公开(公告)号：US11223133B2

公开(公告)日：2022-01-11

申请号：US16802798

申请日：2020-02-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong Kim ,  Chin Mo Kim ,  Ji Hyung Jung ,  Sung Nam Cho ,  Sung Yong An

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q1/48

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

公开(公告)号：US11223100B2

公开(公告)日：2022-01-11

申请号：US16732762

申请日：2020-01-02

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong Kim ,  Sung Nam Cho ,  Sung Yong An ,  Ji Hyung Jung ,  Chin Mo Kim

IPC: H01Q21/06 ,  H01Q1/22 ,  H01Q9/40 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q1/38

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

公开(公告)号：US10903013B2

公开(公告)日：2021-01-26

申请号：US16782586

申请日：2020-02-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Jin Woo Kim ,  Min Gi Sin ,  Byung Hyun Park ,  Chin Mo Kim

IPC: H01G4/30 ,  H01L21/02 ,  H01G4/12 ,  C01G23/00 ,  H01L49/02 ,  H01L23/29 ,  H01G4/10 ,  C01F11/02 ,  C01G23/047

Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.

公开(公告)号：US10580575B2

公开(公告)日：2020-03-03

申请号：US16267534

申请日：2019-02-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Kim ,  Jong Ho Lee ,  Min Gi Sin ,  Hak Kwan Kim ,  Chin Mo Kim ,  Chi Hwa Lee ,  Hong Seok Kim ,  Woo Sup Kim ,  Chang Hwa Park

IPC: C04B35/468 ,  C04B35/628 ,  H01G4/10 ,  H01G4/12 ,  H01G4/33 ,  C01G23/00 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US09966179B2

公开(公告)日：2018-05-08

申请号：US15099921

申请日：2016-04-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chin Mo Kim ,  Jung Wook Seo ,  Eun Hye Na ,  Hak Kwan Kim ,  Hyung Jin Jeon ,  Sung Yong An

IPC: H01F27/255 ,  H01F17/00 ,  H01F1/34

CPC classification number: H01F27/255 ,  H01F1/348 ,  H01F17/0013 ,  H01F2017/0093

Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.