中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

49 records (took 0.02 seconds)

    Composite electronic component
    21.
    发明授权
    Composite electronic component 有权

    公开(公告)号：US10242794B2

    公开(公告)日：2019-03-26

    申请号：US15274550

    申请日：2016-09-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon Kim

    IPC: H01F27/29 ,  H01F27/40 ,  H01G4/248 ,  H01C7/00 ,  H01C1/148 ,  H01F17/00 ,  H01G4/30 ,  H01C1/06 ,  H01C7/18 ,  H01G2/14

    Abstract: A composite electronic component includes a body having first and second external electrodes disposed on outer surfaces thereof and including a dielectric body; first and second electrodes disposed in the dielectric body and electrically connected to the first and second external electrodes, respectively; a third electrode disposed on the body and electrically connected to the first external electrode; an electrostatic discharge (ESD) layer disposed on the third electrode; and a fourth electrode disposed on the ESD discharge layer and electrically connected to the second external electrode.

    Composite electronic component and board having the same
    23.
    发明授权
    Composite electronic component and board having the same 有权
    复合电子部件和板具有相同的功能

    公开(公告)号：US09532443B2

    公开(公告)日：2016-12-27

    申请号：US14674765

    申请日：2015-03-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan Son ,  Myeong Gi Kim ,  Min Kyoung Cheon ,  Yu Jin Choi ,  Ho Yoon Kim ,  So Yeon Song

    IPC: H01G4/40 ,  H05K1/02 ,  H01F27/29 ,  H01F27/28 ,  H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12

    CPC classification number: H05K1/023 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0026 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H05K1/181

    Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

    Abstract translation: 复合电子部件包括电容器和电感器彼此耦合的复合体，所述电容器包括：陶瓷体，其包括多个电介质层和第一和第二内部电极，所述电感器包括具有线圈的磁性体 部分。 输入端子设置在复合体的第一侧表面上并连接到线圈部分。 输出端子包括设置在复合体的第一侧表面上并连接到线圈部分的第一输出端子和设置在复合体的第一端面上并连接到第一内部电极的第二输出端子。 接地端子设置在复合体的第二端面上并连接到第二内部电极。 电容器耦合到电感器的侧表面。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    25.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权

    公开(公告)号：US20220189695A1

    公开(公告)日：2022-06-16

    申请号：US17337939

    申请日：2021-06-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon Kim ,  Man Su Byun

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H05K1/18 ,  H05K1/11

    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes; first and second external electrodes; and an insulator disposed on a first surface of the capacitor body. The capacitor body includes an active region in which first and second internal electrodes overlap each other in a first direction, and upper and lower covers disposed above and below the active region in the first direction. A length of the active region in the second direction is defined as ‘La’, a length of one margin of the capacitor body in the second direction is defined as ‘Lm’, a height of the active region in the first direction is defined as ‘Ta’, a thickness of the lower cover of the capacitor body is defined as ‘Tc’, and a thickness of the insulator is defined as ‘Te’. A relative displacement index, ((La/Lm)−(Ta/Tc))/Te)2, ranges from 0.003 to 0.055.

    Electronic component
    26.
    发明授权
    Electronic component 有权

    公开(公告)号：US10916376B2

    公开(公告)日：2021-02-09

    申请号：US16200402

    申请日：2018-11-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Man Su Byun ,  Ho Yoon Kim ,  Sang Soo Park ,  Woo Chul Shin

    IPC: H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01L49/02

    Abstract: An electronic component includes a multilayer capacitor including a capacitor body and an external electrode disposed at an end of the capacitor body, and an interposer including an interposer body and an external terminal disposed at an end of the interposer body. The external terminal includes a bonding portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a connection portion disposed on an end surface of the interposer body to connect the bonding portion and the mounting portion and having an uneven surface, and a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminals, and an adhesive extends to a portion of the uneven surface.

    Multilayer electronic component and board having the same mounted thereon
    27.
    发明授权
    Multilayer electronic component and board having the same mounted thereon 有权

    公开(公告)号：US10910163B2

    公开(公告)日：2021-02-02

    申请号：US16365088

    申请日：2019-03-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dae Heon Jeong ,  Kyung Hwa Yu ,  Man Su Byun ,  Min Kyoung Cheon ,  Soo Hwan Son ,  Ho Yoon Kim

    IPC: H01G4/228 ,  H01G4/30 ,  H01G4/12 ,  H01G2/06 ,  H01G4/008

    Abstract: A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.

    Electronic component
    28.
    发明授权
    Electronic component 有权

    公开(公告)号：US10910155B2

    公开(公告)日：2021-02-02

    申请号：US16202058

    申请日：2018-11-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Won Chul Sim ,  Ho Yoon Kim ,  Sang Soo Park ,  Woo Chul Shin

    IPC: H01G2/06 ,  H01G4/232 ,  H01G4/018 ,  H01G4/30 ,  H05K3/30 ,  H05K1/18 ,  H01G4/012

    Abstract: An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.

Patent Agency Ranking