standby mode. The controller is also operable to regulate power supplied to the cooling device based on the monitored power data and the temperature of the at least one electronic component.

公开(公告)号：US20210172448A1

公开(公告)日：2021-06-10

申请号：US16706428

申请日：2019-12-06

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Jen-Mao Chen

IPC: F04D27/00 ,  F04D29/58

Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.

公开(公告)号：US20190297748A1

公开(公告)日：2019-09-26

申请号：US15926068

申请日：2018-03-20

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yi-Ta HSU

IPC: H05K7/20

Abstract: A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.

公开(公告)号：US20190239385A1

公开(公告)日：2019-08-01

申请号：US16039808

申请日：2018-07-19

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Yueh-Chang WU ,  Ming-Chin HUANG

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/32

CPC classification number: H05K7/20209 ,  G06F1/206 ,  G06F1/3221 ,  G06F1/325 ,  G06F1/3287 ,  H05K7/20136 ,  H05K7/20727 ,  H05K7/20836

Abstract: A system and method to control fan power for an electronic device based on cooling requirements is disclosed. The electronic device includes a power supply unit and a fan coupled to the power supply unit. A controller is coupled to the fan. The device includes at least one electronic component cooled by the fan. The controller is operable to classify the at least one electronic component, and regulate the power supplied to the fan based on the classification of the at least one electronic component.

公开(公告)号：US20190116690A1

公开(公告)日：2019-04-18

申请号：US15730948

申请日：2017-10-12

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Jen-Mao CHEN ,  Kai-Fan KU

IPC: H05K7/20 ,  G06F1/20 ,  G06F11/22 ,  G06F11/30

Abstract: The present disclosure provides a system and method for dynamically adjusting maximum fan duties in a server system. In accordance with one aspect of the present disclosure, a computer-implemented method for dynamically adjusting maximum fan duties in the server system, comprises: powering on the server system; receiving, from BIOS, bus interface information of a system board of the server system; determining that there is no rotation-vibration issues (RVI) sensitive device directly connected to the system board; and setting a first maximum fan duty for one or more cooling fans of the server system.